• Title/Summary/Keyword: Cu+ complex

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Geochemistry of Cu-Pb-Zn-Ag Deposits from the Euiseong Mineralized Area (의성 광화대 동-연-아연-은 광상의 지화학적 연구)

  • Chi, Se-Jung;Doh, Seong-Jae;Choi, Seon-Gyu;Lee, Jae-Ho
    • Economic and Environmental Geology
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    • v.22 no.3
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    • pp.253-266
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    • 1989
  • The Cu-Pb-Zn-Ag hydrothermal vein type deposits which comprise the Dongil and Dong-cheogogsan mines occur within the Cretaceous sedimentary rocks in the Euiseong Basin of the southern Korean peninsula. The ore mineralization is contained within three stage(I,II and III) quartz and calcite veins. Ore minerals occur as dominant chalcopyrite, galena, sphalerite, tetrahedrite and Pb, Ag, Sb and Bi-bearing sulfosalts. Stage I ore minerals were deposited between $400^{\circ}C$ and $200^{\circ}C$ from the fluid with moderate salinities(7.0 to 4.5 eq. wt. % NaCl). Evidence of boiling suggests pressure of less than 150 bars during stage I mineralization. This pressure corresponds to maximum depths of 650 m and 1700 m, respectively, assuming lithostatic and hydrostatic loads. The data on mineralogy, temperature and salinity, together with information on the solubility of Cu complex, suggest that Cu deposition is a result of boiling coupled with declining temperature from $350^{\circ}$ to $250^{\circ}C$ or declining log $a_{o_2}$(from -29.8 to -35.9 atm.)and increasing in pH. Pb, Ag, Sb and Bi-bearing sulfosalts were deposited by cooling and dilution at temperature of less than $250^{\circ}C$ from the ore fluid with less than -35.9 atm. of log $a_{o_2}$.

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Studies on the Cu (II), Ni (II) and Zn (II) Complexes with Tridentate Schiff Base Ligand (I) (세자리 Schiff Base 리간드의 Cu (II), Ni (II) 및 Zn (II) 착물에 관한 연구 (제1보))

  • Chjo Ki Hyung
    • Journal of the Korean Chemical Society
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    • v.18 no.3
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    • pp.189-193
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    • 1974
  • The tridentate schiff base, salicylidene imino-o-thiolbenzene, has been synthetized from salicylaldehyde and o-amino thiolbenzene by Duff reaction. The schiff base has been reacted with Cu(II), Ni(II), and Zn(II), to form new complexes; Cu(II)$[C_{13}H_9ONS]{\cdot}3H_2O$, Ni(II)$[C_{13}H_9ONS]{\cdot}3H_2O,\;Zn(II)[C_{13}H_9ONS]{\cdot}3H_2O$ It appears that the Cu(II)-complex has tetra-coordinated configuration with the schiff base and one molecule of water, while the Ni(II) and Zn(II)-complexes have hexacoordinated configuration with the schiff base and three molecules of water. The mole ratio of tridentate schiff base ligand to metals was 1:1. These complexes have been identified by infrared spectra, visible spectra, TGA, DTA and elemental analysis.

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Synthesis and Characterization of New Nickel (II) and Copper (II) Complexes of a Pentaaza Macrobicyclic Ligand (새로운 펜타아자 거대두고리 기간드의 니켈 (II) 및 구리 (II) 착화합물의 합성과 특성)

  • Kang Shin Geol;Jung Soo Kyung
    • Journal of the Korean Chemical Society
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    • v.33 no.5
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    • pp.510-515
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    • 1989
  • New nickel(II) and coppr(II) complexes of a saturated pentaaza macrobicyclic ligand $[Ni(D)]^{2+},\;[Cu(D)]^{2+},\;and\;[Cu(D)Cl]^+$, where D is 1,3,6,9,12-pentaazabicyclo[10,2,l]pentadecane, have been prepared by the template condensation reaction of tetraethylenepentamine and formaldehyde in the presence of the metal ion. The complexes contain one imidazolidine ring in the macrobicyclic ligand, D. The complexes $[Ni(D)]^{2+}\;and\;[Cu(D)]^{2+}$ have square planar geometry with 5-5-5-6 chelate ring sequence. The electronic spectra of $[Cu(D)Cl]^+$indicate that the complex has square pyramidal geometry. Synthesis, charactrization, and the spectroscopic and chemical properties of the macrobicyclic nickel(II) and copper(II) complexes are described.

