• Title/Summary/Keyword: Copper plating thickness uniformization

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In Situ Sensing of Copper-plating Thickness Using OPD-regulated Optical Fourier-domain Reflectometry

  • Nayoung, Kim;Do Won, Kim;Nam Su, Park;Gyeong Hun, Kim;Yang Do, Kim;Chang-Seok, Kim
    • Current Optics and Photonics
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    • v.7 no.1
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    • pp.38-46
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    • 2023
  • Optical Fourier-domain reflectometry (OFDR) sensors have been widely used to measure distances with high resolution and speed in a noncontact state. In the electroplating process of a printed circuit board, it is critically important to monitor the copper-plating thickness, as small deviations can lead to defects, such as an open or short circuit. In this paper we employ a phase-based OFDR sensor for in situ relative distance sensing of a sample with nanometer-scale resolution, during electroplating. We also develop an optical-path difference (OPD)-regulated sensing probe that can maintain a preset distance from the sample. This function can markedly facilitate practical measurements in two aspects: Optimal distance setting for high signal-to-noise ratio OFDR sensing, and protection of a fragile probe tip via vertical evasion movement. In a sample with a centimeter-scale structure, a conventional OFDR sensor will probably either bump into the sample or practically out of the detection range of the sensing probe. To address this limitation, a novel OPD-regulated OFDR system is designed by combining the OFDR sensing probe and linear piezo motors with feedback-loop control. By using multiple OFDR sensors, it is possible to effectively monitor copper-plating thickness in situ and uniformize it at various positions.