• 접착 및 계면
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• 제4권3호
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• pp.1-8
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• 2003

철판에 도금한 아연을 구리이온으로 치환하는 치환도금법과 철판에 직접 구리를 증착하는 진공증착법으로 두께가 다른 구리박막 피복철판을 제조하여 배합고무와 접착성질을 조사하였다. 구리박막 피복철판과 배합고무의 접착세기는 제조방법에 관계없이 구리박막 두께에 따라 결정되었다. 구리박막이 75 nm보다 얇으면 안정한 접착층이 형성되어 황동판에 못지 않게 고무와 강하게 접착되었으나, 90 nm보다 두터우면 구리황화물이 지나치게 성정하여 접착세기가 약하였다.

• 한국환경과학회지
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• 제8권6호
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• pp.705-710
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• 1999

The fundamental experiments on the phosphorus removal from water were carried out by the batch and continuous reactors which used aluminium and copper plate. In this systems, the phosphorus was removed by aluminium ion generated with the electrochemical interaction (pitting corrosion) of aluminium and copper. In the batch experiments, the efficiencies of phosphorus removal increased when the surfaces of aluminium and copper plate were brushed. The phosphorus removal by aluminium ion was affected the copper plate and NaCI in this system. The optimal pH values were 5 and 6 for the phosphorus removal. The efficiency of phosphorus removal increased with increasing NaCI concentration, surface area of aluminium and copper plate. The $CUSO_4{\cdot}5H_2O$ instead of copper plate could be used as Cu source. The effluent $PO_4-P$ concentration as low as 2 $mg/{\ell}$ could have been obtained during the continuous experiment at HRT of 48 hrs.

• Progress in Superconductivity
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• 제12권2호
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• pp.93-98
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• 2011

Pinning force is the mechanism between a superconductor and a permanent magnet and it provides a stable levitation. However, when external force greater than the pinning force such as the earthquake exerts, the levitated object may lose the levitating characteristic. In order to achieve more stabilized levitation, the copper plate was inserted in between a superconductor and permanent magnets. And by applying the eddy current effect caused from the relationship between a copper plate and permanent magnets, more stabilized levitation can be established. In this study, an optimized design was found based on various configurations of permanent magnet's polarity, thickness and area of copper plate, and the gap distance between copper plate and permanent magnet. As results, higher eddy current value was obtained at where the change of polarity exists in permanent magnet configuration, and the highest eddy current value was observed at the copper plate thickness of 5 mm and the area of 80 mm ${\times}$ 80 mm. From the resulted optimized conditions above, which are 7 mm gap distance between a superconductor and permanent magnets and 80 mm ${\times}$ 80 mm ${\times}$ 5 mm dimension of a copper plate, the stiffness value was 65 % increased comparing to without any copper plate insertion.

• 한국방사선학회논문지
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• 제12권3호
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• pp.335-341
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• 2018

의료수준의 향상과 더불어 환자들의 첨단의료장비에 대한 기대수준이 증가하고 있으며 특히 자기공명영상(Magnetic Resonance Image : MRI)은 현재 모든 임상 분야에서 가장 핵심적인 영상진단 도구로서 사용되고 있다. 그러나 검사 중에 발생하는 심각한 소음으로 많은 환자가 심리적인 불안을 경험한다고 한다. 이에 본 연구에서는 자기공명영상검사실의 기존 헤드셋 흡음재에서 차음재를 추가한 헤드셋의 소음저감평가와 차음재별 영상 아티팩트(artifact) 유무를 알아보고자 하였다. 3D 프린팅한 헤드셋 내부에 흡음재(스펀지)와 차음재(아크릴판, 구리판, 3D copper plate)를 교차 배열하여 MRI 검사소음을 녹음하여 스피커로 같은 dB 값의 소음을 발생시키며 3D 프린팅 된 두부모형의 내부에 소음측정기로 dB 값을 측정하여 정량분석을 하며 자체 제작한 헤드셋을 물팬텀에 밀착시킨 후 MRI영상 아티팩트 유무를 검사한다. 드셋의 정량평가를 한 결과, 헤드셋 평균 dB 값은 81.8 dB로 나타났으며, 차음재를 추가한 헤드셋에서 가장 방음효과가 뛰어난 재료조합(구리, 아크릴판, 스펀지, 스펀지) 헤드셋의 평균 dB 값은 70.4 dB 값이 측정되었지만 MRI 시뮬레이션 결과 구리가 반자성체이기 때문에 아티팩트가 나타나 배제하였고 두 번째로 방음효과가 뛰어난 (스펀지, 아크릴판, e-copper plate, 스펀지) 헤드셋의 평균 dB 값은 70.6 dB 값이 측정되었고 MRI 시뮬레이션 결과 인공물 나타나지 않았다. 구리분말이 약 40%가 포함된 e-copper PLA로 출력한 재료를 동일하게 시뮬레이션을 한 결과 인공물 나타나지 않았으므로 3D 프린팅 재료의 사용이 적합하였고 구리보다 경제성이 우수하며 가공이 용이하므로 적합한 재료로 선정하였다. MRI관련 연구에 있어 3D 프린팅을 이용한 상호발전이 매우 기대된다.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2001년도 봄 학술발표회 논문집
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• pp.243-248
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• 2001

The objective of this study is to investigate the thermal conductivity of cement mortar for apartment housing floor using expansive admixture, copper fiber, cower lathe, hollowed aluminum plate. According to test results, temperature at point (a) located above heating pipe does not show significant variation with age, and temperature at (b), which is located at the finishing surface above heating pipe, and temperature at (c), which is located at center surface between heating pipe has remarkable change. Temperature distribution sat (b) are in order for, structure containing copper fiber>plain structure>structure containing hollowed aluminum plate>structure containing expansive admixture. Temperature distribution, shows high tendency in order for, structure containing copper fiber>structure containing copper lathe>structure containing hollowed aluminum plate>plain structure>structure containing expansive admixture. (a) estimation of temperature distribution is determined with the variation of temperature between (b) point and (c) point during 60 minutes heating.

