• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2005.11a
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• pp.152-152
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• 2005

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.05a
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• pp.212-212
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• 2009

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.05a
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• pp.125-125
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• 2009

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.222-223
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• 2014

전량 수입에 의존하고 있는 고가의 HEV 및 FPC용 압연동박 대체, 대일 무역 역조개선, 전방위 업체 국제 가격 경쟁력 강화 기여.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.05a
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• pp.122-123
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• 1998

• Clean Technology
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• v.27 no.3
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• pp.240-246
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• 2021

The waste etching solution for chip on film (COF) contained about 3.5% copper, and it was recovered through cementation using iron samples. The effect of cementation with plate, chip, and powder iron samples was investigated. The molar ratio (m/r) of iron to copper was used as a variable in order to increase the recovery rate of copper. As the molar ratio increased, the copper content in the solution rapidly decreased at the beginning of the cementation reaction. Before and after the reaction, the copper content of the solution was determined by Inductively Coupled Plasma (ICP) using copper concentration according to time. After cementation at room temperature for 1 hour, the recovery rate of copper had increased the most in the iron powder sample, having the largest specific surface area of the samples, followed by the chip and plate samples. The recovered copper powder was characterized for its crystalline phase, morphology, and elemental composition by X-ray diffraction (XRD), scanning electron microscopy (SEM), and Energy-dispersive X-ray spectroscopy (EDS), respectively. Copper and unreacted iron were present together in the iron powder samples. The optimum condition for recovering copper was obtained using iron chips with a molar ratio of iron to copper of 4 giving a recovery rate of about 98.4%.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.6
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• pp.658-662
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• 2001

The classification of surface flaw types was performed on the basis of angular dependence of backscattered ultrasound. The copper line adhered on the surface, cower line filled in groove, pure groove and the normal edge were adopted as various surface flaw patterns of glass specimen. A backward longitudinal profile was formed probably by the longitudinal wane scattering at and near 1st critical angle. The wave trains at the peak angles of the backward radiation profiles showed different shapes according to the superposition ratio of scattered and leaky waves. The asymmetry of the backward radiation profile arose due to the scattering effect of flaw. The additive resonance effect of copper line appeared in the left side of the profile. The peak angles of both the longitudinal and radiation profiles were shifted toward small angle by the scattering effect.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.12
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• pp.120-126
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• 2002

The needs of ultra-precisely machined parts are increasing more and more. But the experimental data required to ultra precision machining of nonferrous metal is insufficient. The behavior of cutting in micro cutting area is different from that of traditional cutting because of the size effect. Copper is widely used as optical parts such as LASER reflector's mirror and multimedia instrument. In experimental, after oxygen-free copper is machined by ultra precision machine with natural mono crystal diamond tool (NCD) and synthetic poly crystal diamond tool (PCD), we compared chip formation and tool's wear according to used tool. Also, we researched optimized cutting condition with the results measured according to cutting condition such as spindle speed, feed rate and depth of cut. As a result, the optimal working condition that makes good surface roughness is obtained. The surface roughness is good when spindle speed is above 80 m/min, and feed rate is small and depth of cut is above 0.5 ${\mu}{\textrm}{m}$. In cutting of klystron anode and cavity 3.2 nmRa of surface roughness is obtained.

• Bulletin of the Korean Chemical Society
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• v.31 no.8
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• pp.2247-2254
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• 2010

The surface structures of copper phthalocyanine (CuPc) thin films deposited on sulphur-passivated and plane perylene-3,4,9,10-tetracarboxylic dianhydride (PTCDA)-covered InAs(100) surfaces have been studied by low energy electron diffraction (LEED) and van der Waals (vdW) intermolecular interaction energy calculations. The annealing to $300^{\circ}C$ and $450^{\circ}C$ of $(NH_4)_2S_x$-treated InAs(100) substrates produces a ($1{\times}1$) and ($2{\times}1$) S-passivated surface respectively. The CuPc deposition onto the PTCDA-covered InAs(100) surface leads to a ring-like diffraction pattern, indicating that the 2D ordered overlayer exists and the structure is dominantly determined by the intermolecular interactions rather than substrate-molecule interactions. However, no ordered LEED patterns were observed for the CuPc on S-passivated InAs(100) surface. The intermolecular interaction energy calculations have been carried out to rationalise this structural difference. In the case of CuPc unit cells on PTCDA layer, the planar layered CuPc structure is more stable than the $\alpha$-herringbone structure, consistent with the experimental LEED results. For CuPc unit cells on a S-($1{\times}1$) layer, however, the $\alpha$-herringbone structure is more stable than the planar layered structure, consistent with the absence of diffraction pattern. The results show that the lattice structure during the initial stages of thin film growth is influenced strongly by the intermolecular interactions at the interface.

• Journal of the Korean Society for Nondestructive Testing
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• v.19 no.5
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• pp.340-346
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• 1999

Minimum reflection and backward radiation methods on liquid/solid interrace were used to determine the velocity dispersion relation of acoustical surface wave for brass and aluminum substrates and copper/stainless steel nickel/brass, and nickel/aluminum layered substrates. Dispersion data agreed to dispersion characteristics of a generalized Lamb wave. The difference between velocities determined by two phenomena was closely related to the dispersion characteristics. This correspondence was explained by considering the generation mechanism of surface waves and the concept of group velocity.