• Title/Summary/Keyword: Cross-bonding

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Underground Transmission Cable Sheath Voltage Analysis Using EMTP (EMTP를 이용한 송전케이블 시스전압 분석)

  • Oh, Dong-Soo
    • Proceedings of the KIEE Conference
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    • 2000.07a
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    • pp.428-430
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    • 2000
  • This paper describes under-ground transmission cable sheath voltage by using EMTP and proposes a new design method for calculating cable sheath voltage in steady state. The cross bonding system of power cable is modeled on ${\pi}$ equivalent circuit and the sheath voltage(current) of cable can be analyzed with comparing to conventional method.

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High Speed Direct Bonding of Silicon Wafer Using Atmospheric Pressure Plasma (상압 플라즈마를 이용한 고속 실리콘 웨이퍼 직접접합 공정)

  • Cha, Yong-Won;Park, Sang-Su;Shin, Ho-Jun;Kim, Yong Taek;Lee, Jung Hoon;Suh, Il Woong;Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.3
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    • pp.31-38
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    • 2015
  • In order to achieve a high speed and high quality silicon wafer bonding, the room-temperature direct bonding using atmospheric pressure plasma and sprayed water vapor was developed. Effects of different plasma fabrication parameters, such as flow rate of $N_2$ gas, flow rate of CDA (clear dry air), gap between the plasma head and wafer surface, and plasma applied voltage, on plasma activation were investigated using the measurements of the contact angle. Influences of the annealing temperature and the annealing time on bonding strength were also investigated. The bonding strength of the bonded wafers was measured using a crack opening method. The optimized condition for the highest bonding strength was an annealing temperature of $400^{\circ}C$ and an annealing time of 2 hours. For the plasma activation conditions, the highest bonding strength was achieved at the plasma scan speed of 30 mm/sec and the number of plasma treatment of 4 times. After optimization of the plasma activation conditions and annealing conditions, the direct bonding of the silicon wafers was performed. The infrared transmission image and the cross sectional image of bonded interface indicated that there is no void and defects on the bonded wafers. The bonded wafer exhibited a bonding strength of average $2.3J/m^2$.

A Study on Performance Improvement of Glucose Sensor Adopting a Catalyst Using New Cross Liker (새로운 가교제를 적용한 촉매를 이용한 글루코스 센서의 성능향상 연구)

  • Chung, Yongjin;Kwon, Yongchai
    • Korean Chemical Engineering Research
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    • v.53 no.6
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    • pp.802-807
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    • 2015
  • In this study, we synthesized a new biocatalyst consisting of glucose oxidase (GOx), polyethyleneimine (PEI) and carbon nanotube (CNT) with addition of terephthalaldehyde (TPA) (TPA/GOx/PEI/CNT) for fabrication of glucose sensor that shows improved sensing ability and stability compared with that using other biocatalysts. Main bonding of the new TPA/GOx/PEI/CNT catalyst is formed by Aldol condensation reaction of functional end groups between GOx/PEI and TPA. Such formed bonding structure promotes oxidation reaction of glucose. Catalytic activity of TPA/GOx/PEI/CNT is evaluated quantitatively by electrochemical measurements. As a result of that, large sensitivity value of $41{\mu}Acm^{-2}mM^{-1}$ is gained. Regarding biosensor stability of TPA/GOx/PEI/CNT catalyst, covalent bonding formed between GOx/PEI and TPA prevents GOx molecules from becoming leaching-out and contributes improvement in biosensor stability. With estimation of the biosensor stability, it is found that the TPA/GOx/PEI/CNT catalyst keeps 94.6% of its initial activity even after three weeks.

