• Transactions of the Korean hydrogen and new energy society
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• v.28 no.1
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• pp.70-76
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• 2017

To synthesize copper nanoparticle a thermal decomposition was adopted. And to solve the problem of surface oxidation of the synthesized copper powder an electroless Ag plating method was used. The size and shape of synthesized Cu nanoparticle were affected by the size of copper oxalate used as a precursor, reaction solvent, reaction temperature and amount of reducing agent. Especially reaction solvent is dominant factor to control shape of Cu nano-particle which can have the shapes of sphere, polygon and rod. In case of glycerol, it produced spherical shape of about 500 nm in size. Poly ethylene produced uniform polygonal shape in about 700 nm and ethylene glycol produced both of polygon and rod having size range between 500 and 1500 nm. The silver coated copper powder showed a high electrical conductivity.

• Journal of Industrial and Engineering Chemistry
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• v.67
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• pp.448-460
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• 2018

Copper nanoparticle-doped and graphitic carbon nanofibers-covered porous carbon beads were used as an efficient catalyst for treating synthetic phenolic water by catalytic wet air oxidation (CWAO) in a packed bed reactor over 10-30 bar and $180-230^{\circ}C$, with air and water flowing co-currently. A mathematical model based on reaction kinetics assuming degradation in both heterogeneous and homogeneous phases was developed to predict reduction in chemical oxygen demand (COD) under a continuous operation with recycle. The catalyst and process also showed complete COD reduction (>99%) without leaching of Cu against a high COD (~120,000 mg/L) containing industrial wastewater.

• Journal of the Optical Society of Korea
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• v.20 no.5
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• pp.601-606
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• 2016

In this study, in order to analyze the low-temperature sintering process of silver and copper nanoparticles, we calculate their melting temperatures and surface melting temperatures with respect to particle size. For this calculation, we introduce the concept of mean-squared displacement of the atom proposed by Shi (1994). Using a parameter defined by the vibrational component of melting entropy, we readily obtained the surface and bulk melting temperatures of copper and silver nanoparticles. We also calculated the absorption cross-section of nanoparticles for variation in the wavelength of light. By using the calculated absorption cross-section of the nanoparticles at the melting temperature, we obtained the laser threshold energy for the sintering process with respect to particle size and wavelength of laser. We found that the absorption cross-section of silver nanoparticles has a resonant peak at a wavelength of close to 350 nm, yielding the lowest threshold energy. We calculated the intensity distribution around the nanoparticles using the finite-difference time-domain method and confirmed the resonant excitation of silver nanoparticles near the wavelength of the resonant peak.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1713-1717
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• 2008

We have developed a nanoparticle focusing mask which can generate particle arrays directly on the large area with high resolution. Using this mask, nanomaterials are precisely deposited onto desired positions on a substrate surface. We obtained various sizes of arrays ranging from 80 nm to 6 ${\mu}m$ with silver and copper nanoparticles that are generated by a spark discharge and an evaporation-condensation method. The feather size is much smaller than that of mask openings due to the focusing effects, like electrostatic lens, caused by charge or electric potential on insulator mask surface, which also prevent a mask clogging. The particle array size depends on the size of mask open patterns and focusing effects near the mask relate to ion flow rate and electric potential. We have demonstrated that diverse size of arrays with high resolution could be obtained repeatedly using the same sized mask in atmosphere.

• Bulletin of the Korean Chemical Society
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• v.29 no.8
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• pp.1561-1564
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• 2008

Although the use of Cu(II) salts as catalysts without reductants is limited in the cycloaddition of acetylenes with azides, the catalytic system employing average 10 nm CuO(II) nanoparticles in the absence of reductants shows good catalytic activity to form 1,4-disubstituted 1,2,3-triazoles even in wet THF as well as water. It is also noticeable that CuO(II) nanoparticle catalysts can be recycled with consistent activity. A range of alkynes and azides were subject to the optimized CuO(II) nanoparticle-catalyzed cycloaddition reaction conditions to afford the desired products in good yields.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.121-121
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• 2018

Copper is a promising electronic material due to low cost and high electrical conductivity. However, the oxidation problem in an ambient condition makes a crucial issue in practical applications. In here, we developed a simple and cost-effective Cu patterning method on a flexible PET film by combining a solution processable Cu nanoparticle patterning and a low temperature post-processing using acetic acid treatment, laser sintering process and acid-assisted laser sintering process. Acid-assisted laser sintering processed Cu electrode showed superior characteristics in electrical, mechanical and chemical stability over other post-processing methods. Finally, the Cu electrode was applied to the flexible electronics applications such as flexible and transparent heaters and touch screen panels.

• Design & Manufacturing
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• v.13 no.1
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• pp.42-47
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• 2019

Nucleate boiling heat transfer is one of the most important phenomenon in the various industries. Especially, critical heat flux (CHF) refers to the upper limit of the pool boiling heat transfer region. Therefore, many researchers have found that CHF can be significantly increased by adding very small amounts of nanoparticles. In this study, the CHF and heat transfer coefficient were tested under the pool boiling state using copper and multi wall carbon nanotube nanoparticles. The results showed that two different types of nanoparticles deposited on the surface of two specimens made of the same material increased the heat flux in the nanoparticles with high conductivity, and there was no difference in the critical heat flux when the same material nanoparticles were deposited on the two different specimen surfaces.

• Journal of Powder Materials
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• v.19 no.5
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• pp.343-347
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• 2012

In this study, an oxygen plasma treatment was used as a low temperature debinding method to form a conductive copper feature on a flexible substrate using a direct printing process. To demonstrate this concept, conductive copper patterns were formed on polyimide films using a copper nanoparticle-based paste with polymeric binders and dispersing agents and a screen printing method. Thermal and oxygen plasma treatments were utilized to remove the polymeric vehicle before a sintering of copper nanoparticles. The effect of the debinding methods on the phase, microstructure and electrical conductivity of the screen-printed patterns was systematically investigated by FE-SEM, TGA, XRD and four-point probe analysis. The patterns formed using oxygen plasma debinding showed the well-developed microstructure and the superior electrical conductivity compared with those of using thermal debinding.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.16.2-16.2
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• 2009

Developing a low cost printing material that can replace silver for the formation of a conducting pattern is an important issue in printed electronics. We report a novel approach using a non-oxidized copper material during the printing and sintering process under ambient conditions, which was previously considered unachievable. An attempt was made to understand the conversion process of cuprous oxide nanoparticle aggregates on metallic copper crystals through chemical reduction in the solution phase. The detailed mechanism for this conversion, including the role of the surfactant and crystal growth, was examined.

• Korean Journal of Materials Research
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• v.26 no.4
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• pp.216-221
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• 2016

A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature ($300^{\circ}C$) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.