• Journal of the Korean Magnetics Society
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• v.6 no.5
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• pp.323-328
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• 1996

NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$) trilayers were formed on the $4^{\circ}$ tilt-cut Si(111) substrate by rf magnetron sputtering method. With a Cu($50\;{\AA}$) underlayer, NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$) trilayers developed in-plane magnebc anisotropy and in-plane perpendicular alignment of easy axes in two magnetic components of NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$) trilayers has been found. The easy axis of Co layer consisbng of NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$) trilayers turned out to be along $4^{\circ}$ tilt Si <112> direcbon and that of NiFe layer along Si <110> direction. [NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$)]/Cu($50\;{\AA}$)/Si(111, $4^{\circ}$ tiIt-cut) trilayers showed about 2.2 % MR ratio at room temperature and large plateau in MR curves, which are more improved MR characteristics than those in [NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$)]/Cu($50\;{\AA}$)/glass trilayers with no appreciable magnetic anisotropy.

• Journal of the Korean Vacuum Society
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• v.9 no.3
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• pp.267-272
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• 2000

Electroplating Cu was deposited on Si(100) wafer after seed Cu was deposited by sputtering first. TaN was deposited as a diffusion barrier before depositing the seed Cu. Electroplating Cu thin films show highly (111)-oriented microstructure for both before and after annealing at $450^{\circ}C$ for 30min and no copper silicide was detected in the same samples, which indicates that TaN barrier layer blocks well the Cu diffusion into silicon substrate. After annealing the electroplating Cu film up to $450^{\circ}C$, the Cu film became columnar from non-columnar, its grain size became larger about two times, and also defects density of stacking faults, twins and dislocations decreased greatly. Thus the heat treatment will improve significantly electromigration property caused by the grain boundary in the Cu thin films.

• Proceedings of the Korea Crystallographic Association Conference
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• 2003.05a
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• pp.23-23
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• 2003

Cu 단결정과 다결정 Cu 막대(rod)를 시료로 하여 구부린 완전결정(bent perfect crystal, BPC)을 이용한 중성자 단색기의 특성을 평가함으로써 단결정 회절 및 집합조직 측정장치인 4축 단결정 회절장치(FCD)에 BPC 단색기를 적용할 수 있는지 시험하였다. 측정은 한국원자력연구소의 연구용 원자로인 하나로의 571 수평공에 구성된 test station에서 수행하였다. 단색기와 시료 사이의 거리는 3000mm, 시료와 검출기 사이는 600mm, 단색화빔 인출각도(2θ/sub M/)는 44.6°로 고정하여 FCD와 거의 같은 배치를 구현하였다 직사빔의 단면분포와 강도는 저효율 2차원 위치민감형 검출기(2-D PSD)를 이용하여 확인하였다. 이 검출기는 검출면적 90x90㎟, 공간 분해능 1.2mm, 검출효율 약 1%인 저효율 검출기이다. 회절빔은 검출면적 190x190㎟, 검출효율은 1Å에서 60%인 고효율 2-D PSD를 이용하여 측정하였다. Cu 단결정 측정에 사용한 ePC 단색화 결정은 200×40×3.4㎣ 크기의 Si(220) 슬랩이며, 비대칭 기하로 Si(331)면을 사용하여 파장 λ=0.954Å으로 중성자빔을 단색화시켰다. BPC-Si를 구부려 슬랩의 곡률반경을 변화시키면서 단색기-시료-검출기가 평행배치일 때 Cu(200), (220), (400), (420)면의 rocking curve를 측정하여 각 조건에서의 분해능과 강도를 평가하였다. BPC 단색기를 집합조직 측정에 적용할 수 있는지 시험하기 위하여 다결정 Cu 막대(직경 4.5mm, 길이 18mm)를 시료로 선택하였다. 207x30x3.0㎣ 크기의 Si 슬랩을 단색화 결정으로 사용하였다. 이 슬랩은 다양한 결정면을 이용한 특별한 기하를 구현할 수 있도록 Si(111)면에서 10° 벗어난 면을 절단한 것이다. 비대칭 기하로 Si(311)면을 사용하여 파장 λ=1.253Å의 단색화된 중성자빔으로 측정하였다 BPC-Si를 구부려 슬랩의 곡률반경을 변화시키면서 단색기-시료-검출기가 평행파 반평행배치일 때 Cu(111), (200), (220), (311), (331), (420)면의 회절선을 측정하여 각 조건에서 분해능과 강도를 평가하였다.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.3
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• pp.59-65
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• 1999

