• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.526-530
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• 2004

We report the space charge and the surface potential of the interface between metal and CuPc according to isotropic property and different metal by measuring the microwave reflection coefficients $S_{11}$ of copper(II)-phthalocyanine(CuPc) thin films by using a near-field microwave microscope(NSMM) in order to understand. CuPc thin films were prepared on gold and aluminium substrates using a thermal evaporation method. Two kinds of CuPc thin films were prepared. One was deposited on preheated substrate at $150^{\circ}C$ and the other was annealed after deposition by using thermal evaporation methods. The microwave reflection coefficients $S_{11}$ of CuPc thin films were changed by the dependence on the heat treatment conditions. By comparing reflection coefficient $S_{11}$ we measured electrical conductivity of CuPc thin films and studied this results with respect to the surface potential and space charge of the interface between metal and CuPc thin films.

• Corrosion Science and Technology
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• v.15 no.6
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• pp.311-313
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• 2016

The anodic dissolution behavior of copper and brass in an electrolyte solution of 0.5M NaCl containing 0.5 mM $NaHCO_3$ was investigated by electrochemical impedance spectroscopy. The Nyquist plots of the copper impedance described a small loop in the high-frequency range and a large locus in the low-frequency range. Additionally, the features of the impedance spectrum of the brass were similar to those of the copper. This indicates that the copper-enriched layer formed on the brass surface due to the selective dissolution of the zinc from the surface. In addition, the rest potential and the anodic polarization curve for each sample were measured in order to discuss the selective dissolution of the zinc from the brass surface.

• Journal of the Korean Wood Science and Technology
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• v.47 no.6
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• pp.667-673
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• 2019

The performance of a wooden deck made of refractory materials that have difficulties in achieving target penetrations as stipulated in the specification and quality standards for treated wood in Korea, was assessed via a case study in this research. A wooden deck built in Jinju in 2009 was selected for this study because of its fabrication method using pressure and treated refractory materials. The penetration and retention analysis did not satisfy the domestic standard for treated wood. Inspection of the deck in 2019 revealed that the deck had been attacked by decay fungi. Cap rails showed much deeper and wider checking on their surface compared with the top and base rails, resulting in a severe fungal attack. The decking boards exhibited severe fungal decay primarily in the end parts. However, the rails and balusters without checks and posts were virtually free of fungal attack irrespective of the preservative penetration measures. Copper content in the soil 5 cm away from the deck was less than 150 mg/kg, implying that copper movement in the soil was very limited. These results suggest that the inhibition of surface propagation and the protection of end surfaces are essential factors in increasing the longevity of treated wooden decks; further, the results also showed that the deck was within an acceptable range from the point of copper contamination.

• Journal of the Korean Vacuum Society
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• v.13 no.2
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• pp.72-78
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• 2004

Cu seed layers deposited by magnetron sputtering onto tantalum nitride barrier films were treated with ECR plasma and then the copper films were electroplated and rapid thermal annealed in an argon or nitrogen atmosphere at various temperatures ranging from 200 to $500^{\circ}C$. Changes in the microstructure and physical properties of the copper films electroplated on the hydrogen ECR plasma cleaned copper seed layers were investigated using X-ray diffraction (XRD), electron back-scattered diffraction (EBSD), and atomic force microscopy (AFM) analyses. It was found that the copper film undergoes complete recrystallization during annealing at a temperature higher than $400^{\circ}C$. The resistivity of the Cu film tends to decrease and the degree of (111) preferred orientation tends to increase as the annealing temperature increases. Theoptimum annealing condition for obtaining the film with the lowest resistivity, the smoothest surface and the highest degree of the (111) preferred orientation is rapid thermal annealing in a nitrogen atmosphere at $400^{\circ}C$ for 120 s. The resistivity and the surface roughness of the electroplated copper film annealed under this condition are 1.98 $\mu$O-cm and 17.77 nm, respectively.

• Korean Journal of Metals and Materials
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• v.48 no.10
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• pp.951-956
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• 2010

This study examined the effect of copper and sulfuric acid concentrations on the surface morphology and physical properties of copper plated on a polyimide (PI) film. Electrochemical experiments with SEM and a four-point probe were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the composition of an electrolyte. The resistivity and peel strength were controlled using a range of electrolyte compositions. A lower resistivity and high flexibility were obtained when an electrolyte with 20 g/l of copper was used. However, a uniform surface was obtained when a high current density that exceeded $20mA/cm^2$ was applied, which was maintained at copper concentrations exceeding 40 g/l. Increasing sulfuric acid to >150 g/l decreased the peel strength and flexibility. The lowest resistivity and fine adhesion were detected at a $Cu^{2+}:H_2SO_4$ ratio of 50:100 g/l.

