• Journal of Korea Foundry Society
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• v.25 no.6
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• pp.259-264
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• 2005

The copper clad steel wire is used extensively as lead wires of electronic components such as capacitors, diodes and glass sealing lamp because the wire combines the strength and low thermal expansion characteristic of Fe-Ni steel with the conductivity and corrosion resistance of copper. In order to fabricate the copper clad steel wire, several processes including electro-plating, tubecladding extrusion process and dip forming process have been introduced and applied. The electroplating process for the production of copper clad steel wire shows poor productivity and induces environmental load generation such as electroplating solution. The dip forming process is suitable to mass production of copper clad steel such as trolley wire. and need expensive manufacturing facilities. The present paper describes the improvement of the conventional continuous casting process to fabricate copper clad steel wire, which its core metal is low thermal expansion Fe-Ni alloy and its sheath material is copper. In particular, the formation of intermetallic compound at interface between core and sheath was investigated in order to introduce optimum continuous casting process parameter for fabrication of copper clad steel wire with higher electrical conductivity. The mechanical strength of copper clad steel wire was also investigated through wiredrawing process with of 95% in total reduction ratio.

• Resources Recycling
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• v.29 no.4
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• pp.67-72
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• 2020

Recycling processes of spent copper wires cosisnt of several steps of cutting and chopping processes for peeling covering materials followed by gravity separation processes, where copper is recovered. Because copper thin wires could be lost during further recycling processes, the wire may need to be further treated. In the present study, the copper thin wire was treated with ball milling to prevent the loss. Since the aggregation of the copper wire could be formed by bending and entangling the copper wire each other, the degree of flexion of the copper wire was measured after ball milling. When the 0.5 cm and 3 cm copper wires were used, the 0.5 cm copper wire was not bent and the 3 cm copper wires were aggregated regardless of the ball addition. When the 1 cm and 2 cm copper wires were used, the degree of flexion was remarkable when the balls were added. In the tests using 2 cm copper wires, the aggregation ratio of the copper wire gradually increased with the amount of the 20 mm alumina ball, and when 200 ml of 30 mm alumina ball was used, the aggregation ratio increased to 89.29 %, but after increasing the ball amount further, the aggregation ratio decreased. Thus, it is expected that the loss of the copper wire could be reducedif when the copper thin wire is treated with ball milling by the aggregation of copper thin wires.

• Journal of Powder Materials
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• v.17 no.4
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• pp.276-280
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• 2010

In the present work, ethylene glycol-based (EG) copper oxide nanofluids were synthesized by pulsed wire evaporation method. In order to explode the pure copper wire, high voltage of 23 kV was applied to the both ends of wire and argon/oxygen gas mixture was used as reactant gas. EG-based copper oxide nanofluids with different volume fraction were prepared by controlling explosion number of copper wire. From the transmission electron microscope (TEM) image, it was found that the copper oxide nanoparticles exhibited an average diameter about 100 nm with the oxide layer of 2~3 nm. The synthesized copper oxide consists of CuO/$Cu_2O$ phases and the Brunauer Emmett Teller (BET) surface area was estimated to be $6.86\;m^2\;g^{-1}$. From the analyses of thermal properties, it is suggested that viscosity and thermal conductivity of EG-based copper oxide nanofluids do not show temperature-dependent behavior over the range of 20 to $90^{\circ}C$. On the other hand, the viscosity and thermal conductivity of EG-based copper oxide nanofluids increase with volume fraction due to the active Brownian motion of the nanoparticles, i.e., nanoconvection.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.34-36
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• 2005

Copper wire bonding is an alternative interconnection technology that serves as a viable and cost saving alternative to gold wire bonding. In this paper, ultrasonic wedge bonding with $25{\mu}m$ copper wire on Au/Ni/Cu metallization of a PCB substrate was performed at ambient temperature. The central composite design of experiment (DOE) approach was applied to optimize the copper wire wedge bonding process parameters. After that, pull test of the wedge bond was performed to study the bond strength and to find the optimum bonding parameters. SEM was used to observe the cross section of the wedge bond. The pull test results show good performance of the wedge bond. Additionally, DOE results gave the optimized parameter for both the first bond and the second bond. Cross section analysis shows a continuous interconnection between the copper wire and Au/Ni/Cu metallization. The diffusion of Cu into the Au layer was also observed.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.12
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• pp.1346-1350
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• 2012

Contact wire is one of the most important components supplying electricity to railroad cars. At the beginning of the research on contact wire, wear problem caused by friction between contact wire and pantograph was considered even more important issue for the failure of contact wire. However, since several fatigue fractures were reported from Shinkansen in Japan, fatigue fracture has become another important issue for the failure of contact wire. Despite of its importance, standard of the fatigue test of contact wire has not been established yet. Thus, fatigue characteristics of contact wire is very difficult issue to evaluate quantitatively. Hence, in this study, test method simulating operating conditions of contact wire by Minsung Kang and etc. is used to evaluate the fatigue characteristics of copper alloy contact wire. Also, test results is compared with the result of Minsung Kang's research on pure copper contact wire.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.103-111
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• 2017

In this study, the thermomechanical stress and fatigue analysis of a high voltage and high current (3,300 V/1200 A) insulated gate bipolar transistor (IGBT) module used for electric locomotive applications were performed under thermal cycling condition. Especially, the reliability of the copper wire and the ribbon wire were compared with that of the conventional aluminum wire. The copper wire showed three times higher stress than the aluminum wire. The ribbon type wire showed a higher stress than the circular type wire, and the copper ribbon wire showed the highest stress. The fatigue analysis results of the chip solder connecting the chip and the direct bond copper (DBC) indicated that the crack of the solder mainly occurred at the outer edge of the solder. In case of the circular wire, cracking of the solder occurred at 35,000 thermal cycles, and the crack area in the copper wire was larger than that of the aluminum wire. On the other hand, when the ribbon wire was used, the crack area was smaller than that of the circular wire. In case of the solder existing between DBC and base plate, the crack growth rate was similar regardless of the material and shape of the wire. However, cracking occurred earlier than chip solder, and more than half of the solder was failed at 40,000 cycles. Therefore, it is expected that the reliability of the solder between DBC and base plate would be worse than the chip solder.

