• Title/Summary/Keyword: Corner Filling Ratio

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Finite Element Simulation and Experimental Investigation on the Corner Filling in the Drawing of Quadrangle Rod from a Round Bar (사각재 인발 공정에서 코너 채움에 관한 유한 요소 해석 및 실험)

  • 김용철
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 1999.03b
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    • pp.99-102
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    • 1999
  • In this study, to investigate the effect of process variables such as reduction in area, semi-die angle and the rectangular ratio to the corner filling which influences the dimensional accuracy of the final product in the drawing of the cluadrangle rod from a round bar, it has been simulated by three dimensional rigid-plastic finite element method. In order to reduce the number of simulation artificial neural network has been introduced. Also, through the experimental investigation, the present results have been implemented on the industrial product. In results, the main process variable is the combination of the semi-die angle in case of the irregular shaped drawing process and reduction in area in the event of regular shaped drawing process, respectively.

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Hydroforming Characteristics of Double Layered Tube (이중튜브의 액압 성형특성 연구)

  • Kwon, S.O.;Yi, H.K.;Chung, G.S.;Moon, Y.H.
    • Transactions of Materials Processing
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    • v.16 no.8
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    • pp.567-574
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    • 2007
  • Double layered tube is assembled with an inner tube and an outer tube, similar in material or not, contacting closely and deforming simultaneously when subjected to external force. For the manufacturing of double layered tube, the hydroforming assembly technology has several advantages. Therefore in this study, hydroforming characteristics of double layered tube was investigated. The free bulge test was performed to produce formability diagrams of double layered tubes at various forming pressure and feeding amounts. The hexagonal shape hydroforming test was also performed to estimate the dimensional accuracies of double layered tube through the corner filling ratio and the gap between inner and outer tube. Besides experimental analyses, the analytical model that can predict internal pressure for the hydroforming of double-layered tube was proposed and experimentally validated.

A Studyon the Drawing of Rectangular Rod from Round Bar by using Rigid Plastic FEM and Neural Network (강소성 유한요소법과 신경망을 이용한 직사각재 인발공정에 관한 연구)

  • Kim, Y.C.;Choi, Y.;Kim, B.M.;Choi, J.C.
    • Transactions of Materials Processing
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    • v.8 no.4
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    • pp.331-339
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    • 1999
  • In this study, to analyze the shaped drawing process from round bar, the practical conical die with considering die radius and bearing was defined by a mathematical expression, and also a simple technique for initial mesh generation to the shaped drawing process was proposed. The drawing of rectangular section from round bar, one of the shaped drawing process, has been simulated by using non-steady state 3D rigid plastic finite element method in order to evaluate the influence of semi-die angle and reduction in area to corner filling. Other process variables such as friction constant, rectangular ratio, die radius and bearing length were fixed during the simulation. An artificial neural network has been introduced to obtain the optimal process conditions which gave rise to a fast simulation.

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Effects of Current Density and Organic Additives on via Copper Electroplating for 3D Packaging (3D패키지용 Via 구리충전 시 전류밀도와 유기첨가제의 영향)

  • Choi, Eun-Hey;Lee, Youn-Seoung;Rha, Sa-Kyun
    • Korean Journal of Materials Research
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    • v.22 no.7
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    • pp.374-378
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    • 2012
  • In an effort to overcome the problems which arise when fabricating high-aspect-ratio TSV(through silicon via), we performed experiments involving the void-free Cu filling of a TSV(10~20 ${\mu}m$ in diameter with an aspect ratio of 5~7) by controlling the plating DC current density and the additive SPS concentration. Initially, the copper deposit growth mode in and around the trench and the TSV was estimated by the change in the plating DC current density. According to the variation of the plating current density, the deposition rate during Cu electroplating differed at the top and the bottom of the trench. Specifically, at a current density 2.5 mA/$cm^2$, the deposition rate in the corner of the trench was lower than that at the top and on the bottom sides. From this result, we confirmed that a plating current density 2.5 mA/$cm^2$ is very useful for void-free Cu filling of a TSV. In order to reduce the plating time, we attempted TSV Cu filling by controlling the accelerator SPS concentration at a plating current density of 2.5 mA/$cm^2$. A TSV with a diameter 10 ${\mu}m$ and an aspect ratio of 7 was filled completely with Cu plating material in 90 min at a current density 2.5 mA/$cm^2$ with an addition of SPS at 50 mg/L. Finally, we found that TSV can be filled rapidly with plated Cu without voids by controlling the SPS concentration at the optimized plating current density.

Competitiveness of the Small Package Express Service (소화물 일관수송업(택배업)의 경쟁력 강화)

  • 송계의
    • Proceedings of the Korean Institute of Navigation and Port Research Conference
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    • 1998.10a
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    • pp.223-238
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    • 1998
  • In this study, to investigate the effect of process variables such as reduction in area, semi-die angle and the rectangular ratio to the corner filling which influences the dimensional accuracy of the final product in the drawing of the cluadrangle rod from a round bar, it has been simulated by three dimensional rigid-plastic finite element method. In order to reduce the number of simulation artificial neural network has been introduced. Also, through the experimental investigation, the present results have been implemented on the industrial product. In results, the main process variable is the combination of the semi-die angle in case of the irregular shaped drawing process and reduction in area in the event of regular shaped drawing process, respectively.

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