• Journal of the Korean Wood Science and Technology
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• 제18권1호
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• pp.24-30
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• 1990

This study was attempted to propose a method evaluating fixation of active ingredients in Copper-Chromium-Arsenic preservatives treatment. Fixated amount of active ingredients on wood was obtained by measuring the density of surface electric charge based on $\varsigma$ potential. Data accumulated from density of surface electric charge showed that the fixated amount of preservatives on wood increased linearly as concentration of treating solution increaced, which indicatied quantitative reactions in fixation of preservatives.

• 한국결정성장학회지
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• 제8권1호
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• pp.131-137
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• 1998

구리입자를 코딩한 분말 합성은 Kelex 100 solvent extraction으로부터 silica powder에 수소압력 stripping copper에 의하여 생성하였다. Solvent extraction의 범위내인 일정한 조건에서 loading level과 stripping rate등을 재생하였으며 stripping copper kinetics는 divalent상태에서 metallic 상태로 감소하면서 silica 입자에 침적하였다. Copper들은 seed 입자에 heterogeneous 핵을 형성하면서 이들은 agglomeration 상태로 생성되었고 불균일한 분말로 형성하였다.

• International Journal of Precision Engineering and Manufacturing
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• 제9권4호
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• pp.57-62
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• 2008

The aim of this investigation was to extract the fatigue properties at the designated fatigue life of copper foil and observe the mean stress and stress amplitude effects on both the fatigue life and the corresponding surface morphology. Tensile tests were performed to determine the baseline monotonic material properties of the proportional limit and ultimate tensile strength. Constant amplitude fatigue tests were carried out using a feedback-controlled fatigue testing machine. The mean stress and the stress amplitude were changed to obtain the complete nominal stress-life curves. An atomic force microscope was utilized to observe the relationship between the fatigue damage and the corresponding changes in surface morphology. A Basquin's exponent of-0.071 was obtained through the fatigue tests. An endurance limit of 122 MPa was inferred from a Haigh diagram. The specimen surface became rougher as the number of fatigue cycles increased, and there was a close relationship between the fatigue damage and the surface roughness evolution.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1535-1537
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• 1999

Photochemical defluorination and substitution of fluorocarbon-resin surfaces using a pulsed Nd:YAG laser(266 nm) and copper-sulfate$(CuSO_4)$ aqueous solution were discussed. Interface of copper nuclei and fluorocabon-resin was chemically bonded through oxygen which was photodissociated from water in copper-sulfate aqueous solution under the laser irradiation. The reaction mechanism for chemical surface modification is discussed on the basis of x-ray photoelectron spectroscopy and atomic force microscope analyses.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2001년도 봄 학술발표회 논문집
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• pp.243-248
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• 2001

The objective of this study is to investigate the thermal conductivity of cement mortar for apartment housing floor using expansive admixture, copper fiber, cower lathe, hollowed aluminum plate. According to test results, temperature at point (a) located above heating pipe does not show significant variation with age, and temperature at (b), which is located at the finishing surface above heating pipe, and temperature at (c), which is located at center surface between heating pipe has remarkable change. Temperature distribution sat (b) are in order for, structure containing copper fiber>plain structure>structure containing hollowed aluminum plate>structure containing expansive admixture. Temperature distribution, shows high tendency in order for, structure containing copper fiber>structure containing copper lathe>structure containing hollowed aluminum plate>plain structure>structure containing expansive admixture. (a) estimation of temperature distribution is determined with the variation of temperature between (b) point and (c) point during 60 minutes heating.

• 한국결정성장학회지
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• 제14권2호
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• pp.58-62
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• 2004

The shape evolution of the interface void of copper metallization for intergrated circuits under electromigration stress is modeled. A 2-dimensional finite-difference numerical method is employed for computing time evolution of the void shape driven by surface diffusion, and the electrostatic problem is solved by boundary element method. When the diffusion coefficient is isotropic, the numerical results agree well with the known case of wedge-shape void evolution. The numerical results for the anisotropic diffusion coefficient show that the initially circular void evolves to become a fatal slitlike shape when the electron wind force is large, while the shape becomes non-fatal and circular as the electron wind force decreases. The results indicate that the open circuit failure caused by slit-like void shape is far less probable to be observed for copper metallization under a normal electromigration stress condition.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.176.1-176.1
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• 2014

Graphene has attracted an increasing attention due to its extraordinary electronic, mechanical, and thermal properties. Especially, the two dimensional (2D) sheet of graphene with an extremely high surface to volume ratio has a great potential in the preparation of multifunctional nanomaterials, as 2D supports to host metal nanoparticles (NPs). Copper oxide is widely used in various areas as antifouling paint, p-type semiconductor, dry cell batteries, and catalysts. Although the copper oxide(II) has been well known for efficient catalyst in C-N cross-coupling reaction, copper oxide(I) has not been highlighted. In this research, CuO and Cu2O nanoparticles (NPs) dispersed on the surface of grapehene oxide (GO) have been synthesized by impregnation method and their morphological and electronic structures have been systemically investigated using TEM, XRD, and XAFS. We demonstrate that both CuO and Cu2O on graphene presents efficient catalytic performance toward C-N cross coupling reaction. The detailed structural difference between CuO and Cu2O NPs and their effect on catalytic performance are discussed.

• 한국표면공학회지
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• 제46권4호
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• pp.158-161
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• 2013

Recently, the weight reduction and miniaturization of the electronics have placed great emphasis. The miniaturization of PCB (Printed Circuit Board) as main component among the electronic components has also become progressed. The use of acid copper plating process for Via-Filling effectively forms interlayer connection in build-up PCBs with high-density interconnections. However, in the case of copper-via filled in a bath, which is greatly dependent on the effects of additives. This paper discusses effects of Cl ion on the filling of PCB vias with electrodeposited copper based on both electrochemical experiment and practical observation of cross sections of vias.

• 한국표면공학회지
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• 제24권3호
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• pp.125-136
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• 1991

a mathematical model is presented to describe the current distribution on a rotaing disk electrode under the galvanostatic pulse conlitions. A numerical technique by finite difference method to the transient convective diffusion equation, coordinate transformation and separation of variables to Laplace equation, and an iterative algorithm to solve the above equations simtltaneously with approximate boundary conditions were developed. An experimental investigated based on copper deposition in a copper sulfate-sulfuric acid system was performed and satisfactory agreement was obtained between expermental and theoretical current distribution. The current distribution of copper deposition is secondary current distribution within the experimental conditions. Dimensionless variables, N and J as well as Wagner number were used to determine the criteria for the uniformity of current distribution.

• 한국환경보건학회지
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• 제30권2호
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• pp.115-122
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• 2004

A glassy carbon electrode(GCE) modified with nafion-DTPA (diethylene triamine-pentaacetic acid)-glycerol is used for the highly selective and sensitive determination of a trace amount of Cu(II). Various experimental parameters, which influenced the response of nafion-DTPA-glycerol modified electrode to Cu(II), are optimized. The Copper(II) is accumulated on the electrode surface by the formation of the complex in an open circuit, and the resulting surface is characterized by medium exchange, electrochemical reduction, and differential pulse voltammetry(DPV). The electrochemical response is evaluated with respect to concentration of modifier, pH and preconcentration time, quiet time, copper(II) concentration, and other variables. A linear range is obtained in the concentration range 1.0${\times}$10$^{-8}$ M-1.0${\times}$10$^{-6}$ MCu(II) with 7 min preconcentration time. The detection limit(3s) is as low as 2.36${\times}$10$^{-8}$ M (1.50 ppb).