• 한국지반공학회논문집
• /
• 제33권9호
• /
• pp.23-34
• /
• 2017

도심지 지하공간 개발을 위해서는 안정성 확보를 위해 암반 또는 암주의 미세균열까지도 보강해야 한다. 본 논문에서는 그라우팅 재료의 점도 및 입경, 주입압력, 균열 폭 등을 고려한 미세균열 그라우팅의 주입성능에 대한 연구를 수행하였다. 미세균열 보강에 사용되는 대표적인 그라우팅 재료는 용액형인 약액형 그라우팅 재료와 현탁액형인 시멘트계 그라우팅 재료가 있다. 약액형 그라우팅 재료와 시멘트계 그라우팅 재료의 주입성능은 공통적으로 점도에 영향을 받으며, 시멘트계 그라우팅 재료의 주입성능은 추가적으로 주입 재료의 입경에 영향을 받는다. 실내실험을 통해 점도를 역계산하여 재료별로 적합한 점도 측정 방법을 제시하였고, 균열 폭과 재료의 입경 간의 관계를 이용한 groutability ratio로 시멘트계 그라우팅 재료의 그라우팅 가능여부를 평가하였다.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2004년도 추계학술대회
• /
• pp.13-18
• /
• 2004

It is important to estimate the distribution of intensity of a magnetic field for application of magnetic method to industrial nondestructive evaluation. Magnetic camera provides the distribution of a quantitative magnetic field with homogeneous lift-off and same spatial resolution. Leakage magnetic flux near the crack on the specimen could be amplified by 3-dimensional magnetic fluid and zoom in and out of measurement area. This study introduces the experimental consideration of the effects of lens for concentrating of magnetic flux. The experimental results showed that the magnetic fluid has sufficient lens effect for magnetic camera and effect of improvement in probability of detection.

• Journal of Welding and Joining
• /
• 제22권5호
• /
• pp.32-37
• /
• 2004

Application of bonding by adhesives can be found in many industries, particularly in advanced technological domains such as aeronautical and space, automobile and electronics industries. Periodic inspection with conventional ultrasonic NDE techniques is capable of indicating the presence and possible location of crack. Continuous ultrasonic attenuation monitoring has potential to supply information. This article discusses the use of pulse-echo ultrasonic testing for the inspection of adhesive bonds between metal sheets. The method is based on the measurement of the reflection coefficient at the metal/adhesive interface. By means of a control experiment it is shown that Quantitative Nondestructive Evaluation in Adhesive Joints are evaluated together with Ultrasonic Testing and Fracture Testing.

• International Journal of Naval Architecture and Ocean Engineering
• /
• 제3권2호
• /
• pp.126-135
• /
• 2011

In this study, numerical analysis was carried out by using the finite element method to construct the first mode shape of damaged stiffened plates, and the damage locations were detected with two-dimensional discrete wavelet analysis. In the experimental analysis, four different damaged stiffened structures were observed. Firstly, each damaged structure was hit with a shaker, and then accelerometers were used to measure the vibration responses. Secondly, the first mode shape of each structure was obtained by using the wavelet packet, and the location of cracks were also determined by two-dimensional discrete wavelet analysis. The results of the numerical analysis and experimental investigation reveal that the proposed method is applicable to detect single crack or multi-cracks of a stiffened structure. The experimental results also show that fewer measurement points are required with the proposed technique in comparison to those presented in previous studies.

