• Bulletin of the Korean Chemical Society
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• v.23 no.8
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• pp.1135-1138
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• 2002

CuO/ZnO, CuO/SiO,sub>2, and CuO/ZrO2 catalysts were prepared for investigating the support effects on methanol dehydrogenation. It was found that the conversion of methanol was proportional to the copper surface area on Cu/ZnO cat alysts and was independent on that on Cu/ZrO2 and Cu/SiO2. The highest copper surface area was obtained with the Cu/ZrO2 (9/1). The unusual deactivation of the Cu/ZnO, which showed the highest selectivity among the catalysts tested, was observed. Pulse reaction with methanol indicated that the lattice oxygen in ZnO could be removed by forming CO2 in the catalytic reaction, supporting that the ZnO reduction was responsible for the severe deactivation of the Cu/ZnO.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.10 no.5
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• pp.124-129
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• 2001

The experimental study was the cutting characteristics of non-ferrous metals. The experimental apparatus was used the turning machine and diamond tool. This aimed at lading the optimal cutting conditions by measuring surface farm and roughness. Used non-ferrous metals were aluminum, brass and oxygen-free copper. As well, according to changing cutting conditions such as feed rate by measuring cutting farce and surface roughness and according to cutting conditions the non-ferrous metals studied about cutting properties.

• Journal of Surface Science and Engineering
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• v.27 no.1
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• pp.29-35
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• 1994

The effects of coating of 3$\mu\textrm{m}$ thickness on the mechanical property of alumina after heat treatment at 100$0^{\circ}C$ for 30minutes under $10^{-6}$torr vacuum was quantified in terms of modulus of rupture(MOR) using Weibull plot. While the copper coating did not change MOR of alumina due to the nonwetting behavior of Cu on $Al_2O_3$, the reactive titanium metal coating caused a noticeable 29% reduction in averaged MOr strength. This was related with the combined effects of microcracks in coating formed during heat treatment and good bonding character between Ti and $Al_2O_3$. The effect of cosputtering of Ti and Cu, bilayer coatings of Cu/Ti and Ti/Cu were also investigated. It was found that Ti, cosputtered, Cu/ti and Ti/Cu coatings reduced MOR strength of alumina in the order listed. This was correlated with the amount of Ti at coating/alumina inter-face associated with a coated layer or segregation of Ti during heat treatment.

• Journal of Surface Science and Engineering
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• v.29 no.2
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• pp.109-119
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• 1996

In order to improve adhesion of electroless copper deposits on alumina substrates, some stabilizers such as 2-Mercapto Benzothiazole, thiourea and NaCN were added over a wide range of concentrations. The adhesion tests of the deposits were performed by using the cellophane tape and the push-pull scale. With the minor addition of the stabilizers, 2-MBT having a large molecular size gives poor adhesion, together with a finer grain structure, whereas Thiourea and NaCN show a high mechanical strength of the deposits. The high mechanical strength is supposed to be due to the easy desorption of hydrogen gas generated from the electroless reactions. A large amount of the three stabilizers decreases the adhesion for all the cases, resulting from strong adsorption of the stabilizers to the substrates.

• Korean Journal of Microbiology
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• v.22 no.4
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• pp.243-247
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• 1984

The effect of the heavy metals copper and cadmium on the natural populations of surface microlayer and subsurface water was investigated. Two microbiological parameters, number of colony-forming bacteria and $^{14}C-glucose$ uptake rate, were evalated. The two natural bacterial populations showed different tolerances of the heavy metals. The ingibition of bacterial growth and activity occurred more strongly in the 1m-depth samples than in neuston populations. The results support the existence of autochthonous bacterioneuston populations in marine environment.

• Journal of Surface Science and Engineering
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• v.29 no.3
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• pp.186-194
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• 1996

In this study, ceramic film was coated by a sol-gel process for increasing the adhesion strength between the substrate and copper layer. TEOS and ATSB were used as starting solution of metallic alkoxide. As a result, amorphous-like diffraction pattern after heat treatment at $1200^{\circ}C$ was obtained using X-ray diffractometer. The more contants of $Al_2O_3$ gave rise to the futher advanced cracks. A maximum adhesion strength of 250gf was measured under the condition of 30 Wt.% $Al_2O_3$, which is 5 times greater than that of uncoated one of the ceramic film.

• Journal of Surface Science and Engineering
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• v.32 no.3
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• pp.372-376
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• 1999

The deposited Cu film on the ferrite magnet was more deposited comparing with that on the plastic magnet. The Cu film became thicker on the S pole comparing with that on the N pole in the both of magnets. The thickness and texture coefficient of deposited copper film affected with direction of line of magnetic force. The difference of pole had little or no effect to the texture coefficient of deposited nickel film. The reaction rate on ferrite magnet and S pole was faster comparing with that on plastic magnet and N pole.

• Journal of Surface Science and Engineering
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• v.32 no.3
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• pp.444-446
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• 1999

The structure and composition of anodic films, formed on 6063 commercial aluminium alloy at constant current density of $1.5A/^dm2$ with various superimposed cathodic current ratio, in the range 0~33%, in the 11% $H_2SO_4$ with various concentration of $CuSO_4{\cdot}5H_2O$, in the range 0~75 g/l, without cathodic current are generally porous-type and no sign of Cu co-deposition appearance, suggesting that cathodic current is an important factor in the Cu co-deposition. Comparison with the anodic film thickness measurement results obtained from anodic film formed by direct anodic current and anodic film formed by superimposed various portion of cathodic current, the portion of cathodic current of input current increases with decrease of anodic film thickness and increases with increase of concentration of $Cu_2S{\;}and{\;}Cu_2O$ in the anodic film.

• Journal of Surface Science and Engineering
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• v.36 no.4
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• pp.347-355
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• 2003

Roughening of metal surfaces frequently enhances the adhesion strength of metals to polymers by mechanical interlocking. When a failure occurs at a roughened metal/polymer interface, the failure prone to be cohesive. In a previous work, an adhesion study on a roughened metal (oxidized copper-based leadframe)/polymer (Epoxy Molding Compound, EMC) interface was carried out, and the correlation between adhesion strength and failure path was investigated. In the present work, an attempt to interpret the failure path was made under the assumption that microvoids are formed in the EMC as well as near the roots of the CuO needles during compression-molding process. A simple adhesion model developed from the theory of fiber reinforcement of composite materials was introduced to explain the adhesion behavior of the oxidized copper-based leadframe/EMC interface and failure path. It is believed that this adhesion model can be used to explain the adhesion behavior of other similarly roughened metal/polymer interfaces.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.10a
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• pp.168-168
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• 2009

핸드폰, 노트북과 같이 최신경량 전자재료로 만들어지는 전자제품의 수요가 급증함에 따라 반도체 배선의 폭이 점점 작아지고, 이로 인해 프린팅공정을 이용한 미세 배선기술이 활발히 개발되고 있다. 이에 본 연구는 미세배선에 높은 전기전도도를 부여하기 위하여 전기도금을 실시하였으며, 균일한 도금층을 얻기 위하여 첨가제에 따른 분극거동을 분석하고 이를 바탕으로 양극 및 음극 형상에 따른 구리의 성장 거동을 시뮬레이션을 통하여 분석하였다. 균일한 증착을 위해서는 첨가제의 역할도 중요하지만 양극과 음극의 형상에 따라서도 구리성장 거동에 영향을 미치는 것을 알 수 있었다.