• Journal of the Korean Society of Fashion and Beauty
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• v.4 no.4 s.10
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• pp.63-74
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• 2006

The purpose of the study was to investigate unique field of formative characteristics using copper wire, the present thesis aims at developing concept of hair art as a creative way, and recognizing the formative characteristics of copper wire as analyze and arrange the concept of hair art, formative, a way of practical application, material aspect, through literature, academic journals, photo data, and researched about prior piece, for example, architecture and costume with hair art, and then pieces of hair art were made. Influenced by the theory, applied the social phenomenon and the formative principles, produced the seven pieces which includes flying, composure, yahoo, harmony, balance, way, spring etc. The results of this research are outlined below. Firstly, It showed that the copper wire can express the mysterious and beautiful formative world, and it could know the possibility of design. Secondly, formative activity using copper wire can differ according to approach and interpretation, and it can be a works with aesthetic value. Thirdly, hair could be express the art of the three-dimensional forms which constitute the mixture of line, surface and space. Fourthly, the handicraft including beading, pleat, piping, rolling that used for works are proper to express the unique formative and the rich colors, and it can also express the transparency. So it showed that copper wire is a proper materials. So, hair art has enlarged the fields with development of technique, and changed to recognition of the hair art, and opened up a new field. Hair art will be positive fields to maximize the possibility, and not only the beauty artist but also the public will be communicate each other.

• Korean Journal of Optics and Photonics
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• v.17 no.3
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• pp.290-295
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• 2006

The coupling between copper wire and a THz electromagnetic wave is one of the important factors to build up the magnitude and spectrum of a THz wave. We measured a I THz spectrum range THz pulse into a $480{\mu}m$ diameter and 23cm long copper wire waveguide. We measured THz pulses up to $275{\mu}m$ air gap between the end of the copper wire and transmitter or receiver chips. The coupling sensitivity of the transmitter is 3 times bigger than that of the receiver. The THz pulses propagated to air by the end of the receiver-side copper wire tip acting as a transmitter antenna. We confirmed that the THz field concentrates near the copper wire surface by opening the pin hole to the copper wire waveguide.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.7
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• pp.602-605
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• 2009

The heat generation in the high-$T_c$ superconducting (HTS) wire is related with the cost efficiency and safe factor of HTS devices. This paper deals with the thermal quench at the conduction-cooled joint between HTS wire and copper terminals. The 3-D numerical simulation of thermal distributions in part of the copper terminals was implemented and the premature quench at copper block was observed through the test. The results will be helpful to design the conduction-cooled HTS magnets.

• Journal of the Korean Society of Radiology
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• v.14 no.5
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• pp.619-626
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• 2020

This study aimed to identify the error rates in Catheter Calibration Mode, Auto Calibration Mode, and Segment Calibration Mode among many calibration modes as a quantitative evaluation tool used for predicting the diameter and length of balloon or stent in percutaneous intravascular balloon dilatation or stent insertion. Our experiment was conducted with Copper Wire of 2 mm × 80 mm (diameter × length) manufactured elaborately for quantitative evaluation in calibration and Metal Ball of 5, 10, 15, 30, and 40 mm and Acryl Phantom of 25 mm, 50 mm, 75mm, 100 mm, 125 mm, 150mm, 175 mm, and 200 mm. At each height, subtraction images were acquired with a cineangiograph and Stenosis Analysis Tool as a software provided by the equipment company was used for measurement. To evaluate the error rates in Catheter Calibration Mode, Copper Wire was put on each acryl phantom before shooting. Copper Wire of 2 mm in diameter was set as a diameter for catheter, and Copper Wire of 8 mm in length was measured with Multi-segments. As a result, the error rates appeared at 1.13 ~ 5.63%. To evaluate the error rates in Auto Calibration Mode, the height of acryl was entered at each height of acryl phantom and the length of 8 mm Copper Wire was measured with Multi-segments and as a result, the error rates appeared at 0 ~ 0.26%. To evaluate the error rates in Segment Calibration Mode, each metal ball on the floor of table was calibrated and the length of 8 mm Copper Wire on each acryl phantom was measured and the length of 8 mm Copper Wire depending on the changes of acryl phantom height was measured with Mutli-segments and as a result, the error rates appeared at 1.05 ~ 19.04%. And in the experiment on OID changes in Auto Calibration Mode, the height of acryl phantom was fixed at 100mm and OID only changed within the range of 450 mm ~ 600 mm and as a result, the error rates appeared at 0.13 ~ 0.38%. In conclusion, it was found that entering the height values in Auto Calibration Mode, among these Calibration Modes for evaluating quantitative vascular dimensions provided by the software was the calibration method with the least error rates and it is thus considered that for calibration using a metal ball or other objects, putting them in the same height as that of treatment sites before calibrating is the method that can reduce the error rates the most.