• 대한기계학회논문집A
• /
• 제26권1호
• /
• pp.113-120
• /
• 2002

Experimental procedure to measure fracture toughness (J$_{c}$) under mixed mode loading using CTS(Compact Tension-Shear) specimens is described. It\`s loading angle ranges from 0$^{\circ}$ to 45$^{\circ}$ with interval of 157. The general outline of experimental procedure is similar to that of ASTM E8l3-89 fur mode I fracture. Equations fur determining J-integral is quoted from the authors' previous works. The relation between unloading compliance and physical crack size was calibrated. As an example, fracture toughness of aluminum alloy 2024p-7361 was measured and some reasonable results of J$_{c}$ with various loading angles were obtained.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2003년도 추계학술대회
• /
• pp.1442-1447
• /
• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

• 대한기계학회논문집A
• /
• 제31권6호
• /
• pp.659-664
• /
• 2007

$Moire\'{e}$ interferometry is a useful technique to assess the reliability of electronic package because $Moire\'{e}$ interferometry can measure the whole-field and real-time deformations. The shear strain of a small crack site is important to the reliability assessment of electronic package. The optical limitation of $Moire\'{e}$ interferometry makes ambiguous the shear strain of a small area. An atomic force microscope (AFM) is used to measure the profile of a micro site. High resolution of AFM can apply to the $Moire\'{e}$ technique. AFM $Moire\'{e}$ technique is useful to measure the shear strain of a small area. In this research, the method to accurately measure the deformation of a small area by using AFM $Moire\'{e}$ is proposed. A phase-shifting method is applied to improve the resolution of AFM $Moire\'{e}$.

• 한국안전학회지
• /
• 제25권2호
• /
• pp.7-11
• /
• 2010

Difficulties associated with full-scale pipe tests are rather obvious. That is, it is not only difficult to perform them but also very expensive and it requires lots of experience. And the process of the fracture test for the pipe specimen is very difficult and complicated. Because the pipe specimen, the test jig and the test equipment are very large and heavy, it requires lots of costs and times. In this study, to easily perform the fracture toughness test for a pipe specimen, load line displacement data was obtained using the image processing method.

• 터널과지하공간
• /
• 제24권1호
• /
• pp.67-80
• /
• 2014

본 연구에서는 임계하균열성장 변수를 구하기 위해 제안된 Wilkins의 시험법을 압열인장시험과 결합하여 화강암의 인장강도, Mode I 파괴인성과 임계하균열성장지수를 동시에 구하였으며 이를 사용하여 암석의 장기거동을 평가하였다. 또한 내부압력을 받는 압축공기저장(CAES) 공동에 대한 장기안정성을 수치해석코드인 FRACOD를 사용하여 해석하였다. 시험 결과 화강암의 임계하균열성장지수(n)는 29.39로 결정되었으며 5 ~ 6 MPa의 내압은 저장공동의 장기안정성에 큰 영향을 미치지 않는 것으로 나타났다. 또한 시험 과정에서 측정한 미소파괴음을 분석한 결과 암석내의 미소균열 생성 및 전파에 따른 암석의 손상을 정량적으로 기술할 수 있었다. 만약, 실내와 동일한 조건으로 현장에서 AE 모니터링을 수행할 경우 AE 모니터링을 통해서 하중을 받는 암석의 현재 상태를 정량적으로 평가하는 것이 가능할 것으로 판단된다.

• 터널과지하공간
• /
• 제13권1호
• /
• pp.64-75
• /
• 2003

본 연구에서는 2001년 Bakers와 Stephansson이 제안한 Punch Through Shear Test를 소개한다. 본 연구의 목적은 대전화강암을 사용하여 이 시험법이 암석의 전단 모드 파괴 인성 측정법으로서의 적합성을 알아보는 것이다. 또한, 전단모드 파괴인성을 구하기 위한 최적의 시료형상을 결정하고 전단모드 파괴인성과 봉압과의 관계를 규명하였다. 시험결과, 인장 파괴에서와 같이 거친 파괴면이 형성되지 않고 전단을 받았음을 알 수 있는 부드러운 파괴면이 관찰되었다. 시료형상에 대한 연속체 해석과 입자유동 해석 그리고 균열전파 시뮬레이션을 수행한 결과 시료내부에서 일어나는 균열의 발생은 주로 전단모드이고 이러한 전단균열들로 인해 시료의 파괴가 발생함을 입증할 수 있었으며, 결과적으로 Punch Through Shear Test는 암석의 전단모드 파괴인성 측정법으로서 적합함을 입증할 수 있었다.