• 접착 및 계면
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• 제4권3호
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• pp.1-8
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• 2003

철판에 도금한 아연을 구리이온으로 치환하는 치환도금법과 철판에 직접 구리를 증착하는 진공증착법으로 두께가 다른 구리박막 피복철판을 제조하여 배합고무와 접착성질을 조사하였다. 구리박막 피복철판과 배합고무의 접착세기는 제조방법에 관계없이 구리박막 두께에 따라 결정되었다. 구리박막이 75 nm보다 얇으면 안정한 접착층이 형성되어 황동판에 못지 않게 고무와 강하게 접착되었으나, 90 nm보다 두터우면 구리황화물이 지나치게 성정하여 접착세기가 약하였다.

• Journal of Animal Science and Technology
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• 제64권5호
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• pp.885-896
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• 2022

This experiment was conducted to investigate the effects of three different copper (Cu) sources (one inorganic and two organics) and levels (0, 50, and 100 mg/kg) on the growth performance, Cu digestibility, fecal mineral excretion, serum mineral concentration, jejunal morphology, and serum biochemical profile of growing pigs. A total of 42 male, growing pigs (31.08 ± 1.82 kg) were randomly assigned to seven treatments consisting of one negative control (0 mg/kg of added Cu level) and treatments with copper sulfate (CuSO4), Cu-amino acid complex (CuAA), and Cu-hydroxy-4-methylthio butanoate chelate complex (CuHMB) at 50 and 100 mg/kg each for 28 d. Pigs fed 50 or 100 mg/kg of Cu showed improved (p < 0.05) average daily gain and feed intake. Although Cu excretion decreased (p < 0.01) in pigs fed 100 mg/kg of organic Cu sources compared to those fed CuSO4, there was no difference between the Cu sources in pigs fed 50 mg/kg. However, the apparent total tract digestibility of Cu increased (p < 0.01) in pigs fed organic Cu sources compared with that in pigs fed CuSO4. The addition of CuHMB increased (p < 0.01) serum phosphorus and sulfur concentrations; however, there were no effects of source and level on jejunal morphology and serum biochemical profile. These results suggest that the inclusion (50 mg/kg) of organic Cu sources (CuAA and CuHMB) in the growing pig diet could be beneficial for growth performance and Cu availability and may reduce environmental pollution.

• 한국결정성장학회지
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• 제27권5호
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• pp.243-248
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• 2017

본 연구에서는 산화주석(IV) 첨가량을 달리하여 동화유약 시편을 제조하고 발색기구를 분석하기 위하여 분광 분석, 결정상 분석, 미세구조 분석을 실시하여 색상과의 상관성을 분석하였다. 산화주석(VI) 첨가량이 증가함에 따라 동화유약의 붉은색은 사라지고 CIEab 값이 감소하여 무채색으로 발색하였다. 산화주석은 유약층에 고르게 분포하여 Cu nuclei가 성장하여 붉은색으로 발색하는 것을 방해하고 기포 주변의 metal Cu와 반응하여 합금을 형성하였다. 이로 인해 산화주석 첨가량이 증가함에 따라 금속 Cu 피크는 사라지고 미세한 $Cu_2O$ 피크만 남게 된다. 산화주석을 3.79 % 첨가하였을 때는 유약에 붉은색을 내는 $Cu_2O$보다 검정색을 나타내는 CuO와 Cassiterite $SnO_2$가 색상에 더 영향을 미치는 것으로 보여진다.

• 미생물학회지
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• 제53권4호
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• pp.251-256
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• 2017

구리 스트레스를 받는 식물에 구리 내성을 부여하며 생장을 촉진할 수 있는 여러 구리 내성 근권세균을 분리하였다. 분리균주 Pseudomonas veronii MS1과 P. migulae MS2는 금속 킬레이트제인 siderophore를 각각 0.13과 0.26 mmol/ml 생성하였으며 또한 20 mg/L Cu 수용액에서 각각 64.6과 77.9%의 구리에 대한 생물흡착능을 나타내었다. 구리는 생물체에서 산화스트레스를 유발할 수 있는 유해한 자유 라디칼 형성을 유도할 수 있다. MS1과 MS2 균주의 1,1-diphenyl-2-picryl hydrazyl 라디칼 제거능과 항산화능은 24시간 배양 후 대조군에 비해 각각 82.6과 78.1% 증가하였다. 이들은 식물에서 스트레스 호르몬인 에틸렌의 수준을 낮추는 1-aminocyclopropane-1-carboxylic acid deaminase 활성을 각각 7.10과 $6.42{\mu}mol$ ${\alpha}$-ketobutyrate mg/h 나타내었으며 한편 비생물적 스트레스 하의 식물 생장을 도울 수 있는 indole-3-acetic acid와 salicylic acid도 생성하였다. 이 모둔 결과들은 이 구리-내성 근권세균들이 식물에 구리 내성을 부여하며 생장을 촉진할 수 있다는 것을 가리킨다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 춘계학술발표강연 및 논문개요집
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• pp.86-86
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• 2003

Copper has attracted much attention in the deep submicron ULSI metallization process as a replacement for aluminum due to its lower resistivity and higher electromigration resistance. Electroless copper deposition method is appealing because it yields conformal, high quality copper at relatively low cost and a low processing temperature. In this work, it was investigated that effect of the microstructure of the substrate on the electroless deposition. The mechanism of the nucleation and growth of the palladium nuclei during palladium activation was proposed. Electroless copper deposition on TiN barriers using glyoxylic acid as a reducing agent was also investigated to replace toxic formaldehyde. Furthermore, electroless copper deposition on TaN$\sub$x/ barriers was examined at various nitrogen flow rate during TaN$\sub$x/ deposition. Finally, it was investigated that the effect of plasma treatment of as-deposited TaN$\sub$x/ harriers on the electroless copper deposition.