SHEAR BOND STRENGTH OF DENTIN BONDING AGENTS ON DENTIN SURFACE TREATED WITH EUGENOL (유지놀 처리된 상아질 표면의 상아질 접착제의 전단결합강도에 관한 연구)

  • Yu, Hwa-Sung;Choi, Gi-Woon;Choi, Kyung-Kyu;Park, Sang-Jin
    • Restorative Dentistry and Endodontics
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    • v.25 no.4
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    • pp.550-560
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    • 2000
  • In this study, shear bond strength of two bonding systems were measured and appearance of dentin surfaces were observed with SEM according to the storage time of eugenol on dentin surface, thus evaluated the effect of eugenol on bond strength of two dentin bonding systems. Control groups were directly bonded to dentin surface with One Step, Prime & Bond 2.1. Experimental groups were divided into experimental I and II according to dentin bonding agents. After eugenol application, dentin surfaces were bonded with One Step and Prime & Bond 2.1 according to the each storage time of immediately, 3min, 24hour, 48hour and 1week, and then control and experimental groups were filled with light cured composite resin(Z-100). After 24 hours water storage at $37^{\circ}C$, all samples were subjected to a shear load to fracture at a cross head 1.0mm/min with Instron universal testing machine(No. 4467). Etched dentin surface storaged for each time of immediately, 3min, 24hour, 48hour and 1 week after eugenol application were observed under Scanning Electron Microscope(Hitachi S-2300) at 20kvp. The data were evaluated statistically with two-way ANOVA and Tukey's HSD. The results were as follows; 1. Shear bond strengths were higher in control groups than in the experimental groups. 2. As storage time was increased after eugenol application, the shear bond strengths were decreased in experimental groups. 3. In experimental I, II the shear bond strengths were the lowest in which storage time was 1 week after eugenol application. 4. As storage time was increased after eugenol application, etched dentin surfaces showed obstructed dentinal tubule.

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Studies on Adhesion Properties of Grafted EPDM Containing Carboxylic Acid Group (카르복시산을 포함하는 Grafted EPDM의 접착특성에 관한 연구)

  • Kim, Dongho;Yoon, Yoomi;Chung, Ildoo;Park, Chanyoung;Bae, Jongwoo;Oh, Sangtaek;Kim, Guni
    • Journal of Adhesion and Interface
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    • v.13 no.1
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    • pp.1-8
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    • 2012
  • The effect of the grafting ratio on the mechanical property and adhesion property of the grafted EPDM modified with methacrylic acid (MA) was investigated. The storage modulus of MA-grafted EPDM was maintained higher than that of cross-linked EPDM vulcanizate by sulfur, but it was observed that the storage modulus was decreased at elevated temperature because of the weakened secondary bonding. When the functional group for hydrogen bonding was introduced in EPDM, it had excellent mechanical properties by the aggregate between grafted EPDM molecules and crystallinity of MA. The bonding strength between EPDM and other rubbers was very low because EPDM has nonpolar property and low molecular interaction to others. The bonding strength was increased as increasing grafting ratio and it was excellent enough to break the rubber during the peel test when the grafting ratio was more than 10%.

A Study on the Bonding Materials used for the Great Jar of the Proto-Three Kingdoms Period from Daechuri Site, Pyeongtaek (평택 대추리 유적 출토 원삼국시대 대형옹(甕)에 사용된 접착재료 연구)

  • Cho, Nam-Chul;Kim, Soo-Chul;Kim, Woo-Hyun;Shin, Yeun-Sik
    • Journal of Conservation Science
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    • v.26 no.4
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    • pp.371-376
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    • 2010
  • The great jar estimated in Proto-Three Kingdoms period was found at the site from Pyeongtaek Daechuri and the bonding traces from pieces destroyed when they were excavated are observed. Therefore this study would figure out the components of bonding material used in great jars by optical microscope, FT-IR, py-GC/MS and the kind of textile attaching to great jar by transmitted light microscope. As a result of optical microscope for the cross-section, black material is uniformly applied between a piece of jar and the part of bonding and the textile line are observed. Black bonding material is resulted in korean rhus lacquer by FT-IR and py-GC/MS and the kind of textile is identified as hemp by transmitted light microscope. Materials for repairing archaeological objects are hardly known causing little information, but this study proves that the bonding material had used lacquer for great jars before Proto-Three Kingdoms period. Therefore if ancient bonding materials are systematically analysed in the further studies, it would be significant help for studying bonding and restoration materials of ancient objects.

