• Journal of Korean Society of Environmental Engineers
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• v.22 no.3
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• pp.511-521
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• 2000

Investigation was carried out lean burn de-NOx properties of Pt-$TiO_2$ bifunctional catalyst by propylene in order to get the high de-NOx activity and the wide temperature window under coexistence of $SO_2$ and $H_2O$. Only noncatalyst and carrier catalyst themselves had NOx conversion activity at high temperature over $400^{\circ}C$. NOx conversion activity of catalysts exchanged copper ion resulted in Cu-$TiO_2$>Cu-ZSM-5>Cu-$Al_2O_3$>CU-YZ>Cu-AZ. Catalysts impregnated with platinum based on titania gave the results of high NOx conversion activity at low temperature. $250^{\circ}C$. Bifunctional catalysts based on Pt-$TiO_2$ showed high NOx conversion activity both at a low zone of $300^{\circ}C$ and a high zone of $500^{\circ}C$. Pt-$TiO_2$/$Al_2O_3$ catalyst gave the highest NOx conversion activity at a low temperature zone. and Pt-$TiO_2$/$Mn_2O_3$(21) catalyst gave the highest NOx conversion activity at a high temperature zone. Under the coexistence of $SO_2$ and $H_2O$. NOx conversion activities of 0.55wt%Pt-$TiO_2$/5wt%Cu-ZSM-5 catalyst was high both at a low and high temperature zone, and increased depending on oxygen concentration. 0.55wt%Pt-$TiO_2$/5wt%Cu-ZSM-5 catalyst showed the best correlation between de-NOx activities and the propyl ere conversion rates to CO on the log function.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.229-229
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• 2010

With the scaling down of ultra large integrated circuits (ULSI) to the sub-50 nm technology node, the need for an ultra-thin, continuous and conformal diffusion barrier and Cu seed layer is increasing. However, diffusion barrier and Cu seed layer formation with a physical vapor deposition (PVD) method has become difficult as the technology node is reduced to 30 nm and beyond. Recent work on self-forming barrier processes using PVD Cu alloys have attracted great attention due to the capability of conformal ultra-thin barrier formation using a simple technique. However, as in the case of the conventional barrier and Cu seed layer, PVD of the Cu alloy seed layer will eventually encounter the difficulty in conformal deposition in narrow line trenches and via holes. Atomic layer deposition (ALD) has been known for its good step coverage and precise thickness control, and is a candidate technique for the formation of a thin conformal barrier layer and Cu seed layer. Conformal Cu-Mn seed layers were deposited by plasma enhanced atomic layer deposition (PEALD) at low temperature ($120^{\circ}C$), and the Mn content in the Cu-Mn alloys were controlled form 0 to approximately 10 atomic percent with various Mn precursor feeding times. Resistivity of the Cu-Mn alloy films decreased by annealing due to out-diffusion of Mn atoms. Out-diffused Mn atoms were segregated to the surface of the film and interface between a Cu-Mn alloy and $SiO_2$, resulting in self-formed $MnO_x$ and $MnSi_xO_y$, respectively. No inter-diffusion was observed between Cu and $SiO_2$ after annealing at $500^{\circ}C$ for 12 h, indicating an excellent diffusion barrier property of the $MnSi_xO_y$. The adhesion between Cu and $SiO_2$ was enhanced by the formation of $MnSi_xO_y$. Continuous and conductive Cu-Mn seed layers were deposited with PEALD into 32 nm $SiO_2$ trench, enabling a low temperature process, and the trench was perfectly filled using electrochemical plating (ECD) under conventional conditions. Thus, it is the resultant self-forming barrier process with PEALD Cu-Mn alloy film as a seed layer for plating Cu that has further potential to meet the requirement of the smaller than 30 nm node.