In this paper, we had studied the possibility of application as Cu thin films from (hfac)Cu(VTMOS) which is very stable. Cu thin films had been studied as a function of deposition temperature. Substrates used in the experiment were PVD TiN on Si wafer. Deposition conditions were as follow : deposition temperature $50^{\circ}C$. Cu thin films were analyzed by AES, four point probe, XRD and SEM. All of deposited films were very pure and some favoring of <111> planes perpendicular to the substrate surface were observed. Cu thin films had two distinct growth rates at various deposition temperature. One is the surface reaction limited region below $200^{\circ}C$, and the other is the mass transport limited region above $200^{\circ}C$. The resistivity of deposited Cu thin films under the optimum deposition condition is $2.5mu\Omega.cm$ Thus, properties of deposited Cu thin films using (hfac)Cu(VTMOS) didn't show difference with Cu thin films from other precursors.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.5
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• pp.486-492
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• 1999

The purpose of this research was to find out what is the dominant factor determining the $H_{ex}$ and the $H_C$ of Mn-Ir/Ni-Fe multilayers with different buffer layers. Regardless of (111) texture of Mn-Ir layer, all samples showed over the $H_{ex}$ of 155 Oe. We found out the $H_{ex}$ and the $H_C$ of Mn-Ir/Ni-Fe multilayers depend on interface morphology and grain size of Mn-Ir layer at the interface between Mn-Ir and Ni-Fe layers. The dependence of magnetroesistance ratio and coupling field on the thickness of ferromagnetic layer, thickness of Cu layer and different buffer layers have been studied. Maximum magnetoresistance ratio appeared for the sample Ta(5 nm)/Mn-Ir(10 nm)/Ni-Fe(7.5 nm)/Cu(2 nm)/Ni-Fe(6 nm)/Ta(5 nm)/Si. Magnetoresistance ratio may be related to grain of ferromagnetic layer. Coupling field may be related to the roughness and the grain size of ferromagnetic layer in the spin-valve multilayers.

• Korean Journal of Materials Research
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• v.5 no.2
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• pp.169-177
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• 1995

The diffusion barrier property of 100-nm-thick titanium nitride (TiN) film between Cu and Si was investigated using sheet resistance measurements, etch-pit observation, x-ray diffractometry, Auger electron spectroscopy, and transmission electron microscopy. The TiN barrier fails due to the formation of crystalline defects (dislocations) and precipitates (presumably Cu-silicides) in the Si substrate which result from the predominant in-diffusion of Cu through the TiN layer. In contrast with the case of Al, it is identified that the TiN barrier fails only the in-diffusion of Cu because there is no indication of Si pits in the Si substrate. In addition, it appears that the stuffing of TiN does not improve the diffusion barrier property in the Cu/TiN/Si structure. This indicates that in the case of Al, the chemical effect that impedes the diffusion of Al by the reaction of Al with $TiO_{2}$ which is present in the grain boundaries of TIN is very improtant. On the while, in the case of Cu, there is no chemical effect because Cu oxides, such as $Cu_{2}O$ or CuO, is thermodynamically unstable in comparison with $TiO_{2}$. For this reason, it is considered that the effect of stuffing of TiN on the diffusion barrier property is not significant in the Cu/ TiN/Si structure.

• Journal of the Korean Vacuum Society
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• v.6 no.1
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• pp.28-35
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• 1997

Effects of rapid thermal annealing on the characteristics of Cu films deposited from the (hfac)Cu(VTMS) precursor and on the barrier properties of TiN layers were studied. By the post-annealing, the electrical characteristics of Cu/TiN and the microstructures of Cu films were significantly changed. The properties of Cu films were more sensitive to the annealing temperature than the annealing time. Sheet resistance started to increase above $400^{\circ}C$, and the interreaction between Cu and Ti and the oxidation of Cu layer were observed above $600^{\circ}C$. The grain growth of Cu with the (111) preferred orientation was found to be most pronounced at $500^{\circ}C$. It revealed that the optimum annealing conditions for MOCVD-Cu/PVD-TiN structures to enhance the electrical characteristics without degradation of TiN barriers were in the range of $400^{\circ}C$.

