• Clean Technology
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• v.19 no.4
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• pp.487-491
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• 2013

To efficiently desorb gold and copper-cyanide complexes adsorbed onto Dowex21K XLT resin, the mixed solvent with HCl and acetone which is a kind of dipolar aprotic solvent was used as a desorbing agent. The desorption efficiency for gold-cyanide complex was the highest as about 94% when the mixing ratio of HCl and acetone based on volume was the 7:3, however, the value decreased as the ratio of acetone increased. In the case of copper-cyanide complex, most of them was desorbed when the amount of HCl was relatively higher than that of acetone, however, desorption efficiency decreased as the ratio of acetone increased. The desorption efficiency for gold and copper-cyanide complexes was the 94 and 100%, respectively at the 0.6 M of HCl with the 7 (HCl) : 3 (Acetone) of mixing ratio and desorption efficiency for gold-cyanide complex not increased any more even though higher HCl concentration was used. And the desorption efficiency for gold and copper-cyanide complexes was about 100% at the S/L raio ${\leq_-}1.0$ whereas desorption efficiency for gold-cyanide complex was very low as about 20-29% at the S/L ratio > 1.0. Also, most of desorption process for gold and copper-cyanide complexes was completed within 120 min.

• Journal of the Korean institute of surface engineering
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• v.29 no.2
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• pp.140-145
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• 1996

Silver deposits formed on copper substrates by replacement reactions show poor adhesion, and a silver film plated on such a deposit does not adhere. Silver ion makes a highly stable complex with cyanide ion, so that in a silver cyanide solution, the activity of silver ion is very small. This is one of the reasons for the universal use of cyanide baths in the industrial silver plating. However, the consideration of the difference between the values of the stability constants for bath the silver-iodide complex and the copper-iodide complex suggest that the rate of replacement deposition of silver on the copper substrate in si]ver-potassium iodide solution, could be comparatively low. To confirm this, the rate of replacement deposition of silver in both a silver-potassium iodide solution ($AgNO_3$0.10 mol/L, KI 2.00 mol/L ) and a strike silver plating bath (AgCN 0.028 mol/L, KCN 1.15 mol/L ) was estimated from the current density corresponding to the point of intersection of the anodic and the cathodic polarization curves. These estimated values were almost the same, and it is suggested that the silver-potassium iodide solution is not only a cyanide free silver plating bath capable of employing a copper substrate but a silver plating bath which requires no strike plating.

• Corrosion Science and Technology
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• v.6 no.6
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• pp.304-307
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• 2007

As to the reflection electrode of LCD (liquid crystal displays), silver-copper-gold alloy (hereafter, it is called as ACA (Ag98%, Cu1%, Au1%)) is an effective material of which weathering resistance can be improved more compared with pure silver. However, there is a problem that gold remains on the substrate as residues when ACA is etched in cerium ammonium nitrate solution or phosphoric acid. Gold can not be etched in these etchants as readily as the other two alloying elements. Gold residue has actually been removed physically by brushing etc. This procedure causes damage to the display elements. Another etchant of iodine/potassium iodide generally known as one of the gold etchants can not give precise etch pattern because of remarkable difference in etching rates among silver, copper and gold. The purpose of this research is to obtain a practical etchant for ACA alloy. The results are as follows. The cyanogen complex salt of gold generates when cyanide is used as the etchant, in which gold dissolves considerably. Oxygen reduction is important as the cathodic reaction in the dissolution of gold. A new etchant of sodium cyanide / potassium ferricyanide whose cathodic reduction is stronger than oxygen, can give precise etch patterns in ACA alloy swiftly at room temperature.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.714-719
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• 1996

For the fabrication of the circuits, contact or terminal areas are usually coated with nickel and gold. Usually, diluted palladium solution is applied to initiate electroless nickel plating on the copper circuits. However, the trace amounts of palladium remains on the resin and it causes the extraneous deposition. We confirmed that selectivity was greatly improved by the treatment with the strong reducing agents such as SBH or DMAB. Bondability was greatly influenced by the contents of phosphorus in the deposited nickel. Stabilizers in the electroless gold plating were also influenced the bonding strength. The baths containing cupferron or potassium nickel cyanide as a stabilizer showed superior bondability. The gold deposits having strong orientation with Au(220) and Au(311) showed good bond ability.

• Membrane Journal
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• v.28 no.4
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• pp.252-259
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• 2018

An acidic, real metal-plating wastewater was treated by a fluidized bed membrane reactor introduced with granular activated carbon (GAC) as fluidized media. With GAC fluidization, there was no increase in suction pressure with time at each flux set-point applied. At neutral solution pH, much less fouling rate was observed than acidic pH under GAC fluidization. Higher solution pH resulted in the increase in particle size in metal-finishing wastewater, thus producing a less dense cake structure on membrane. More than 95% of chemical oxygen demand was observed from the fluidized bed membrane reactor under GAC fluidization. Total suspended solid concentration in membrane permeate was near zero. At the raw wastewater pH, no removal of copper and chromium by the fluidized bed membrane reactor was observed. As the pH was increased to 7.0, removal efficiency of copper and chromium was increased considerably to 99 and 94%, respectively. Regardless of solution pH tested, more than 95% of cyanide was removed possibly due to the strong adsorption of organic-cyanide complex on GAC in fluidized bed membrane reactor.