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Planarization of Cu intereonnect using ECMP process (전기화학 기계적 연마를 이용한 Cu 배선의 평탄화)

  • Jeong, Suk-Hoon;Seo, Heon-Deok;Park, Boum-Young;Park, Jae-Hong;Lee, Ho-Jun;Oh, Ji-Heon;Jeong, Hae-Do
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.79-80
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    • 2007
  • Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing (CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical planarization/polishing (ECMP) or electro-chemical mechanical planarization was introduced to solve the. technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

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The Simultaneous Extraction and Determination of Trace Copper and Zinc in Solvent Extraction (용매추출법에 의한 토양중의 미량 구리와 아연원소의 동시추출 및 정량에 관한 연구)

  • 정창웅;지석주;박종안
    • Journal of Environmental Health Sciences
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    • v.21 no.3
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    • pp.87-95
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    • 1995
  • A rapid and selective co-extraction systems of copper and zinc-thiocyanate complex into various types of alkylamine for the simultaneous determination of two metal ions by atomic absorption spectrometry and ion chromatograph have been proposed. The quantitative extractions of Cu(II) and Zn(II) at 0.1 M-thiocyanate and 0.1 M-HCI were achieved with Aliquat 336-$CHCl_3$. The detection limits of Cu and Zn were 2 ppb and 0.9 ppb respectively.

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Synthesis and Characterization of Schiff Base Metal Complexes and Reactivity Studies with Malemide Epoxy Resin

  • Lakshmi, B.;Shivananda, K.N.;Prakash, Gouda Avaji;Isloor, Arun M.;Mahendra, K.N.
    • Bulletin of the Korean Chemical Society
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    • v.33 no.2
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    • pp.473-482
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    • 2012
  • A novel malemide epoxy containing Co(II), Ni(II) and Cu(II) ions have been synthesized by curing malemide epoxy resin (MIEB-13) and Co(II), Ni(II) and Cu(II) complexes of macrocyclic bis-hydrazone Schiff base. The Schiff base was synthesized by reacting 1,4-dicarbnyl phenyl dihydrazide with 2,6-diformyl-4-methyl phenol. The Schiff base and its Co(II), Ni(II) and Cu(II) complexes have been characterized by elemental analyses, spectral (IR, $^1H$ NMR, UV-vis., FAB mass, ESR), thermal and magnetic data. The curing reaction of maleimide epoxy compound with metal complexes was studied as curing agents. The stability of cured samples was studied by thermo-gravimetric analyses and which have excellent chemical (acid/alkali/solvent) and water absorption resistance. Further, the scanning electron microscopy (SEM) and definitional scanning colorimetric (DSC) techniques were confirmed the phase homogeneity of the cured systems.

Synthesis of Hexagonal Boron Nitride along a domain of Cu foil

  • Park, Jong-Hyun;Moon, Youngwoong;Park, Sijin;Kim, Hyojin;Hwang, Chanyong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.344.2-344.2
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    • 2016
  • Fully and partially grown hexagonal boron nitride (h-BN) on Cu foil, synthesized by chemical vapor deposition method, was studied using Raman and SEM measurements. Fully and partially grown samples were successfully made from borane-ammonia complex to controlling pressure and growth time. The fully grown h-BN and partially grown h-BN exhibits a ~ 1370 cm-1 B-N vibrational mode (E2g). Especially, well-aligned triangular h-BN monolayer was observed on some domain of Cu foil using SEM measurements.

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Immobile Artificial Metalloproteases

  • Kim, Myoung-Soon;Suh, Jung-Hun
    • Bulletin of the Korean Chemical Society
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    • v.26 no.12
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    • pp.1911-1920
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    • 2005
  • Effective artificial metalloproteases have been designed by using cross-linked polystyrene as the backbone. Artificial active sites comprising Cu(II) complexes as the catalytic site and other metal centers or organic functionalities as binding sites were synthesized. The activity of Cu(II) centers for peptide hydrolysis was greatly enhanced on attachment to polystyrene. By placing binding sites in proximity to the catalytic centers, the ability to hydrolyze a variety of protein substrates at selected cleavage sites was improved. Thus far, the most advanced immobile artificial proteases have been obtained by attaching the aldehyde group in proximity to the Cu(II) complex of cyclen.

High performance top-emitting OLEDs with copper iodide-doped hole injection layer

  • Lee, Jae-Hyun;Leem, Dong-Seok;Kim, Jang-Joo
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.492-495
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    • 2008
  • Efficient top-emitting organic light-emitting diodes were fabricated using copper iodide (CuI) doped NPB as a p-doped hole injection layer to improve hole injection from a silver bottom electrode. The enhanced hole injection is originated from the formation of the charge transfer complex between CuI and NPB. The devices result in high efficiency of 69 cd/A with almost Lambertian emission pattern.

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Transport of Metal Ions Through the Crosslinked Chitosan Membrane (가교 Chitosan막에 의한 금속 이온의 투과 특성)

  • Kim, Chong-Bae
    • Applied Chemistry for Engineering
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    • v.4 no.2
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    • pp.416-422
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    • 1993
  • In order to prepare high performance polymeric membrane, the crosslinked chitosan(C. Chitosan)membrane was prepared, the transport and the selective separation of the metal ions through the membrane were investigated. It was observed that the transport rates of the metal ions through the membrane increased according to the decreasing of the initial pH in downstream solution. Proton pump mechanism for this transport phenomenon was suggested. The transport selectivity is dependent on the selective adsorption resulting from the complex formation of chitosan with each metal ion. The separatin factor(${\alpha}_{Cu}{^{2+}}$) for the membrane was 9.5.

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