• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.10
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• pp.1-8
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• 2003

Copper thin films were deposited on a Cu/Ta/Si substrate using the electroplating technique. Deposition rate was about 200 nm/min in proportion to current density and in inverse proportion to flow rate. Resistivity of copper thin film was approximately 2.1 ${\mu}$Ωcm and Int$\sub$(111)//Int$\sub$(200)/ ratio of copper film was 5.4 and no significant impurities were detected. After the deposition, electroplating copper films were annealed at various temperatures in a background pressure of 10$\^$-3/ torr. The resistivity of copper thin films were improved by ∼17 % and texture was improved by ∼40 % after annealing at 170$^{\circ}C$. The stress in films was not reduced much after annealing below 170$^{\circ}C$.

• Corrosion Science and Technology
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• v.16 no.5
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• pp.265-272
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• 2017

Inhibition of pitting corrosion of the copper sprinkler tubes by removing dissolved oxygen in water with sodium sulfite was studied on the wet sprinkler systems operated in 258 household sites. First, air in the sprinkler tubing was removed by vacuum pumping. The tube was then filled with sodium sulfite dissolved in water. Sodium sulfite was very effective in maintaining a very low dissolved oxygen concentration in water in the sprinkler tube for the observation period of six months. Water leakage from the copper sprinkler tube was reduced significantly by using sodium sulfite. Both pitting corrosion process and pitting corrosion inhibition mechanism were investigated by examining microscopical and structural aspects of corrosion pits formed in failed copper sprinkler tube. Pitting corrosion was caused by pressurized air as well as sediments such as sand particles in copper tubes through oxygen concentration cells. It was confirmed microscopically that growth of corrosion pits was stopped by reducing dissolved oxygen concentration to a very level by using sodium sulfite.

• Korean Journal of Materials Research
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• v.20 no.10
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• pp.555-558
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• 2010

This study examined the effect of current density on the surface morphology and physical properties of copper plated on a polyimide (PI) film. The morphology, crystal structure, and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity was controlled using current density. Large particles were observed on the surface of the copper layer electroplated onto a current density of 25 mA/$cm^2$. However, a uniform surface and lower resistivity were obtained with a current density of 10 mA/$cm^2$. One of the important properties of FCCL is the flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density rather than a high current density. Moreover, a reasonable current density is 20 mA/$cm^2$ considering the productivity and mechanical properties of copper foil.

• Korean Journal of Materials Research
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• v.16 no.11
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• pp.710-714
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• 2006

The purpose of this study is to identify the effect of additives and composition on copper surface morphology and mechanical characteristics by copper electrodeposition. Additives such as hydroxy ethyl cellulose(HEC), chloride ion were used in this study. Electrochemical experiments allied to SEM, XRD, AFM and four- point probe were performed to characterize the morphology and mechanical characters of copper in the presence of additives. Among various electrodeposition conditions, the minimum surface roughness of copper foil was obtained when electrodeposited at the current density of 200 mA/$cm^2$ for 68 seconds with 2 ppm of HEC. The minimum value of surface roughness(Rms) was 107.6 nm. It is copper foil is good for electromigration inhibition due to preferential crystal growth of Cu (111) deposited in the electrolyte containing chloride ions(10 ppm) and HEC(1 ppm).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.05a
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• pp.132-136
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• 2004

열 증착 방법을 이용하여 copper(II)-phthalocyanine(CuPc) 박막을 glass 기판 위에 제작하였다. 열처리 조건은 $150^{\circ}C$에서 후열(annealing) 처리 하는 방식과 예열하는 두 가지 방식으로 달리하였다. 제작된 박막의 전기전도도를 평가하기 위해 마이크로웨이브 근접장 효과를 이용한 근접장 현미경(near-field scanning microwave microscope)을 이용하여 비파괴적인 방식으로 CuPc 박막의 반사계수(reflection coefficient)를 측정하였다. CuPc 박막의 전기전도도 특성을 UV 흡수도를 통한 에너지 밴드갭의 shift 현상과 관련지어 설명하고 또한 x-ray diffraction(XRD) data를 통해 박막의 결정 특성과 비교하였다. 박막 표면 특성은 SEM(scanning microscope microscopy)을 통해 관측하였다. 열처리 조건에 따른 CuPc 박막의 전기전도도 특성은 후열 처리한 박막의 경우 예열 처리한 박막보다 전기 전도 특성이 향상되었음을 관측할 수 있었다.

