• Transactions of Materials Processing
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• v.14 no.2 s.74
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• pp.147-152
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• 2005

The objective of this study is to develop an optimal drawing die for the clad wire drawing process. Cu-clad wire, which has the advantages of the high strength of a steel core and the electro-conductivity, corrosion resistance of a copper layer, is widely being used in the field of the telecommunications, electric-electronic and military technology industries. It is important to obtain uniformly coated rate when producing clad wires. Drawing process of clad wire will be influenced on damage and coated rate of core and sleeve for process variables such as semi-die angle and reduction in area. Therefore, in this study, the finite-element result obtained in this study was analyzed to the effect of the various forming parameters, which included the semi-die angle and reduction in area. The coated rate will be predicted with observation of copper coated rate variation according to total reduction in area and the optimal pass schedule will be set up through proper reduction in area and semi-die angle variation.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.47-52
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• 2013

Gold wire has long been used as a proven method of connecting a silicon die to a substrate in wide variety of package types, delivering high yield and productivity. However, with the high price of gold, the semiconductor packaging industry has been implementing an alternate wire material. These materials may include silver (Ag) or copper (Cu) alloys as an alternative to save material cost and maintain electrical performance. This paper will analyze and compare the electrical characteristics of several wire types. For the study, typical 0.6 mil, 0.8 mil and 1.0 mil diameter wires were selected from various alloy types (2N gold, Palladium (Pd) coated/doped copper, 88% and 96% silver) as well as respective pure metallic wires for comparison. Each wire model was validated by comparing it to electromagnetic simulation results and measurement data. Measurements from the implemented test boards were done using a vector network analyzer (VNA) and probe station setup. The test board layout consisted of three parts: 1. Analysis of the diameter, length and material characteristic of each wire; 2. Comparison between a microstrip line and the wire to microstrip line transition; and 3. Analysis of the wire's cross-talk. These areas will be discussed in detail along with all the extracted results from each type the wire.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.5
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• pp.1-8
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• 2022

Fused deposition modeling (FDM), based on stacking a continuous filament of polymer or composite materials, is well matured and is thus widely used in additive manufacturing technology. To advance FDM-based 3D printing technology, the mechanical properties of additively manufactured composite materials must be improved. In this study, we proposed a novel FDM 3D printing process using metal wire-polymer composites, enabling enhanced mechanical properties. In addition, we developed a new type FDM filament of copper wire wrapped in nylon material for stable 3D printing without thermal damage during the printing process. After FDM printing of the copper wire-nylon composite filament, we conducted a tensile test to investigate the mechanical behavior of the printed composite materials. The experimental results confirmed that the tensile strength of the 3D-printed metal wire-polymer composites was higher than that of the conventional single polymer material. Thus, we expect that the FDM printing process developed in this study may be promising for high-load-bearing applications.

• Journal of the Korean institute of surface engineering
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• v.48 no.1
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• pp.1-6
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• 2015

Amino-carboxyl acid as a complexing agent in acid copper sulfate solution was utilized to improve the adhesion of immersion copper layer for steel wire. According to the tape test results, regardless of alloy composition of the wire, the adhesion of immersion copper layer was improved with the addition of amino-carboxyl acid. The incorporation of H and Fe in the plating layer was analyzed by TOF-SIMS. The H and Fe were detected at the entire coating layer without any addition of amino-carboxyl acid. However, with addition of amino-carboxyl acid, the H and Fe were scarcely detected at the coating layer.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.10a
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• pp.245-249
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• 2009

According to the increase of intelligent vehicles many automotive electric components are installed. The wire harness which connects those also increases. The crimping process for compressing the copper wire bundle into the terminal is a key process to assure the good quality of wire harness. For the case of inadequate forming condition many shape failures such as less-filling, over-filling are happen in the crimping process. Even though the quality of crimping shape is satisfactory the quality check for electrical resistance of wire harness is sometime not satisfied the qualification due to large variation of electrical resistance of wire harness under climate test. This large variation is thought to be related with the malfunction automotive electric system and caused by the internal stress of wire, which occurred during the crimping process. In this paper we develop the 3D-FEM simulation scheme and design methodology of optimum terminal shape. Also the effect of terminal shape on the residual stress is discussed.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.2 no.2
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• pp.98-105
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• 2003