• Journal of the Korean Ceramic Society
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• v.32 no.3
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• pp.313-320
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• 1995

We investigated the preferred orientation, electrical and magnetic properties of the Mn-Zn ferrite thin films deposited on SiO2/Si(100) by ion beam sputtering. The Cu-added Mn-Zn ferrite thin films had a preferred orientation of (111) with a weak orientation, (311). While the Zn-added one had a strong (111) preferred orientation. The saturation magnetization of the Cu- or Zn-doped Mn-Zn ferrite films increased with increasing substrate temperature (Ts) due to the increase of grain size and the enhancement of crystallinity. For the same reason the coercivity of Cu- or Zn-doped Mn-Zn ferrite films deposited at low Ts increased with increasing Ts, but those of the films deposited at high Ts slightly decreased not only because the defect density of the films decreases but because more grains have multi-domains with increasing Ts. The resistivity of Cu- or Zn-added Mn-Zn ferrite thin fims measured by complex impedance method decreased with increasing Ts due to the ehhancement of crystallinity as well as due to the increase of grain size.

• Korean Journal of Materials Research
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• v.6 no.7
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• pp.723-732
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• 1996

Cu films were deposited by chemical wapor deposition on the as-received substrates (TiN/Si) and three kinds of Cu-seeded substrates (Cu/TiN/Si) which had seeding layer in the thick ness of 5 ${\AA}$ and 130 ${\AA}$ coated by ICB(Ionized Cluster Beam) method. The effect of Cu seeding layers on the growth rate, crystallinity, grain size uniformity and film adhesion strength of final CVD-Cu films was investigated by scanning eletron microscopy(SEM), X-ray diffractometry and scratch test. The growth rate was found to incresase somewhat in the case of ICB-seeding. The XRD patterns of the Cu films on the as-received substrate and ICB Cu-seeded substrates exhibited the diffraction peaks corresponding to FCC phase, but the peak intensity ratio($I_{111}/I_{200}$) of Cu films deposited on the ICB Cu-seeded substrates increased compared with that of Cu films on the as-received substrate. The resistivity of final Cu film on 40 ${\AA}$ seeded substrate was observed as the lowest value, 2.42 $\mu\Omega\cdot$cm compared with other Cu films. In adhesion test, as the seeding thickness increased from zero to 130 ${\AA}$, the adhesion strength increased from 21N to 27N.

• Journal of Korea Foundry Society
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• v.38 no.6
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• pp.111-120
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• 2018

In this study, the effects of two different casting methods (gravity casting and, diecasting) and various solid-solution conditions on the mechanical properties of ASC (Al-10.5wt%Si-1.75wt%Cu) and ALDC12 (Al-10.3wt%Si-1.72wt%Cu-0.76wt%Fe-0.28wt% Mn-0.32wt%Mg-0.9wt%Zn) alloys were investigated. A thermodynamic solidification analysis program (PANDAT) was used to predict the liquidus, solidus, and phases of the used alloys. In the results of an XRD analysis, ${\beta}$-AlFeSi peaks were observed only in the ALDC12 alloy regardless of the casting method or SST (solid-solution treatment) conditions. However, according to the results of a FE-SEM observation, both ${\theta}(Al_2Cu)$ and ${\beta}$-AlFeSi were found to exist besides ${\alpha}$-Al and eutectic Si in the gravity-casted ASC alloy at $500^{\circ}C$ after a SST of 120min. The ${\alpha}$-AlFeSi and ${\beta}$-AlFeSi phases including the eutectic phases were also found to exist in the ALDC12 alloy. The results of a microstructural observation and analyses by XRD, FE-SEM and EDS were in good agreement with the PANDAT results. The gravity-casted ALDC12 and ASC specimens showed the highest Y.S. and UTS values after aging for three hours at $180^{\circ}C$ after a SST at $500^{\circ}C$ for 30min. At longer solid-solution treatment times at $500^{\circ}C$ in the gravity-casted ALDC12 and ASC specimens, the elongations of the ASC alloys increased, whereas they decreased slightly in the ALDC12 alloys.