• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1996.03a
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• pp.73-80
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• 1996

Commerical purity aluminium , copper and STS 304 stainless steel sheets are welded by ultrasonic welding. The microstructures, x-ray diffraction profiles of planes , pole figures of the surface of original metal sheets are compared with those of the weld interface. The microstructures show disturbance and dark areas in the weld interface and grain refinement in the vicinity of the interface. The x-ray diffraction intensity of each plane in weld interface decreased in all metal sheets with exception of 9200) in steel sheet. The microstructure and x-ray diffraction intensity is affected by the mixture of deformation, heating and vibratin duringthe ultrasonic welding. Therefore, after the ultrasonic welding, the positions of the peak intensity in the pole figures are changed, the value of the maximum pole intensity is decreased in Al, is increased in copper and stainless steel. Very strong {100} <001> texture, strong {100} <001>,{123}<634> textures in original Al surface are transformed into weak, {100}<001>, {110}<112> and {112}<111> components in weld surface, weak (110) fiber is slightly changed to (110) fiber in copper, (100)and ${\gamma}$ fiber components are transformed into strong ${\gamma}$ fiber component in stainless steel.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.2067_2068
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, $Cu_6Sn_5({\mu})$ and $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface. $Cu_6Sn_5({\mu})$ intermetallics layer gradually changed $Cu_3Sn({\varepsilon})$. Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1540-1542
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• 2001

In this paper, the amount of additives in the electrode were investigated the relation of the mechanical properties and surface luminance of copper foil. Especially, organic compound of PEG(Poly-ethylene Glycol) was added from 1 to 20ppm for the propose of increasing the mechanical property and the surface state. The surface luminance of copper foil is appealed 69.25 at 2ppm-15A/$dm^2$ and 68.25 at 2ppm-10A/$dm^2$. It guess that 10ppm-10A/$dm^2$ occurred pin-hole. Tensile strength was not showed the significant difference but elongation appealed the most value at 5ppm-15A. We earned that the most PEG value of mechanical properties is 5 PPM.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.8
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• pp.1559-1565
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, Cu6Sn5(${\mu}$) and Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface. Cu6Sn5(${\mu}$) intermetallics layer gradually changed Cu3Sn(${\varepsilon}$). Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

• Journal of Technologic Dentistry
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• v.31 no.4
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• pp.9-15
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• 2009

The purpose of this study was to observe the change of mechanical property and microstructure in porcelain fused to gold alloy by heat treatment. PFG alloys are composed with Au-Pd-Ag alloy of the additional elements with indium, tin and copper. Specimens were tested in hardness using vicker,s micro-hardness tester and the surface micro structural changes were analysed by SEM and EDS. The results were as fellows: 1. The vickers hardness showed highest in Au-Pd-Ag alloy of the additional element with tin. 2. By hardening-oxiding result, the vicker,s hardness increased in additional element with tin but there was no significant difference in additional elements with indium and copper. 3. The surface oxide layer of Au-Pd-Ag alloy with added indium and tin increased but there was small change in additional element with copper. 4. The elements of indium and tin increased with increasing heat treatment in the surface alloy.

• Composites Research
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• v.25 no.5
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• pp.159-163
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• 2012

The coating of metal surface with carbon nanotubes(CNTs) has been studied for the heat transfer enhancement of the boiling and condensation of refrigerant. The multiwalled carbon nanotube/copper oxide(CuO) composite powder, which has been surface modified by dispersant and polyvinyl alcohol solution, was ultrasonically sprayed and sintered on a copper wafer. In this paper, experiments were performed to assess the characterization and comparison of the carbon nanotube before and after sinterning and the morphology changes of the CNT/CuO-coated surface by using different dispersants. The dispersants used are THF (Tetrahydrofuran), SDBS(Dodecylbenzenesulfonic acid sodium salt), SDS(Sodium dodecy sulfate). The samples were examined by scanning electron microscopy(SEM), thermogravimetric analysis(TGA), differential scanning calorimeter(DSC) and Raman spectroscopy.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.123.1-123.1
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• 2017

Hybrid solar cells have intensively studied in recent years due to their advantages such as cost effectiveness and possibility of applications in flexible and transparent devices. It is critical to fabricate individual layer composed of organic and inorganic materials in the hybrid solar cell at low cost. Therefore, it is required to manufacture cheaply and enhance the photon-to-electricity conversion efficiency of each layer in the flexible solar cell industry. In this research, we fabricated pure Cu metal mesh electrode prepared by using electroplating and/or electroless plating on the Ni mold which was manufacture through photolithography, electroforming, and polishing process. Copper mesh was formed on the surface of nickel metal working master when pulsed electrolytic copper deposition were performed at various plating parameters such as plating time, current density, and so on. After electrodeposition at 2ASD for 5~30seconds, the line/pitch/thickness of copper mesh sheet was $1.8{\sim}2.0/298/0.5{\mu}m$.

• Journal of Surface Science and Engineering
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• v.19 no.3
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• pp.92-108
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• 1986

An electroplating on the lead frame fabricated from domestic copper plate was studied experimentally. In this study, nickel was plated on the thin copper lead frame and silver layer was coated on the nickel film in the cyanide electrolyte. The effect of process variables such as current density, plating time, coating thickness and flow rate of electrolytic solution on the properties of coating was investigated. Some samples on each step were fabricated during electroplating. The results obtained from polarization measurement, observation of SEM photograph, adhesion test of coating and microhardness test are as follows. On silver plating, polarization resistance of potentiostatic cathodic polarization curve is reduced as the flow rate of Ag electrolytic solution increases. And above resistance is also reduced when the minor chemicals of sodium cyanide and sodium carbonate are added in potassium silver cyanide bath. The reduced polarization resistance makes silver deposition on the cathode easy. An increase in the current density and the coating thickness causes the particle size of deposit to coarsen, and consequently the Knoop microhardness of the coating decreases. On selective plating an increase in the flow rate of plating solution lead to do high speed plating with high current density. In this case, the surface morphology of deposit is of fine microstructure with high Knoop hardness. An increasing trend of the adhesion of coating was shown with increasing the current density and flow rate of electrolytic solution.

• Journal of Surface Science and Engineering
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• v.56 no.1
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• pp.40-54
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• 2023

In this work, we synthesized a novel electrochemical sensing materials based on tetracarboxylic copper phthalocyanine (TcCuPtc) conjugated PANI (TcCuPtc@PANI). The synthesized materials were employed to modify the screen-printed carbon electrode (SPCE) for the selective sensing of 4-nitrophenol. The TcCuPtc was conjugated with conducting polymer of PANI through the electrostatic interaction and π-π electron conjugation, the polymer film of PANI to inhibit the leakage of TcCuPtc from the surface of the electrode. The prepared TcCuPtc@PANI were characterized and confirmed by scanning electron microscopy (SEM) with EDX, ATR-IR, UV-vis absorption spectroscopy, cyclic voltammetry, and differential pulse voltammetry techniques. The prepared TcCuPtc@PANI/SPCE showed an excellent electrocatalytic sensing of 4-NP in the linear concentrations from 3 to 500 nM with a LOD of 0.03 nM and a sensitivity of 8.8294 ㎂/nM cm^-2. However, the prepared TcCuPtc@PANI/SPCE showed selective sensing of 4-NP in the presence of other interfering species. The practical applicability of the TcCuPtc@PANI/SPCE was employed for the sensing of 4-NP in different water samples by standard addition method and showed satisfactory recovery results.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2002.05a
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• pp.29-30
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• 2002