In the experimental study, wire EDM was conducted for cold die steel by changing the Wire electrode, peak discharge current and number of finish cut. From the micro structure analysis of SEM photographs, the size of irregular welded and added component on the EDMed surface is decreasing and size of EDMed plane surface is increasing as the decreasing peak current and increasing number of finish cut. From the analysis of coating effect, Zn component is highly contained in Br and Zn Wire EDMed surface and copper component is highly contained in Br and Al wire EDMed surface. Hardness values are Increasing as the increasing peak current and decreasing the number of finish cut The value of hardness is decreasing as Cu, Al, Zn and Br wire electrode because of the residual austenite effect of solid solution copper on solidification, and finally EDMed surface has the highest hardness values for every wire electrode. Yield strength values becomes larger and bending strength values become smaller due to the increasing the hardness. These results are increased as increasing brittleness with hardness.

• Proceedings of the KSR Conference
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• 2007.05a
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• pp.875-880
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• 2007

Due to increasing demands for environment-friendly railway system, bronze wires with cadmium, which is a potential environmental hazard, have been no longer permitted as messenger wire for electric railway system. One of materials being considered as the replacements is copper-clad steel conductor(CCSC), which is currently used as contact wire for high speed operation in the Japanese shinkansen. However, there have been few studies for the application as messenger wire by the CCSC. This study deals with requirements and performances of the messenger wire stranded by the CCSC, especially for high speed electric railway. And the tentative evaluation items and methods to be specified as the Korean railway standard(KRS) are proposed.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.56 no.1
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• pp.37-44
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• 2007

This paper describes characteristics for copper oxide growth of polyvinyl chloride(PVC) insulated wires by series arc. In this experiment, 600V IV wires were used, and characteristics of oxide growth and ignition process were analyzed in case load was 300W, 460W and 600W, respectively. In the result of experiment, covering materials were molten, carbonized and ignited, whereas, oxidized materials were grown in conducting material. During copper oxide was growing, contact voltages and power dissipations increased. When there is copper oxide growth, the waveform of current showed sinusoidal waveform, and the waveform of voltage showed modified waveform. Oxidized materials were heated at about $905^{\circ}C$, surface structure showed irregular shapes, and cross-section showed multiple cracks. And, the results of this experiment were applied to the fire cause analysis of fire evidence collected at the fire scene.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.358-359
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• 2008

The heat generated in the high-Tc superconducting (HTS) devices is related with the cost efficiency and safe factor of HTS devices. This paper deals with the quench at the conduction-cooled joint between the HTS wire and copper terminals. The 3-D numerical simulation of this phenomenon was implemented and compared with the experimental results. The experiment was implemented with the HTS wire mounted on the copper blocks cooled with a Gifford McMahon (GM) cryocooler.

• Progress in Superconductivity and Cryogenics
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• v.25 no.4
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• pp.24-27
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• 2023

Until now, many research activities have been conducted to commercialize high-temperature superconducting (HTS) wires for electric applications. Most of all researchers have focused on enhancing the piece length, critical current density, mechanical strength, and throughput of HTS wires. Recently, HTS magnet for generating high magnetic field shows degraded performance due to the deformation of HTS wire by high electro-magnetic force. The deformation can be derived from widthwise thickness non-uniformity of HTS wire mainly caused by wet processes such as electro-polishing of metal substrate and electro-plating of copper. Gradient sputtering process is designed to improve the thickness uniformity of HTS wire along the width direction. Copper stabilizing layer is deposited on HTS wire covered with specially designed mask. In order to evaluate the thickness uniformity of HTS wire after gradient sputtering process, the thickness distribution across the width is measured by using the optical microscope. The results show that the gradient deposition process is an effective method for improving the thickness uniformity of HTS wire.