• Journal of Powder Materials
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• v.22 no.4
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• pp.247-253
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• 2015

The sintering mechanisms of nanoscale copper powders have been investigated. A molecular dynamics (MD) simulation with the embedded-atom method (EAM) was employed for these simulations. The dimensional changes for initial-stage sintering such as characteristic lengths, neck growth, and neck angle were calculated to understand the densification behavior of copper nano-powders. Factors affecting sintering such as the temperature, powder size, and crystalline misalignment between adjacent powders have also been studied. These results could provide information of setting the processing cycles and material designs applicable to nano-powders. In addition, it is expected that MD simulation will be a foundation for the multi-scale modeling in sintering process.

• KSBB Journal
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• v.10 no.5
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• pp.475-481
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• 1995

The effect of metallothionein expression on the metal resistance and removal by recombinant Saccharomyces cerevisiae containing the plasmid pJW9 was investigated. The recombinant strain S. cerevisiae BZ-pJ was constructed by transforming the host strain S. cerevisiae BZ3l-1-7Ba with the gene coding for a metal-binding protein, metallothionein. Introduction of the MT gene yielded an increase in the minimum inhibitory concentration (MIC) of copper more than three times compared with the host strain. The minimum inhibitory concentrations of $Cr^{2+}, Znr^{2+} and Pb^{2+}, $ were not different for the two strains. The recombinant yeast grown in a medium containing 8mM CuSO4 was able to remove copper with a capacity of 18.9mg $Cu^{2+}$/g dry cell. In a mixture of copper and zinc, the presence of copper relieved the toxic effects caused by zinc, resulting in an enhancement of the final cell density and the specific growth rate of the recombinant yeast. The capability to remove copper by the recombinant yeast was linearly proportional to the copper concentrations in the medium. The efficiency of copper removal was rather constant regardless of the initial copper concentrations. The specific removal of zinc was dependent on the zinc concentrations in media, though, and such dependence was not so pronounced as the concentration of copper.

• Asian-Australasian Journal of Animal Sciences
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• v.17 no.7
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• pp.1007-1013
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• 2004

This experiment was conducted to investigate the effect of cadmium levels on weight gain, nutrient digestibility and the retention of iron, copper and zinc in tissues of growing pigs. A total of one hundred and ninety-two crossbred pigs (barrows, Duroc$\times$Landrace$\times$Yorkshine, 27.67$\pm$1.33 kg of average initial body weight) were randomly allotted to four treatments. Each treatment had three replicates with 16 pigs per pen. The corn-soybean basal diets were supplemented with 0, 0.5, 5.0, 10.0 mg/kg cadmium respectively, and the feeding experiment lasted for eight-three days. Cadmium chloride was used as cadmium source. The results showed that pigs fed the diet containing 10.0 mg/kg cadmium had lower ADG and FCR than any other treatments (p<0.05). Apparent digestibility of protein in 10.0 mg/kg cadmium-treated group was lower than that of other groups (p<0.05). There was lower iron retention in some tissues of 5.0 mg/kg and 10.0 mg/kg cadmium treatments (p<0.05). However, pigs fed the diet 10.0 mg/kg cadmium had higher copper content in most tissues than that of any other groups (p<0.05). There was a significantly increase of zinc retention in kidney of 10.0 mg/kg cadmium additional group (p<0.05) and zinc concentrations in lymphaden, pancreas and heart of 10.0 mg/kg cadmium treatment were lower than those of the control (p<0.05). This study indicated that relatively high cadmium level (10.0 mg/kg) could decrease pig growth performance and change the retention of iron, copper and zinc in most tissues during extended cadmium exposure period.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.67-71
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• 2021

In this study, graphene layer was grown on metal microwire using chemical vapor deposition. The difference of carbon solubility between copper and nickel resulted in the formation of mono-layer and multi-layer graphene were formed on the surfaces of copper and nickel microwires, respectively. During the growth of graphene at high temperature, copper and nickel were recrytallized and the grain size increased. The ampacity of graphene/copper microwire was improved by approximately 27%, 1.91×105 A/㎠, compared to pristine copper microwire. Similar to this behavior, the ampacity of multilayer graphene/nickel microwire was 4.41×104 A/㎠ which is about about 36% improved compared to the pure nickel microwire. The excellent electrical properties of graphene/metal composites are beneficial for supplying the electrical energy to the high-power electronic devices and equipment.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.05a
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• pp.95-96
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• 1999