• Tribology and Lubricants
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• v.39 no.6
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• pp.256-261
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• 2023

This study is conducted to evaluate the durability of superhydrophobic surfaces, with a focus on two aspects: contact angle measurement and self-cleaning-performance analysis. Superhydrophobic copper and aluminum surfaces are fabricated using the immersion method and subjected to a rolling wear test, in which a 2 kg weight is placed on a rolling tester, under loaded conditions. To evaluate their durability, the contact angles of the specimens are measured for each cycle. In addition, the surface deformation of the specimens before and after the test is analyzed through SEM imaging and EDS mapping. The degradation of the self-cleaning performance is evaluated before and after the wear test. The results show that superhydrophobic aluminum is approximately 4.5 times more durable than superhydrophobic copper; the copper and aluminum specimens could endure 21,000 and 4,300 cycles of wear, respectively. The results of the self-cleaning test demonstrate that superhydrophobic aluminum is superior to superhydrophobic copper. After the wear test, the self-cleaning rates of the copper and aluminum specimens decrease to 72.7% and 83.4%, respectively. The relatively minor decrease in the self-cleaning rate of the aluminum specimen, despite the large number of wear cycles, confirms that the superhydrophobic aluminum specimen is more durable than its copper counterpart. This study is expected to aid in evaluating the durability of superhydrophobic surfaces in the future owing to the advantage of performing wear tests on superhydrophobic surfaces without damaging the surface coating.

• Laser Solutions
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• v.16 no.2
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• pp.7-11
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• 2013

Recently advanced laser processing is widely introduced to improve the efficiency of micro part production and to reduce the rate of inferior goods. In this paper the trend of delamination of single layer with both thin copper and polyimide according to the variation of copper thickness was investigated using the coupled thermal-structural analysis of ANSYS. From these analyses results, some conclusions were obtained. Firstly, the maximum temperature was increasing with respect to decrease of copper thickness. Secondly the maximum strain which was in general estimation the main effect of the delamination was observed in case of the copper thickness of $5{\mu}m$. Finally the trend of the delamination was decreasing with increasing the thickness of copper layer.

• Proceedings of the KWS Conference
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• 1996.05a
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• pp.6-9
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• 1996

The Joining of copper rod and zirconia tube was carried out in Ar gas atmosphere. There are two type of the joining. The one is the reaction bond consisting of Cu and zirconia was dominated by surface reaction wi th a undetctable very thin layer. It was found that copper elements were diffused to zirconia side, but that most of Z $r^{4+}$ ions were not diffused to copper side. This result means application of a DC voltage to migrate oxygen to the copper/zirconia interface can oxidize metal at the copper /zirconia interface, and the bonding reaction between zirconia and copper oxide may occur. The other is the reaction bonding was dominated by interdiffusion with a very thick interface layer. This result means application of a DC voltage can reduce zirconia at the interface. The bonding reaction is to be an alloying between Zr and Cr.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.922-925
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• 2002

Klystron which is micro wave amplifier tube are mainly used in fields of science such as accelerator, nuclear fusion, broadcasting, communication fields, and defense industry fields, tract. The quality of Klystron anode and cavity are determined by form accuracy and roughness of the worked surface. Therefore anode and cavity are restricted the from accuracy strictly and the surface roughness be under Rmax 0.03S. As a work material of anode and cavity, the oxygen-free copper, that is used for optical pares of aerospace and laser mirror is selected. An outside diameter of material is $\Phi$100 mm and an inside diameter is $\Phi$30~33 mm. In this study, to find the optimum ultra precision cuffing condition of oxygen-free copper with diamond turning machine, the surface roughness is examined for various diamond toot nose radius, main spindle speed, fred rate and depth of cut. As a result of experiment, we could machined the anode and cavity with a surface roughness within Ra 3.2 nm, a form accuracy within 0.01 $\mu\textrm{m}$.

• Carbon letters
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• v.1 no.3_4
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• pp.170-177
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• 2001

Lithium intercalated carbon (LIC) are basically employed as an anode for currently commercialized lithium secondary batteries. However, there are still strong interests in modifying carbon surface of active materials of the anode because the amount of irreversible capacity, charge-discharge capacity and high rate capability are largely determined by the surface conditions of the carbon. In this study, the carbonaceous materials were coated with tin oxide and copper by fluidized-bed chemical vapor deposition (CVD) method and their coating effects on electrochemical characteristics were investigated. The electrode which coated with tin oxides gave the higher capacity than that of raw material. Their capacity decreased with the progress of cycling possibly due to severe volume changes. However, the cyclability was improved by coating with copper on the surface of the tin oxides coated carbonaceous materials, which plays an important role as an inactive matrix buffering volume changes. An impedance on passivation film was decreased as tin oxides contents and it resulted in the higher capacity.