• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2001년도 봄 학술발표회 논문집
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• pp.453-458
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• 2001

Copper slag is produced about 700,000 tons annually though copper refining process in Korea. In the paper, a laboratory investigation was carried out to estimate the geotechnical properties of copper slag and examine the feasibility of using the copper slag as a substitute for conventional construction materials and the improvement of the soft clay deposit. The specific gravity of copper slag is 3.45, and pH is 7.83. And the size distribution of the copper slag is well graded, so usage of copper slag will be extended in Geotechnical engineering fields. Copper slag has the permeability of 3.502${\times}$10￣$^2$cm/sec, which is satisfied with the criterion of sand drainage materials.. At the same time, it is thought to be suitable material for sand mat since it meets JIS of grain size distribution. The content of CaO from steel slag is about 40 percent while that of CaO from copper slag is about 5 percent. Based on this fact, copper slag has less hardening property compared to steel slag. Therefore, copper slag can be used as vertical drains, filters, and sand mats for improving the soft deposit.

• 한국표면공학회지
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• 제49권5호
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• pp.401-407
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• 2016

In this work, effect of zincate treatment of AZ91 Mg alloy on the following electrodeposition of copper was examined in a non-cyanide bath containing pyrophosphate ions in view of surface morphology and adhesion of the electrodeposited copper layer. Without zincate treatment, the electrodeposited copper layer showed very porous structure and poor adhesion. On the other hand, the copper layer electrodeposited on the zincate-treated surface showed dense structure and good adhesion. The dissolution rate of AZ91 Mg alloy after the zincate treatment appeared to decrease about 40 times in the copper pyrophosphate bath, as compared to that of the surface without zincate treatment. The porous morphology and poor adhesion of a copper layer on the AZ91 Mg alloy surface without zincate treatment were attributed to small number of nucleation sites of copper because of rapid dissolution of the magnesium substrate in the pyrophosphate bath. Based on the experimental results, it is concluded that the zincate treatment to form a conducting and protecting layer on the AZ91 Mg alloy surface is essential for successful electrodeposition of a copper layer on AZ91 Mg alloy with good adhesion and dense structure in the copper pyrophosphate bath.

• 공업화학
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• 제2권3호
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• pp.289-299
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• 1991

후막 구리도체에 적합한 유리를 얻기 위하여 연붕규산계 및 무연 붕규산계 유리를 기반으로 하는 9종의 유리를 제조하고 후막 구리도체에의 적합성을 시험하였다. 그 결과 모든 유리들이 후막 구리도체의 쉬트 저항치, 납땜성 및 땜납 침식저항에는 양호하게 기여하는 것을 확인하였다. 그러나 후막과 알루미나 기판간의 노화후의 부착강도는 연붕규산계 유리로 만들어진 구리 도체막 만이 유용한 값을 가졌고, 그 외의 유리로 만들어진 구리 도체막의 노화후 부착강도는 사용하기에 부적합할 정도로 낮은 것이었다. 특히 $Cu_2O$ 가 첨가된 연붕규산계 유리가 후막 구리도체 제조에 가장 양호한 것으로 확인되었다.

• 대한화학회지
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• 제55권4호
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• pp.620-625
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• 2011

구리수은막 전극(CBMFE)으로 전위차 역적정함으로써 이소니아자이드(INH)를 정량하는 간단하고 빠른 방법이다. 순수한 형태와 투약형태에 대해서 1.0-10.0 mg 범위에서 정량 할 수 있도록 적정조건을 설정하였다. 방법의 정밀도와 정확도는 통계적인 방법으로 평가되었으며, 정제와 시럽속에 함유된 INH 정량법은 F-시험과 t-시험을 통하여 영국약전(BP) 방법과 비교하였다.

• Advances in materials Research
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• 제1권2호
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• pp.109-113
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• 2012

Electromigration-induced void evolutions in typical upper and lower layer dual-inlaid Copper (Cu) interconnect structures were simulated by applying a phenomenological model resorting to Monte Carlo based simulations, which considers redistribution of heterogeneously nucleated voids and/or pre-existing vacancy clusters at the Copper/dielectric cap interface during electromigration. The results indicate that this model can qualitatively explain the electromigration-induced void evolutions observations in many studies reported by several researchers heretofore. These findings warrant need to re-investigate technologically important electromigration mechanisms by developing rigorous models based on similar concepts.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 추계학술대회논문집
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• pp.203-206
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• 2004

Copper-based bulk amorphous alloy composite was synthesized by using the copper-coated $Cu_{54}Ni_{6}Zr_{22}Ti_{18}$ amorphous powder which was obtained by argon gas atomization. The amorphous powder having a super-cooled liquid region of 53 K was coated by crystalline copper by electroless coating. The consolidation was carried out by manufacturing performs and by the subsequent warm extrusion at 743 K. During the compression test at the room temperature, the composite containing a large fraction of crystalline copper displayed a larger plastic strain after yielding. FEM simulation revealed change in fracture modes in the composites depending on the amount of crystalline copper in the composites.