• Corrosion Science and Technology
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• 제6권4호
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• pp.198-205
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• 2007

The initial stages of electrochemical oxidative CuI film formation on Cu(111), as studied by means of Cyclic Voltammetry (CV), in-situ Scanning Tunneling Microscopy (STM) and ex-situ Synchrotron X-ray Photoemission Spectroscopy (SXPS), indicate a significant acceleration of copper oxidation in the presence of iodide anions in the electrolyte. A surface confined supersaturation with mobile CuI monomers first leads to the formation of a 2D-CuI film via nucleation and growth of a Cu/I-bilayer on-top of a pre-adsorbed iodide monolayer. Structurally, this 2D-CuI film is closely related to the (111) plane of crystalline CuI (zinc blende type). Interestingly, this film causes no significant passivation of the copper surface. In an advanced stage of copper dissolution a transition from the 2D- to a 3D-CuI growth mode can be observed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.245-245
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• 2009

l-D nanostructured materials have much more attention because of their outstanding properties and wide applicability in device fabrication. Copper oxide(CuO) has been realized as a p-type metal oxide semiconductor with narrow band gap of 1.2 -1.5eV. Copper oxide nanostructures can be synthesized by various growth method such as oxidation reaction, thermal evaporation thermal decomposition, sol-gel. and Mostly CuO nanowire prepared on the Cu substrate such as Copper foil, grid, plate. In this study, CuO NWs were grown by thermal oxidation (at various temperatures in air (1 atm)) of Cu metal deposited on CuO (20nm)/$SiO_2$(250nm)/Si. A 20nm-thick CuO layer was used as an adhesion layer between Cu metal and $SiO_2$

• 열처리공학회지
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• 제21권3호
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• pp.144-149
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• 2008

It has been reported that copper and copper alloys have a large anisotropy of functional properties such as electrical, thermal and mechanical properties, which means that the texture of polycrystalline alloy should be considered to achieve better properties. In this study, the determination of grain growth orientation and texture formation in the cold-rolled, heat-treated and Ni-plated hybrid copper sheets was investigated. Grain growth direction and texture formation were analyzed by the X-ray pole figure. The influence of texture on the mechanical properties could be quantitatively confirmed by the results from the orientation distribution function and the tensile test. The heat-treated texture in the cold-rolled hybrid copper sheet is also investigated and discussed.

• 한국결정성장학회지
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• 제20권6호
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• pp.307-313
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• 2010

용매추출과 ICP-AES를 이용하여 구리와 탄소가 주성분인 탄소소재에 함유된 납 및 카드뮴을 정량하기 위한 조건을 연구하였다. 구리성분은 납 및 카드뮴 정량에 방해를 하므로 potassium cyanide로 masking한 다음 dithizone을 가하여 납 및 카드뮴을 Pb- 또는 Cd-dithizone 착물을 형성한 다음 chloroform으로 추출하여 측정하였다. 납 및 카드뮴에 대한 측정 회수율이 우수하였고, 방해를 일으키는 매질원소를 효율적으로 제거할 수 있었다. 납 및 카드뮴 화합물이 첨가된 시험기준 물질에 대한 용매추출시험에서 matrix의 영향을 받지 않고 정량하였다.

• Journal of Animal Science and Technology
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• 제55권4호
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• pp.295-301
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• 2013

This study was conducted to evaluate the effects of chelated Cu and Zn on growth performance, nutrient digestibility, blood profiles, and fecal noxious gas emission in weanling pigs. A total of 90 weanling pigs with an initial body weight (BW) of $5.27{\pm}0.04kg$ were randomly allotted to two dietary treatments for 42 d. Pigs were then fed a control diet (CON) or a Zinpro diet (CON + 0.1% chelate copper and zinc). There were nine replicate-pens with five pigs in each pen. During d 0 to 14 and d 14 to 28, the ADFI decreased (p<0.05) and the G/F increased (p<0.05) in pigs fed the Zinpro diet compared with those that received the CON diet. During d 28 to 42, the ADFI increased (p<0.05) in pigs fed the Zinpro diet relative to those fed the CON diet. Additionally, the apparent total tract digestibility of DM, N, and energy increased (p<0.05) in the Zinpro group when compared to the CON group on d 14 and 28. The lymphocyte percentage was also greater (p<0.05) in the Zinpro group than in the CON group. Overall, dietary supplementation with 0.1% chelate copper and zinc improved the growth performance and nutrient digestibility in weanling pigs.