• International Journal of Naval Architecture and Ocean Engineering
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• v.3 no.2
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• pp.126-135
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• 2011

In this study, numerical analysis was carried out by using the finite element method to construct the first mode shape of damaged stiffened plates, and the damage locations were detected with two-dimensional discrete wavelet analysis. In the experimental analysis, four different damaged stiffened structures were observed. Firstly, each damaged structure was hit with a shaker, and then accelerometers were used to measure the vibration responses. Secondly, the first mode shape of each structure was obtained by using the wavelet packet, and the location of cracks were also determined by two-dimensional discrete wavelet analysis. The results of the numerical analysis and experimental investigation reveal that the proposed method is applicable to detect single crack or multi-cracks of a stiffened structure. The experimental results also show that fewer measurement points are required with the proposed technique in comparison to those presented in previous studies.

• Journal of Ocean Engineering and Technology
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• v.11 no.1
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• pp.113-123
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• 1997

The welding residual stresses produced by welding frequently cause a crack and promote stress corrosion etc. in heat affected zone contained with external load and weakness of material. For the purpose pof relaxation of welding residual stress, post welding heat teratment(PWHT) is widely used. In this paper, the computer program which is based on Thermal-Elasto-plastic-creep theory for plane deformation on developed by finite element method (F.E.M) and verified its propriety by experimental measurement and also by using the developed computer program. The mechanical behavior of butt welding joint is clairfied during PWHT.

• Journal of the Korean Society of Safety
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• v.24 no.3
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• pp.1-6
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• 2009

Recently power plants and oil refineries are focusing on capacity enlargement for better efficiency through higher temperature and higher pressure. Thickness of boiler tubes becomes lessened due to oxidation and erasion caused by high temperature bums gas flowing over tubes outside. Accordingly, mechanical stress of tubes is increasing and that is a critical factor to make a crack and fracture. To prevent those sorts of accidents, aging assessment for proper periodic repair and replacement should be conducted reliably and reasonably. We performed IIT test on Cr-Mo steel, one of the most heat-resistant materials for facilities in power plants, and we report the test result and the considerable effectiveness of IIT test.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.1
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• pp.21-26
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• 1993

A study on the fatigue fracture at electro discharge machined(E.D.M) surface has been made with special emphases on the microstructure variation and the residual stress distribution at the E.D.H heat affected zone. Results obtained are summarized as follows. (1) E.D.M brings about a variation of microstructure in heat affected zone, structures of molten, quenching, tempering are formed in order of formation from E.D.M surface. (2) Residual stress generated by E.D.M reduces the fatigue strength of the material through the influencing fatigue crack initiation and growth. (3) Magnitude of the residual stress existed in a microscopic area is approximately estimated by a COD measurement method which was originally suggested by authors.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.1
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• pp.113-120
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• 2002

Experimental procedure to measure fracture toughness (J$_{c}$) under mixed mode loading using CTS(Compact Tension-Shear) specimens is described. It\`s loading angle ranges from 0$^{\circ}$ to 45$^{\circ}$ with interval of 157. The general outline of experimental procedure is similar to that of ASTM E8l3-89 fur mode I fracture. Equations fur determining J-integral is quoted from the authors' previous works. The relation between unloading compliance and physical crack size was calibrated. As an example, fracture toughness of aluminum alloy 2024p-7361 was measured and some reasonable results of J$_{c}$ with various loading angles were obtained.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1442-1447
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• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.5 s.98
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• pp.175-185
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• 1999

Acoustic emission(AE) measurement was carried out to evaluate the fracture behavior of high tension steel. Fracture toughness $K_{AE}$ could be determined reasonably by using the load value corresponding to an abrupt change of the accumulated AE counts AE emitted from the test specimens. AE characteristics of the base metal, the weld metal and the heat-affected zone could be distinguished using a constant value b which represented the AE amplitude distribution, Consequently the structure integrity can be evaluated by variation of the constant b at the load level. In addition it was found that AE signals due to crack growth have high amplitude but low rise time and duration.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.885-886
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• 2006

Significant advances in mechanical testing for hard materials are discussed in this paper. There are three specific areas that are covered. In the measurement of fracture toughness factors such as the control of slow crack growth to produce strating cracks, and evaluating reproducibility and repeatability of tests have been recently examined. The miniaturization of tests reduces the amount of material that is used in testing, improves the throughput of tests, and also improves cost effectiveness. New techniques such as stepwise testing and micro scratch testing have contributed to significant additions to the knowledge of the wear mechanisms that operate in these materials.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.6 s.261
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• pp.659-664
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• 2007

$Moire\'{e}$ interferometry is a useful technique to assess the reliability of electronic package because $Moire\'{e}$ interferometry can measure the whole-field and real-time deformations. The shear strain of a small crack site is important to the reliability assessment of electronic package. The optical limitation of $Moire\'{e}$ interferometry makes ambiguous the shear strain of a small area. An atomic force microscope (AFM) is used to measure the profile of a micro site. High resolution of AFM can apply to the $Moire\'{e}$ technique. AFM $Moire\'{e}$ technique is useful to measure the shear strain of a small area. In this research, the method to accurately measure the deformation of a small area by using AFM $Moire\'{e}$ is proposed. A phase-shifting method is applied to improve the resolution of AFM $Moire\'{e}$.

• Journal of the Korean Society of Propulsion Engineers
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• v.4 no.1
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• pp.53-64
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• 2000

Strain gage method is investigated to evaluate the mode I stress intensity factor. Two types of specimens for CT and three point bend specimen are used. Sharp notch of specimens is manufactured by wiring discharge machining. Strain gages signal from the crack tip region are used to calculate stress intensity factors. The results are compared with those of the ASTM E399 method and finite element analysis. The present experimental results coincide well with the data obtained from finite element analysis. Attached position of strain gage should be seriously considered during the application of this method.