• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.377-378
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• 2006

Thermal management technology is a critical element in all new chip generations, caused by a power multiplication combined with a size reduction. A heat sink, mounted on a base plate, requires the use of special materials possessing both high thermal conductivity (TC) and a coefficient of thermal expansion (CTE) that matches semiconductor materials as well as certain packaging ceramics. In this study, nano tungsten coated copper powder has been developed with a wide range of compositions, 90W-10Cu to 10W-90Cu. Powder technologies were used to make samples to evaluate density, TC, and CTE. Measured TC lies among theoretical values predicted by several existing models.

• 한국분말재료학회지
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• 제21권5호
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• pp.343-348
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• 2014

A powder-in-sheath rolling (PSR) process utilizing a copper alloy tube was applied to a fabrication of a multi-walled carbon nanotube (CNT) reinforced aluminum matrix composite. A copper tube with an outer diameter of 30 mm and a wall thickness of 2 mm was used as a sheath material. A mixture of pure aluminum powders and CNTs with the volume contents of 1, 3, 5 vol% was filled in the tube by tap filling and then processed to 93.3% height reduction by a rolling mill. The relative density of the CNT/Al composite fabricated by the PSR decreased slightly with increasing of CNTs content, but showed high value more than 98%. The average hardness of the 5%CNT/Al composite increased more than 3 times, compared to that of unreinforced pure Al powder compaction. The hardness of the CNT/Al composites was some higher than that of the composites fabricated by PSR using SUS304 tube. Therefore, it is concluded that the type of tube affects largely on the mechanical properties of the CNT/Al composites in the PSR process.

• 한국재료학회지
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• 제30권3호
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• pp.149-154
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• 2020

A powder-in-sheath rolling method is applied to the fabrication of a carbon nano tube (CNT) reinforced copper composite. A copper tube with outer diameter of 30 mm and wall thickness of 2 mm is used as sheath material. A mixture of pure copper powder and CNTs with a volume content of 3 % is filled in a tube by tap filling and then processed to an 93.3 % reduction using multi-pass rolling after heating for 0.5 h at 400 ℃. The specimen is then sintered for 1h at 500 ℃. The relative density of the 3 vol%CNT/Cu composite fabricated using powder in sheath rolling is 98 %, while that of the Cu powder compact is 99 %. The microstructure is somewhat heterogeneous in width direction in the composite, but is relatively homogeneous in the Cu powder compact. The hardness distribution is also ununiform in the width direction for the composite. The average hardness of the composites is higher by 8Hv than that of Cu powder compact. The tensile strength of the composite is 280 MPa, which is 20 MPa higher than that of the Cu powder compact. It is concluded that the powder in sheath rolling method is an effective process for fabrication of sound CNT reinforced Cu matrix composites.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2002년도 춘계학술강연 및 발표대회
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• pp.63-63
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• 2002

• 한국분말재료학회지
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• 제20권6호
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• pp.411-424
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• 2013

In this study, the synthesis of nickel nanoparticles and copper nanospheres for the potential applications of MLCC electrode materials has been studied by plasma arc evaporation method. The change in the broad distribution of the size of nickel and copper nanopowders is successfully controlled by manifesting proper mixture of gas ambiance for plasma generation in the size range of 20 to 200 nm in diameter. The factors affecting the mean diameter of the nanopowder was studied by changing the composition of reactive gases, indicating that nitrogen enhances the formation of larger particles compared to hydrogen gas. The morphologies and particle sizes of the metal nanoparticles were observed by SEM, and ultrathin oxide layers on the powder surface generated during passivation step have been confirmed using TEM. The metallic FCC structure of the nanoparticles was confirmed using powder X-ray diffraction method.

