• Journal of Adhesion and Interface
• /
• v.4 no.3
• /
• pp.1-8
• /
• 2003

Adhesion between rubber compound and copper-film-coated steel plate (abbreviated hereafter as copper film plate) with different thicknesses of copper film was investigated. Two different methods were employed for the preparation of the copper film plates: a substitution plating of preelectroplated zinc with copper ion and a vacuum sputtering of copper on steel plate. Adhesion strength of the copper film plates with rubber compounds was largely dependent upon the thickness of copper film, regardless of their preparation methods. The copper film plates with thinner thickness than 75 nm showed high adhesion comparable to brass, while those with thicker copper film showed poor adhesion due to excessive growth of copper sulfide at adhesion interface.

• Journal of Environmental Science International
• /
• v.8 no.6
• /
• pp.705-710
• /
• 1999

The fundamental experiments on the phosphorus removal from water were carried out by the batch and continuous reactors which used aluminium and copper plate. In this systems, the phosphorus was removed by aluminium ion generated with the electrochemical interaction (pitting corrosion) of aluminium and copper. In the batch experiments, the efficiencies of phosphorus removal increased when the surfaces of aluminium and copper plate were brushed. The phosphorus removal by aluminium ion was affected the copper plate and NaCI in this system. The optimal pH values were 5 and 6 for the phosphorus removal. The efficiency of phosphorus removal increased with increasing NaCI concentration, surface area of aluminium and copper plate. The $CUSO_4{\cdot}5H_2O$ instead of copper plate could be used as Cu source. The effluent $PO_4-P$ concentration as low as 2 $mg/{\ell}$ could have been obtained during the continuous experiment at HRT of 48 hrs.

• Progress in Superconductivity
• /
• v.12 no.2
• /
• pp.93-98
• /
• 2011

Pinning force is the mechanism between a superconductor and a permanent magnet and it provides a stable levitation. However, when external force greater than the pinning force such as the earthquake exerts, the levitated object may lose the levitating characteristic. In order to achieve more stabilized levitation, the copper plate was inserted in between a superconductor and permanent magnets. And by applying the eddy current effect caused from the relationship between a copper plate and permanent magnets, more stabilized levitation can be established. In this study, an optimized design was found based on various configurations of permanent magnet's polarity, thickness and area of copper plate, and the gap distance between copper plate and permanent magnet. As results, higher eddy current value was obtained at where the change of polarity exists in permanent magnet configuration, and the highest eddy current value was observed at the copper plate thickness of 5 mm and the area of 80 mm ${\times}$ 80 mm. From the resulted optimized conditions above, which are 7 mm gap distance between a superconductor and permanent magnets and 80 mm ${\times}$ 80 mm ${\times}$ 5 mm dimension of a copper plate, the stiffness value was 65 % increased comparing to without any copper plate insertion.

• Journal of the Korean Society of Radiology
• /
• v.12 no.3
• /
• pp.335-341
• /
• 2018

With the improvement of medical state, patients' expectations for the most advanced medical equipment are increasing. Particularly, Magnetic Resonance Image (MRI) is used as one of the core image diagnosis methods in all clinical area. However, it has been reported that many of patients who go through the examination suffer from anxiety to the severe noise level during the examination. In this study, both the noise reduction evaluation of headsets with sound-blocking materials added to existing sound-absorbing materials and the existence of sound blocking materials as artifacts on the examination image are tested. An MRI test noise is recorded as a speaker by cross-ordination the sound material (sponge) and the sound material (acrylic plate, copper plate, and 3D copper plate) inside the headset made from 3D pring. A quantitative assessment of headsets showed that the average headset value was 81.8 dB. The average dB value of the most soundproof material combination(Copper, acrylic plate, sponge, sponge) headsets on headsets with added charactering material was measured at 70.4 dB, and MRI showed that the copper was diamagnetic substance and excluded. The second most soundproof headset(Sponge, acrylic plate, 3D copper plate, sponge) was measured at 70.6 dB and MRI showed no artifacts. The same simulation of the material printed with a 3D copper PLA containing approximately 40 % copper powder resulted in no artifacts, therefore, the material output as a 3D printing was better suited for use. For MRI related research, the mutual development of 3D printing is highly anticipated.

• Proceedings of the Korea Concrete Institute Conference
• /
• 2001.05a
• /
• pp.243-248
• /
• 2001

The objective of this study is to investigate the thermal conductivity of cement mortar for apartment housing floor using expansive admixture, copper fiber, cower lathe, hollowed aluminum plate. According to test results, temperature at point (a) located above heating pipe does not show significant variation with age, and temperature at (b), which is located at the finishing surface above heating pipe, and temperature at (c), which is located at center surface between heating pipe has remarkable change. Temperature distribution sat (b) are in order for, structure containing copper fiber>plain structure>structure containing hollowed aluminum plate>structure containing expansive admixture. Temperature distribution, shows high tendency in order for, structure containing copper fiber>structure containing copper lathe>structure containing hollowed aluminum plate>plain structure>structure containing expansive admixture. (a) estimation of temperature distribution is determined with the variation of temperature between (b) point and (c) point during 60 minutes heating.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.35 no.3
• /
• pp.269-278
• /
• 2011