• Journal of the Korean Geosynthetics Society
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• v.16 no.1
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• pp.73-83
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• 2017

Laboratory and in-situ tests were conducted to evaluate the cone factors for the layers with low plasticity containing a lot of silty and sand soils from the west coast (Incheon, Hwaseong and Gunsan areas) and its applicability was evaluated based on these results. The cone factors were evaluated from 19 to 23 based on unconfined compression strengths (qu), from 13 to 13.8 based on simple CU strengths and from 11.6 to 13.1 based on field vane strengths, respectively. The unconfined compression strengths of undisturbed silty soil samples with low plasticity were considerably underestimated due to the change of in-situ residual effective stress during sampling. Half of unconfined compression strength (qu/2) based cone factors of silty soils with low plasticity fluctuated and were approximately 1.8 times higher than simple CU based values of these soils. When evaluating cone factors of these soils, it should be judged overall on the physical properties such as the grain size distribution and soil plasticity and on the fluctuation of the corrected cone resistance and the sleeve friction due to the distribution of sandseam in the ground including pore pressure parameter.

• Journal of Electrochemical Science and Technology
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• v.9 no.3
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• pp.195-201
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• 2018

To enhance the performance of cathodes at low temperatures, a Cu-coated cathode is prepared, and its electrochemical performance is examined by testing its use in a single cell. At $620^{\circ}C$ and a current density of $150mAcm^{-2}$, a single cell containing the Cu-coated cathode has a significantly higher voltage (0.87 V) during the initial operation than does that with an uncoated cathode (0.79 V). According to EIS analysis, the high voltage of the cell with the Cu-coated cathode is due to the dramatic decrease in the high-frequency resistance related to electrochemical reactions. From XPS analysis, it is confirmed that the Cu is initially in the form of $Cu_2O$ and is converted into CuO after 150 h of operation, without any change in the state of the Ni or Li. Therefore, the high initial cell voltage is confirmed to be due to $Cu_2O$. Because $Cu_2O$ is catalytically active toward $O_2$ adsorption and dissociation, $Cu_2O$ on a NiO cathode enhances cell performance and reduces cathode polarization. However, the cell with the Cu-coated cathode does not maintain its high voltage because $Cu_2O$ is oxidized to CuO, which demonstrates similar catalytic activity toward $O_2$ as NiO.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.5
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• pp.337-343
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• 2020

This study investigated the low temperature sintering with various templates of Bi-based lead-free piezoelectric ceramics. The effects of using CuO-coated Na_0.5Bi_4.5Ti₄O₁₅ templates on the sintering behavior as well as the dielectric, ferroelectric, and piezoelectric properties of Bi_1/2(Na_0.78K_0.22)_1/2TiO₃ (BNKT) ceramics have been examined. In comparison with the specimens sintered with the Na_0.5Bi_4.5Ti₄O₁₅ templates without CuO coating, those sintered with the CuO-coated Na_0.5Bi_4.5Ti₄O₁₅ templates showed larger template sizes as well as a larger electric field induced strain (S_max/E_max) of 422 pm/V after sintering at temperatures as low as 975℃. These results are promising for low-cost multilayer ceramic actuator applications.

• Asian-Australasian Journal of Animal Sciences
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• v.8 no.3
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• pp.263-265
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• 1995

Blood plasma minerals and their effects towards the fertility in 136 cows randomly selected from 26 dairy farms in central Thailand were studied. An average of 8.60 mg% Ca, 5.97 mg% P, 2.45 mg% Mg, $85.9{\mu}g%$ Cu, and $160.9{\mu}g%$ Zn in plasma was observed. Compared to the critical deficient values, 24.3, 10.3, 11.8, 28.7 and 0.0% of the surveyed cows obtained the respective elements in plasma below the standard levels. No significant difference (p >.05) in plasma concentrations of Ca, P, Mg and Zn for the low fertile (conception rate > 3) and fertile (conception rate < 3) cows was found. However, plasma Cu of the low fertile cows (averaged $77.2{\mu}g%$) was lower (p <.01) than that of the fertile ones (averaged $91.12{\mu}g%$). Additionally, it is observed that 47.1% of the cows with the low fertility problem obtained plasma Cu below the 65.0 pg% critical deficient value.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.302-305
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• 2009