• 한국분말재료학회지
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• 제22권4호
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• pp.247-253
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• 2015

The sintering mechanisms of nanoscale copper powders have been investigated. A molecular dynamics (MD) simulation with the embedded-atom method (EAM) was employed for these simulations. The dimensional changes for initial-stage sintering such as characteristic lengths, neck growth, and neck angle were calculated to understand the densification behavior of copper nano-powders. Factors affecting sintering such as the temperature, powder size, and crystalline misalignment between adjacent powders have also been studied. These results could provide information of setting the processing cycles and material designs applicable to nano-powders. In addition, it is expected that MD simulation will be a foundation for the multi-scale modeling in sintering process.

• 한국분말재료학회지
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• 제13권5호
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• pp.321-326
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• 2006

Electronic packaging involves interconnecting, powering, protecting, and cooling of semiconductor circuits fur the use in a variety of microelectronic applications. For microelectronic circuits, the main type of failure is thermal fatigue, owing to the different thermal expansion coefficients of semiconductor chips and packaging materials. Therefore, the search for matched coefficients of thermal expansion (CTE) of packaging materials in combination with a high thermal conductivity is the main task for developments of heat sink materials electronics, and good mechanical properties are also required. The aim of this work is to develop copper matrix composites reinforced with carbon nanofibers. The advantages of carbon nanofibers, especially the good thermal conductivity, are utlized to obtain a composite material having a thermal conductivity higher than 400 W/mK. The main challenge is to obtain a homogeneous dispersion of carbon nanofibers in copper. In this paper, a technology for obtaining a homogeneous mixture of copper and nanofibers will be presented and the microstructure and properties of consolidated samples will be discussed. In order to improve the bonding strength between copper and nanofibers, different alloying elements were added. The microstructure and the properties will be presented and the influence of interface modification will be discussed.

• Journal of Welding and Joining
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• 제15권4호
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• pp.109-115
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• 1997

Laser cladding is a technique for modification of metal surface. In this laser cladding experiment a metal powder feeding system was developed for more efficient laser cladding. This system can reduce processing time and be used simpler than the conventional method. The feeding of metal powder has given a rise to the process for sequential buildup of bulk rapidly solidified materials in the form of fine powder stream to the laser cladding process. The parameters of laser cladding have been investigated using this experimental equipment. Bronze on aluminum alloy and copper on aluminum alloy were experimented by using defocused beam, powder feeding system, and gas shielding. Good cladding was achieved in the range of beam travel speed of 2.25m/min. In the case of copper/aluminum and bronze/aluminum substrate, the absorption of laser beam was too high to produce low diluted clad. In the case of copper/1050 aluminum, the optimal laser cladding condition was of laser power of 2.8kW, powder feed rate of 0.31g/s and beam travel speed of 2.25m/min. In the case of bronze/aluminum the optimal condition is of laser power of 2.5kW, powder feed rate of 0.31g/s, and beam travel speed of 2.36m/min.

• 동력기계공학회지
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• 제9권4호
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• pp.124-129
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• 2005

Copper oxide, CuO, are very important components include of high temperature super- conductors, and widely used. The properties of sintered materials were affected by the size and shape of copper oxide with starting materials in the solid-phase reaction. A homogeneous and fine CuO powder was prepared by thermal decomposition of the copper oxalate precursor. Copper oxalate was precipitated by the addition of copper nitrate solution to an oxalic acid solution. The influence of various factors such as temperature, pH, concentration as well as ultrasonic irradiation in the solution were investigated.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.922-923
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• 2006

Thermal management is one of the critical aspects in the design of highly integrated microelectronic devices. The reliability of electronic components is limited not only to operating temperature but also by the thermal stresses caused during the operation. The need for higher power densities calls for use of advanced heat spreader materials. A copper diamond composite has been developed with high thermal conductivity $(\lambda)$ and tailorable coefficient of thermal expansion (CTE). Copper diamond composites are processed via gas pressure assisted infiltration with different copper alloys. Emphasis has been placed on the addition of trace elements in deisgning the copper alloys to facilitate a compromise between thermal conductivity and mechanical adhesion. The interfaces between the alloy and the diamond are related to the thermal properties of these copper composites.