• Bulletin of the Korean Chemical Society
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• 제29권8호
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• pp.1561-1564
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• 2008

Although the use of Cu(II) salts as catalysts without reductants is limited in the cycloaddition of acetylenes with azides, the catalytic system employing average 10 nm CuO(II) nanoparticles in the absence of reductants shows good catalytic activity to form 1,4-disubstituted 1,2,3-triazoles even in wet THF as well as water. It is also noticeable that CuO(II) nanoparticle catalysts can be recycled with consistent activity. A range of alkynes and azides were subject to the optimized CuO(II) nanoparticle-catalyzed cycloaddition reaction conditions to afford the desired products in good yields.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.293.1-293.1
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• 2016

Various materials including conductive, dielectric, and semi-conductive materials, constitute suitable candidates for printed electronics. Metal nanoparticles (e.g. Ag, Cu, Ni, Au) are typically used in conductive ink. However, easily oxidized metals, such as Cu, must be processed at low temperatures and as such, photonic sintering has gained significant attention as a new low-temperature processing method. This method is based on the principle of selective heating of a strongly absorbent film, without light-source-induced damage to the transparent substrate. However, Cu nanoparticles used in inks are susceptible to the growth of a native copper-oxide layer on their surface. Copper-oxide-nanoparticle ink subjected to a reduction mechanism has therefore been introduced in an attempt to achieve long-term stability and reliability. In this work, a flash-light sintering process was used for the reduction of an inkjet-printed Cu(II)O thin film to a Cu film. Using a photographic lighting instrument, the intensity of the light (or intense pulse light) was controlled by the charged power (Ws). The resulting changes in the structure, as well as the optical and electrical properties of the light-irradiated Cu(II)O films, were investigated. A Cu thin film was obtained from Cu(II)O via photo-thermal reduction at 2500 Ws. More importantly, at one shot of 3000 Ws, a low sheet resistance value ($0.2527{\Omega}/sq.$) and a high resistivity (${\sim}5.05-6.32{\times}10^{-8}{\Omega}m$), which was ~3.0-3.8 times that of bulk Cu was achieved for the ~200-250-nm-thick film.

• Korean Chemical Engineering Research
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• 제46권6호
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• pp.1069-1074
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• 2008

구리 나노입자의 표면에 화학흡착한 octanethiol, decanethiol 및 dodecanethiol의 3D SAMs를 연구하였고, dodecanethiol의 투입량 변화에 따른 구리 나노입자의 산화 안정성을 고찰하였다. 제조 공정은 산소로부터 보호하기 위해 질소 분위기에서 수행하였고, 합성된 입자는 원심분리를 통하여 획득하였다. 구리 전구체는 Copper(II) nitrate, 환원제는 sodium borohydride를 사용하였으며, 반응은 단일상에서 진행하였다. 나노 크기의 구리입자는 TEM 분석을 통하여 확인하였고, 그 크기는 약 3~6 nm였다. FT-IR, XPS와 열중량분석(TGA) 결과 alkanethiol의 thiol기가 구리 표면에 화학흡착 한다는 것과 alkyl기의 사슬이 길수록 alkanethiol의 흡착양이 증가한다는 것을 확인하였고, XRD 패턴으로부터 구리 나노입자의 거대격자회절(superlattice diffraction)을 관측할 수 있었다. 그리고 dodecanethiol의 투입양이 구리의 투입양보다 적을 경우 구리는 $Cu_2O$의 형태로 산화되었으며, 구리보다 1.25배 많이 투입할 경우 더욱 조밀한 SAMs를 형성하였다.