This paper examines the effect of nitride formation on formability for Cu bearing high strength extra low carbon (ELC) steel sheets. For this purpose, we have investigated the effect of addition of aluminium (Al) and boron (B) on texture and precipitation behavior of the ELC steel during continuous annealing. Mechanical properties and microstructures of the ELC steel sheets were analyzed as well using uni-axial tensile test, electron back-scattered diffraction (EBSD) technique and transmission electron microscopy (TEM) following pilot rolling and continuous annealing. It has been found that the addition of Al and B increases the precipitation of AlN and BN. What is more, the scavange of solute nitrogen is effective in increasing the formability of the ELC steels. In addition, the Al and B addition improves the aging property of the ELC steel.

• Journal of the Korean Ceramic Society
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• v.45 no.12
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• pp.755-759
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• 2008

New cathode materials $LaNi_{1-x}{Cu_x}{O_3}$ (typically $LaNi_{0.8}Cu_{0.2}O_3$) were synthesized using a co-precipitation method. The structure and morphology of the powders were characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM). The composite material [$Ce_{0.8}Sm_{0.2}O_{2-\ddot{a}}$(SDC) and carbonate (${Na_2}{CO_3},{Li_2}{CO_3}$)], NiO and $LaNi_{1-x}{Cu_x}{O_3}$ were used as the electrolyte, anode and cathode, respectively. The electrochemical performance of La-Ni-Cu-O perovskite oxide at low temperatures ($400{\sim}550^{\circ}C$) was studied. The results showed that $LaNi_{0.8}Cu_{0.2}O_3$ precursor powder prepared through a co-precipitation method and calcined at $860^{\circ}C$ for 2 h formed uniform grains with diameters in the range of $400{\sim}500\;nm$. The maximum power density and the short circuit current density of the single cell unit at $550^{\circ}C$ were found to be $390\;mW/cm^2$ and $968\;mA/cm^2$, respectively.

• Journal of Korea Foundry Society
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• v.34 no.3
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• pp.100-106
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• 2014

In recent years, Mg and its alloys have attracted a great deal of attention due to their low density, relatively excellent castability, and straightforward recyclability. Mg alloys have been widely applied to various industrial fields, and are representatively used in automotive and electronic parts. According to previous researches, the electrical conductivity of Mg alloys greatly decreases with increasing Al content. However, with the addition of Zn and/or Cu, the electrical conductivity of Mg alloys is maintained or slightly increased, and improved mechanical properties are obtained as well. On this basis, Mg-Zn-Cu alloys have been investigated in the present study with a focus on the effect of adding Zn and Cu on the electrical conductivity. The Zn and Cu contents ranged from 4 to 6wt.% and 0 to 1.5wt.%, respectively. Ternary Mg-Zn-Cu alloys have been prepared by gravity casting in a steel mold. In the as-casting condition, the electrical conductivity of Mg-Zn-Cu alloys showed a linear increasing trend with decreasing Zn and increasing Cu contents. Furthermore, impact values of Zn = -1.5 and Cu = 2.5 were determined for these alloys by electrical conductivity tests.

• Applied Science and Convergence Technology
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• v.23 no.6
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• pp.345-350
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• 2014

The surface oxidation mechanism of lead-free solder alloys has been investigated with multiple reflow using X-ray photoelectron spectroscopy. It was found that the solder surface of Sn-Ag-Cu-In solder alloy is surrounded by a thin $InO_x$ layer after reflow process; this coating protects the metallic surface from thermal oxidation. Based on this result, we have performed a wetting balance test at various temperatures. The Sn-Ag-Cu-In solder alloy shows characteristics of both thermal oxidation and wetting balance better than those of Sn-Ag-Cu solder alloy. Therefore, Sn-Ag-Cu-In solder alloy is a good candidate to solve the two problems of easy oxidation and low wettability, which are the most critical problems of Pb-free solders.