• Transactions on Electrical and Electronic Materials
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• 제1권1호
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• pp.6-11
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• 2000

The hydrogen plasma treatment of silicon wafers in the reactive ion-etching mode was studied for the application to silicon-on-insulator wafers which were prepared using the wafer bonding technique. The chemical reactions of hydrogen plasma with surface were used for both surface activation and removal of surface contaminants. As a result of exposure of silicon wafers to the plasma, an active oxide layer was found on the surface. This layer was rendered hydrophilic. The surface roughness and morphology were examined as functions of the plasma exposing time and power. In addition, the surface became smoother with the shorter plasma exposing time and power. The value of initial surface energy estimated by the crack propagation method was 506 mJ/㎡, which was up to about three times higher as compared to the case of conventional direct using the wet RCA cleaning method.

• 한국기계가공학회지
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• 제11권3호
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• pp.19-23
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• 2012

Glassy carbon is widely used for high temperature melting process such as quartz due to its thermal stability. For utilizing Classy Carbon to glass mold press(GMP) optical lens, brittleness of Glassy Carbon is main obstacle of ultraprecision machining. Thus authors investigated ductile machining of Glassy Carbon adopting turning and grinding process respectively. From the experiments, ultraprecision turning surfaces resulted brittle crack in all machining conditions and ultraprecision grinding surfaces showed semi-ductile mode in small undeformed chip thickness conditions.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 춘계학술대회 논문집
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• pp.29-33
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• 1996

This paper aims to clatify the potimum grinding condition for the electroplated diamond wheel in form grinding of Sr-ferrite. The main conclusions obtained were as follows. (1) The flexural strength and surface roughness of ferrite became the highest at the peripheral wheel speed of 1700m/min. (2) In the case of depth of cut larger than 0.4mm, crack layers is induced in the ground surface, the fracture type of chips exhibits slight ductile mode in the depth of cut smaller than 0.2mm. (3) When the depth of cut exceed 0.6mm, the tool life becomes extermely short due to large chipping and brackage. However, at the depth of cut .geq. 0.05mm, the diamond grain shows abrasive wear. (4) The flexural strength and surface roughness increases in proportion to the feed rate.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2007년도 추계학술대회 논문집
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• pp.843-851
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• 2007

It is known that bogie frame must have sufficient stiffness for car body and passenger weight and transfer traction and braking force, and as of today most studies and verifications are restricted to static and fatigue analysis for force acted on bogie frame. Bogie frame is mounted with equipments to control the signal, traction and so on, this equipment's behavior is subjected to vibration mode occurs on running condition. If the resonance occurs on this equipment, the possibility of crack occurrence on bracket connected with equipment and bogie frame will be increased. In this paper, the method of vibration strength verification for bracket attached on bogie frame will be introduced by using frequency response method.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2003년도 봄 학술발표회 논문집
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• pp.1007-1012
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• 2003

With deterioration of the nation's infrastructure comes the growing, need for effective means of rehabilitating structures. Possibly one for the most challenging tasks is to upgrade the overall capacity of concrete structure. This study focused on the flexural behavior of reinforced concrete slabs strengthened by PS strand and polymer mortar in the tension zone. The properties of slabs are 70×12㎝ rectangular and over a 220㎝ span. Test parameters in this experimental study were placing thickness, chipping, the number of strand, the kind of mortar. Attention is concentrated upon overall bending capacity, deflection, ductility index, failure mode and crack development of repaired and rehabilitated slabs.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2003년도 봄 학술발표회 논문집
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• pp.591-596
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• 2003

Many studies have dealt with strengthening by epoxy-bonded CFRP(Carbon Fiber Reinforced Polymer) composites. However, the effects of various influencing factors have not been clarified on the behavior of strengthened RC beams. This study was performed to verify the effects of strengthening due to various bond details of externally attached CFRP Composites. In this study, major test parameters include the bond type and the anchor type. The deflections, failure load, strain of reinforcing bar, concrete and CFRP are measured at each loading step. The failure mode and debonding loads(ultimate loads) are analysed from these measured data. According to the test results, all specimens are failed by intermediate flexural crack induced interfacial debonding.

• 콘크리트학회논문집
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• 제12권5호
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• pp.13-23
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• 2000

In this study, an flexural test on half-scale spliced PSC-I girder was conducted to verify the efficiency of the long span spliced girder as suggested by the Korean Highway Design Specification. The experimental results showed that the specimens developed a complex failure mode due to flexural-compression and torsional stress. The cracking moment of each girder was higher the experiment than was calulated by the ACI and the ultimate strength were the almost same. To estimate the safety and the structural efficiency of the spliced girder, the proposed Yielding Resistance Index(YRI) and ductility index by American Concrete Institutes were used based on the energy concept. The proposed YRI defined the ratio of crack resisting energy and the total energy calculated from load-displacement relationship. Based on the analysis of YRI and ductility index, the flexural behavior of the spliced girder was found to be efficient. Through the experimental results, the structural behavior of proposed spliced PSC I-type girder for long span bridge was found to be more efficient than the exsisting PSC I-type girders.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1277-1282
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• 2008

Recently LCD panels have becom very important components for portable electronics. In the high density interconnection material, ACF's are used to connect the outer lead of the tape automated bonding to the transparent indium tin oxide electrodes of the LCD panel. ACF consists of an adhesive polymer matrix and randomly dispersed conductive balls. In this study, we analyzed Failure Mode / Mechanism of ACF which is identified Conductive ball Corrsion, Delamination, Crack and Polymer Expansion / Swelling. In ALT(Accelerated Life Test), we select primary stress factors as temperature and humidity. As time passes by, an increase of connection resistance was observed. In conclusion, we have found that high temperature / humidity affects the adhesion.

• 대한기계학회논문집A
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• 제32권12호
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• pp.1123-1131
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• 2008

This paper provides V-factor estimation under combined mechanical and thermal load for circumferential cracks. Results are based on finite element analyses and effect of types and magnitudes of the thermal stress, crack geometry, the loading mode and plastic strain hardening on variations of the V-factor are investigated. The results of finite element analyses are compared with R6 values. As a result, it is shown that R6 gives generally conservative results. The conservatism is especially increased for the combination of large mechanical and thermal load. As a result, new estimation method which uses failure assessment line in R6 is proposed for V-factor and gives less conservative results.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 추계학술대회논문집A
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• pp.304-309
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• 2000

Strain gage method is used to evaluate the mode I dynamic stress intensity factor of marging steel(18Ni) and titanium alloy(Ti-6A1-4V). To decide the best strain gage position on specimen, static fracture toughness test was performed. Then instrumented charpy impact test and dynamic tensile test was performed by using strain gage method for evlauating dynamic stress intensity factor. Strain gage signals on the crack tip region are used to calculate the stress intensity factors. It is found that strain gage method is more useful than method by using load which is obtained from impact tup to assess dynamic characteristics such as dynamic stress intensity factor.