Electrical Properties of Organic Materials as Low Dielectric Constant Materials

  • Oh Teresa;Kim Hong Bae;Kwon Hak Yong;Son Jae Gu
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2005.05a
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    • pp.67-72
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    • 2005
  • The bonding structure of organic materials such as fluorinated amorphous carbon films was classified into two types due to the chemical shifts. The electrical properties of fluorinated amorphous carbon films also showed very different effect of two types notwithstanding a very little difference. Fluorinated amorphous carbon films with the cross-link breakage structure existed large leakage current resulting from effect of the electron tunneling. Increasing the cation due to the electron-deficient group increased the barrier height of the films with the cross-link amorphous structure, therefore the electric characteristic of the final materials with low dielectric constant was also improved. The lowest dielectric constant is 2.3 at the sample with the cross-link amorphous structure.

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Effect of Additives on the Physicochemical Properties of Acetaminophen Liquid Suppository (아세트아미노펜 액상좌제의 물리화학적 특성에 미치는 첨가제의 영향)

  • Choi, Han-Gon;Jung, Jae-Hee;Ryu, Jei-Man;Lee, Mi-Kyung;Kim, In-Sook;Lee, Beom-Jin;Kim, Chong-Kook
    • YAKHAK HOEJI
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    • v.42 no.3
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    • pp.290-295
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    • 1998
  • To optimize the formulation of acetaminophen liquid suppository, the effect of additives on the physicochemical properties of liquid suppository base was investigated. The physi cochemical properties of P 407/P 188 (15/15%) (abbreviated in 15/15) and P 407/P l88 (15/20%) (abbreviated in 15/20) were measured after the addition of following additives; 2.5% acetaminophen as an active ingredient, vehicle components (5% ethanol, 5% propylene glycol, 5% glycerin), preservatives (0.1% sodium benzoate, 0,1% methylparahydroxybenzoate, 0.1% propylparahydroxybenzoate) and 1% of sodium chloride as an ionic strength controlling agent. Poloxamer gel was prepared with three different buffer solutions (pH 1.2, 4.0 and 6.8) and the physicochemical properties, gelation temperature, gel strength and bioadhesive force, were determined. In the results, the effect of additives on the physicochemical properties was dependent on their bonding capacities including hydrogen bonding and cross-linking bonding. Because the hydrogen-bonding capacities of acetaminophen, ethanol and propylene glycol were smaller than that of poloxamer, the binding force of poloxamer gel became weak by their putting in between poloxamer gel. Therefore, the gelation temperature (15/15, $35.7^{\circ}C$ vs 37.0, 39.4 $38.2^{\circ}C$; 15/20, $29.2^{\circ}C$ vs 31.2, 32.0, $30.3^{\circ}C$) increased, and gel strength (15/15, 4.03 see vs 2.72, 2.08, 3.12sec; 15/20, 300g vs 50, 50, 200g) and bioadhesive force (15/15, $6.8{\times}10^2\;dyne/cm^2$ vs 3.2, 6.0, $6.0{\times}10^2\;dyne/cm^2$; 15/20, $97.3{\times}10^2\;dyne/cm^2$ vs 11.1, 89.5, $92.0{\times}10^2\;dyne/cm^2$) decreased. Furthermore, the binding force of poloxamer gel became strong due to the hydrogen-bonding capacities of glycerin and the cross-liking bonding of sodium salt. Then, the gelation temperature (15/15, 35.0, $32.1^{\circ}C$; 15/20, 26.0, $21.0^{\circ}C$) decreased, and gel strength (15/15, 6.51 see, 300g; 15/20, 500, 650g) and bioadhesive force (15/15, 7.2, $81.6{\times}10^2\;dyne/cm^2$; 15/20, 112.3, $309.2{\times}10^2\;dyne/cm^2$) increased. The effect of pH on the physicochemical properties of poloxamer gel was dependent on the ingredients with which the buffer solutions were prepared. Poloxamer gels prepared with pH 1.2 and 4.0 buffer solutions had the increasing gelation temperature (15/15, 37.5, $38.1^{\circ}C$; 15/20, 33.1, $34.0^{\circ}C$) and the decreasing gel strength (15/15, 2.98, 3.81sec; 15/20, 200, 200g) and bioadhesive force (15/15, $7.0{\times}10^2dyne/cm^2$; 15/20, $74.0{\sim}88.1{\times}10^2dyne/cm^2$) owing to HCl. Poloxamer gel prepared with pH 6.8 buffer solutions had the decreasing gelation temperature (15/15, $27.2^{\circ}C$; 15/20, $22.3^{\circ}C$) and the increasing gel strength (15/15, 400g; 15/20, 550g) and bioadhesive force (15/15, $207.0{\times}10^2dyne/cm^2$; 15/20, $215.0{\times}10^2dyne/cm^2$) due to the cross-linking bonding of $NaH_2PO_4\;and\;K_2HPO_4$.