• 대한기계학회논문집B
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• 제35권3호
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• pp.269-278
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• 2011

본 연구에서는 구리 재질의 평판 핀과 나선형 핀-관 열교환기에 대하여 핀 피치와 열수의 변화에 따른 공기측 전열성능을 검토하였다. 두 형상 모두 핀 피치가 열전달계수에 미치는 영향은 미미하였다. 마찰인자는 핀 피치가 증가하면 증가하였다. 열수가 미치는 영향은 형상에 따라 다르게 나타났다. 평판 핀-관 열교환기의 경우 열전달계수는 열수가 증가할수록 감소하였다. 하지만 나선형 핀-관 열교환기의 열전달 계수는 열수가 증가하면서 그 값이 증가하는 경향을 보였다. 평판 핀-관 열교환기의 열전달계수는 나선형 핀-관 열교환기의 열전달계수보다 높게 나타났다. 하지만 열수가 증가하면 그 차이가 줄어들어 4열이 되면 거의 같았다. 한편 마찰인자는 평판 핀-관 열교환기에서 다소 높게 나타나고 열수의 영향은 크지 않았다. 본 실험 데이터를 기존 상관식의 예측치와 비교하였다.

• 소성∙가공
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• 제27권1호
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• pp.37-47
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• 2018

In this paper, a double spot welding process, utilizing electric resistance heating dies, is suggested for the spot welding of dissimilar metal plates for drawing and concurrent spot welding. This double welding process has two heating methods for the fusion welding at the interfacial zone between steel and aluminum plates, such as heating method by thermal conduction of electric resistance by welding current induced to heating dies, and heating method by electric resistance between contacted surfaces of two plates by welding current induced to copper electrode. This double welding process has welding variables such as each current induced in heating dies and in copper electrode, outer diameters of heating dies, and edge shape of copper electrode. Experiments for current conditions in welding process should be demanded in order to get successful welding strength. It was known that the welding strength could be reached to the value demanded on industry fields under such welding conditions as heating dies of outer ring dia.12mm contacted on steel plate, as heating dies of outer ring dia. 14mm contacted on aluminum plate, and as copper electrode of dia. 6.0mm, and as 3 times continuous heating method by $1^{st}$ current of 11 kA(9cycle), $2^{nd}$ current 11 kA(60cycle), $3^{rd}$ current 7 kA(60cycle) applied in steel heating dies and copper electrodes, flat edge of copper electrode, for double spot welding process of dissimilar metal plates of steel and aluminum of 1.0 mm thickness.

• Corrosion Science and Technology
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• 제16권5호
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• pp.227-234
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• 2017

Reference electrodes are generally implemented for the purpose of monitoring the cathodic protection potentials of buried or immersed metallic structures. In the market, many types of reference electrodes are available for this purpose, such as saturated calomel, silver/silver chloride and copper/copper sulfate. These electrodes contain a porous ceramic junction plate situated in the cylindrical body bottom to permit ionic flux between the internal electrolyte (of the reference electrode) and the external electrolyte. In this work, the copper/copper sulfate reference electrode was modified by replacing the porous ceramic junction plate for a metallic platinum wire. The main purpose of this modification was to avoid the ion copper transport from coming from the inner reference electrode solution into the surrounding electrolyte, and to mitigate the copper plating on the coupon surfaces. Lab tests were performed in order to compare the performance of the two mentioned reference electrodes. We verified that the experimental errors associated with the measurements conducted with developed reference electrode would be negligible, as the platinum surface area exposed to the surrounding electrolyte and/or to the reference electrolyte are maintained as small as possible.

• 한국표면공학회지
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• 제37권1호
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• pp.22-27
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• 2004

Copper electroforming process has been applied to duplicate Koryo Tripitaka (Taejang'kyong), wooden printing block. Thin copper replica printing plates of 1 mm thickness was successfully manufactured from the printing face (54.5${\times}$25.5 cm) of wooden printing plate. Major processes are (1) silicon rubber replication of the master (2) silvering on silicon rubber (3) copper electroforming (4) separation of copper from the silicon mandrel (5) final coloring by brass plating and trimming. This process has various Potential applications in making thin metallic objects such as plaques, statues, bust and hollow metal objects for jewelry.

• 한국식품위생안전성학회지
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• 제35권2호
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• pp.177-182
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• 2020

본 연구에서는 건조 고춧가루의 가공 및 저장라인에서 구리의 이용가능성을 조사하였다. 구리와 스테인리스강 표면과의 접촉을 통한 고춧가루의 색도 변화를 평가한 결과, 55℃에서 2시간 구리 판에 처리한 시료의 명도가 다소 증가하였다. 구리와 스테인리스강 접촉에 의한 고춧가루 내 미생물 저해는 중온성의 호기성 세균보다 곰팡이 및 효모의 저해에 더 효과적이었고, 55℃에서 2시간 구리 접촉에 의해 곰팡이와 효모의 수는 0.64 log 감소하여 유의적인 효과를 나타내었다. 산화방지 활성은 구리와 스테인리스강 접촉 고춧가루의 DPPH 라디칼 소거활성은 감소한 반면 ABTS 라디칼 소거활성은 증가하였다. 본 연구는 구리 또는 구리와 스테인리스강 등의 합금을 이용하여 고춧가루를 포함한 다양한 분말 식품의 가공 및 저장 과정에 활용할 수 있는 가능성을 제시하고 있다.