• 한국물환경학회지
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• 제22권4호
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• pp.626-631
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• 2006

The adsorption features of copper ion have been investigated by taking the barley residue which occurring from the beer production process as an adsorbent. Under the experimental conditions, adsorption equilibrium of copper ion was attained within 30 minutes after the adsorption started and the adsorption reaction was observed to be first order. As the temperature increased, the adsorbed amount of copper ion at equilibrium was also increased, which indicated that the adsorption reaction was endothermic. Based on the experimental results which obtained by varying the temperatures, several thermodynamic parameters for copper adsorption reaction were estimated. Regarding the electrokinetic behavior of barley residue, its electrokinetic potential was observed to be positive below pH 5 and turned into negative above this pH. In the pH range from 1.5 to 4, copper adsorption was found to be increased, which was well explained by the electrokinetic behavior of barley residue in the pH range. When nitrilotriacetic acid, which is a complexing agent, was coexisted with copper ion, equilibrium adsorption of copper ion was decreased and this was presumed to be due to the formation of metal complex. In addition, the adsorbed amount of copper ion was examined to be increased when $KNO_3$ was coexisted, however, it approached a saturated value above a certain concentration of $KNO_3$.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2002년도 가을 학술발표회 논문집
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• pp.613-620
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• 2002

Sand Compaction Pile(SCP) is a soil improvement method that a sand charge is introduced into the pipe, and the pipe is withdrawn part away while the sand pile is compacted and its diameter is enlarged. The sand used in this method should be of good quality. In Korea, crushed stone and washed sea sand are used frequently in SCP. However, use of these materials is restricted because of environmental problem and deficiency of supply. In the copper smelting process, about 0.7 million tons of copper slag are produced in Korea. The range of particle size distribution of copper slag is from 0.15mm to 5mm, so it can be a substitute for sand, and the relatively high specific gravity compared with the sand, is its characteristic. Copper slag is hyaline and so stable environmentally that in foreign country, such as Japan, Germany etc., it is widely used in harbor, revetment and offshore structure construction works. Therefore, in this study, the several laboratory tests were peformed to evaluate the applicability of copper slag as a substitute for sand of SCP. From the mechanical property test, the characteristics of sand and copper slag were compared and analyzed, and from laboratory model test, the strength of composite ground was compared and analyzed by monitoring the stress and ground settlement of clay, SCP and copper slag compaction pile. Specially, this study focused on the application of copper slag as sand substitute in SCP pilot tests based on laboratory tests results.

• 방사성폐기물학회지
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• 제21권1호
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• pp.1-8
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• 2023

The major concern in the deep geological disposal of spent nuclear fuels include sulfide-induced corrosion and stress corrosion cracking of copper canisters. Sulfur diffusion into copper canisters may induce copper embrittlement by causing Cu₂S particle formation along grain boundaries; these sulfide particles can act as crack initiation sites and eventually cause embrittlement. To prevent the formation of Cu₂S along grain boundaries and sulfur-induced copper embrittlement, copper alloys are designed in this study. Alloying elements that can act as chemical anchors to suppress sulfur diffusion and the formation of Cu₂S along grain boundaries are investigated based on the understanding of the microscopic mechanism of sulfur diffusion and Cu₂S precipitation along grain boundaries. Copper alloy ingots are experimentally manufactured to validate the alloying elements. Microstructural analysis using scanning electron microscopy with energy dispersive spectroscopy demonstrates that Cu₂S particles are not formed at grain boundaries but randomly distributed within grains in all the vacuum arc-melted Cu alloys (Cu-Si, Cu-Ag, and Cu-Zr). Further studies will be conducted to evaluate the mechanical and corrosion properties of the developed Cu alloys.

• Journal of Electrochemical Science and Technology
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• 제14권2호
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• pp.194-204
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• 2023

Models based on diffusion-limited aggregation (DLA) have been extensively used to explore the mechanisms of dendritic particle aggregation phenomena. The physical and chemical properties of systems in which DLA aggregates emerge are given in their fractal. In this paper, we present a comprehensive study of the growth of electrodeposited copper dendrites in flat plate electrochemical cells from a fractal perspective. The effects of growth time, applied voltage, copper ion concentration, and electrolyte acidity on the morphology and fractal dimension of deposited copper were examined. 'Phase diagram' set out the variety of electrodeposited copper fractal morphology analysed by metallographic microscopy. The box counting method confirms that the electrodeposited dendritic structures manifestly exhibit fractal character. It was found that with the increase of the voltage and copper ion concentration. The fractal copper size becomes larger and its morphology shifts towards a dendritic structure, with the fractal dimension fluctuating around 1.60-1.70. In addition, the morphology of the deposited copper is significantly affected by the acidity of the electrolyte. The increase in acidity from 0.01 to 1.00 mol/L intensifies the hydrogen precipitation side reactions and the overflow path of hydrogen bubbles affects the fractal growth of copper dendrites.