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Thermal Stability and Dry Sliding Wear Behavior of Ultra-Fine Grained 6061 Al Alloy Processed by the Accumulative Roll-Bonding Process (누적압연접합 공정에 의해 제조된 초미세립 6061 Al 합금의 열적 안정성과 건식 미끄럼 마멸 거동)

  • Kim Y.S.
    • Transactions of Materials Processing
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    • v.14 no.1 s.73
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    • pp.71-77
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    • 2005
  • Thermal stability and dry sliding wear behavior of ultra-fine grained 6061 Al alloy fabricated by an accumulative roll-bonding (ARB) process have been investigated. After 4 ARB cycles, an ultra-fine grained microstructure of the 6061 Al alloy composed of grains with average size of 500nm, and separated mostly by high-angle boundaries was obtained. Though hardness and tensile strength of the ARB processed Al alloy increased with ARB cycles up to 4 cycles, the processed alloy exhibited decreased ductility and little strain hardening. Thermal stability of the ARB-processed microstructure was studied by annealing of the severely deformed alloy at $423K{\sim}573K$. The refined microstructure of the alloy remained stable up to 473K, and the peak aging treatment of the alloy at 450K for 8 hrs increased the thermal stability of the alloy. Sliding-wear rates of the alloy increased with the number of ARB cycles in spite of the increased hardness with the cycles. Wear mechanisms of the ultra-fine grained alloy were investigated by examining worn surfaces, wear debris, and cross-sections by a scanning electron microscopy (SEM).

Fracture Toughness Improvement of Graphite/Epoxy Composite by Intermittent Interlaminar Bonding (간헐적인 층간접착 을 이용한 Graphite/Epoxy 복합재료 의 파괴인성 개선)

  • 임승규;홍창선
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.8 no.5
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    • pp.425-434
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    • 1984
  • The concept of intermittent interlaminar bonding is investigated as a means of improving the fracture toughness of cross-ply Gr/Ep composites without significant loss of tensile strength and modulus. The concept of linear elastic fracture mechanics(LEFM)is used to study the effects of strong bonded area and bonding composites. The experimental results indicate that the fracture toughness and notch strength of intermittent interlaminar bonded composities are improved and the tensile strength only decreased by 3-8% in comparison to those of the fully bonded composites. Damage zones around the crack tip are detected by the modified X-Ray non-destructive testing technique and the fractography. The improvement of toughness is explained based on the damage zones. The mechanisms of damage zone are shown to be caused by subcrack along the fiber on the 0.deg. ply, matrix cracking along the fiber on the 90.deg. ply, interlaminar delamination, and ply pull-out of the 0.deg. ply.