We investigate the heat-transfer and pressure-drop characteristics of fin-and-tube heat exchangers with a copper plate or copper spiral fins. Twenty-four samples with different fin pitches and tube rows were tested. For both configurations, the effect of the fin pitch on the j factor is negligible, and the f factor increases with the fin pitch. The effect of the tube row depends on the configuration. For plate fin-and-tube heat exchangers, the j factor decreases as the row number increases; the reverse is true for spiral exchangers. We explain this by considering the flow pattern. The j factor for plate fin-and-tube heat exchangers is larger than that for spiral exchangers, and the difference decreases as the row number increases. The f factor of the plate fin-and-tube heat exchanger is also larger. We compare our results with existing predictions of correlations.

• Transactions of Materials Processing
• /
• v.27 no.1
• /
• pp.37-47
• /
• 2018

In this paper, a double spot welding process, utilizing electric resistance heating dies, is suggested for the spot welding of dissimilar metal plates for drawing and concurrent spot welding. This double welding process has two heating methods for the fusion welding at the interfacial zone between steel and aluminum plates, such as heating method by thermal conduction of electric resistance by welding current induced to heating dies, and heating method by electric resistance between contacted surfaces of two plates by welding current induced to copper electrode. This double welding process has welding variables such as each current induced in heating dies and in copper electrode, outer diameters of heating dies, and edge shape of copper electrode. Experiments for current conditions in welding process should be demanded in order to get successful welding strength. It was known that the welding strength could be reached to the value demanded on industry fields under such welding conditions as heating dies of outer ring dia.12mm contacted on steel plate, as heating dies of outer ring dia. 14mm contacted on aluminum plate, and as copper electrode of dia. 6.0mm, and as 3 times continuous heating method by $1^{st}$ current of 11 kA(9cycle), $2^{nd}$ current 11 kA(60cycle), $3^{rd}$ current 7 kA(60cycle) applied in steel heating dies and copper electrodes, flat edge of copper electrode, for double spot welding process of dissimilar metal plates of steel and aluminum of 1.0 mm thickness.

• Corrosion Science and Technology
• /
• v.16 no.5
• /
• pp.227-234
• /
• 2017

Reference electrodes are generally implemented for the purpose of monitoring the cathodic protection potentials of buried or immersed metallic structures. In the market, many types of reference electrodes are available for this purpose, such as saturated calomel, silver/silver chloride and copper/copper sulfate. These electrodes contain a porous ceramic junction plate situated in the cylindrical body bottom to permit ionic flux between the internal electrolyte (of the reference electrode) and the external electrolyte. In this work, the copper/copper sulfate reference electrode was modified by replacing the porous ceramic junction plate for a metallic platinum wire. The main purpose of this modification was to avoid the ion copper transport from coming from the inner reference electrode solution into the surrounding electrolyte, and to mitigate the copper plating on the coupon surfaces. Lab tests were performed in order to compare the performance of the two mentioned reference electrodes. We verified that the experimental errors associated with the measurements conducted with developed reference electrode would be negligible, as the platinum surface area exposed to the surrounding electrolyte and/or to the reference electrolyte are maintained as small as possible.

• Journal of the Korean institute of surface engineering
• /
• v.37 no.1
• /
• pp.22-27
• /
• 2004

Copper electroforming process has been applied to duplicate Koryo Tripitaka (Taejang'kyong), wooden printing block. Thin copper replica printing plates of 1 mm thickness was successfully manufactured from the printing face (54.5${\times}$25.5 cm) of wooden printing plate. Major processes are (1) silicon rubber replication of the master (2) silvering on silicon rubber (3) copper electroforming (4) separation of copper from the silicon mandrel (5) final coloring by brass plating and trimming. This process has various Potential applications in making thin metallic objects such as plaques, statues, bust and hollow metal objects for jewelry.

• Journal of Food Hygiene and Safety
• /
• v.35 no.2
• /
• pp.177-182
• /
• 2020

Copper possesses antimicrobial properties against certain bacteria and fungi. In this study, changes in microbial population, color and the antioxidant properties of dried red pepper powder (RPP) by contact with the surface of a copper plate were investigated. Lightness of RPP increased after treatment on the copper plate for 2 h at 55℃. The numbers of total aerobic mesophilic bacteria in RPP increased by 0.61 and 0.50 log on the surface of stainless steel and copper plates during 24 h at 37℃, respectively. The population of yeast and mold was reduced by 90% in the RPP treated on both copper and stainless steel plates under the same condition. Yeast and mold were significantly reduced on the copper plate during 2 h at 55℃. Scavenging activities of RPP treated on the copper plate for 24 h at 37℃ against DPPH radical were decreased; those for 2 h at 55℃ against ABTS radical were rather enhanced. The results suggest that copper might be applied in the processing and storage equipment in relation to RPP products for antimicrobial purposes.