• The Journal of Engineering Geology
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• v.34 no.2
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• pp.163-171
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• 2024

Changes in the soil layer on Dokdo are important both academically and with regard to sustainable conservation and utilization of the islands. Continuous investigation and observation are necessary, as the soil layer is essential to the growth of plants and, therefore, the islands' ecosystem. Such work was carried out for about 8 years using soil erosion measuring bars, which are durable and facilitate simple monitoring of changes in the soil layer. Each bar comprised a rod measuring 30~50 cm long and 1.5 cm in diameter, and the use of stainless steel afforded resistance to corrosion caused by sea breezes. Six measuring bars were installed in the soil layers of each of two islands, Dongdo and Seodo, and measurements were taken one to three times a year from 2014 to 2021. The field measurements indicate that soil was deposited on Dongdo but eroded on Seodo during the observation period. As the measuring bars on Dongdo were located in the central and lower parts of the island, the observed changes in the soil layer resulted mainly from sedimentation of material eroded by weathering or soil runoff from the upper part of the island. In contrast, the measurement locations on Seodo were located in the upper and central parts of the island, where soil erosion and runoff diminished the soil layer at the observation points.

• Clean Technology
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• v.17 no.4
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• pp.306-313
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• 2011

Flux or solder is used in soldering process for manufacturing electronic parts such as printed circuit boards (PCB). After soldering process, residual flux and solder paste on the parts should be removed since their residuals could cause performance degradation or failure of parts due to their corrosion and electric leakage. Ozone depletion substances such as 1,1,1- trichloroethane (TCE) and HCFC-141b have widely been using for removal of residual flux and solder paste after soldering process In manufacturing of electronic parts until now. In this study, non-aqueous cleaning agents without flash point were developed and applied to industrial field for replacement of cleaning agents with ozone depletion. In order to develop non-aqueous cleaning agents without ethers, esters, fluoride- type solvents. And their physical properties and cleaning abilities were evaluated, and they were applied to industrial fields for cleaning of flux and solder on the PCB. And vacuum distillation apparatus were operated to determine their operating conditions and recycling yields for recycling of used cleaning agents formulated in this study. As a result of physical properties measurement of our formulated cleaning agents, they were expected to have good wetting and penetrating power since their surface tensions were relatively low as 18.0~20.4 dyne/$cm^2$ and their wetting indices are relatively large. And some cleaning agents holding fluoride-type solvents as their components did not have any flash point and they seemed to be safe in their handling and storage. The cleaning experimental results showed that some cleaning agents were better in their cleaning of flux and solder paste than 1,1,1-TCE and HCFC-141b. And industrial application results of the formulated cleaning agents for cleaning PCB indicated that they can be applicable to industry due to their good cleaning capability in comparison with HCFC-141b. The recycling experiments of the used formulated cleaning agents through a vacuum distillation apparatus also showed that their 91.9~97.5% could be recycled with its proper operating conditions.