• Bulletin of the Korean Chemical Society
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• 제27권8호
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• pp.1127-1132
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• 2006

A new salicylate-selective electrode based on the complex N,N'-1,4-butylene bis(3-methyl salicylidene iminato) copper(II) as the membrane carrier was developed. The electrode exhibits a good Nernstian slope of 59.1 ${\pm}$ 1.0 mV/decade and a linear range of $1.0\;{\times}\;10^{-6}$-1.0 M for salicylate. The limit of detection was $5.0\;{\times}\;10^{-7}$ M. It has a fast response time 10 s and can be used for more than three months. The selective coefficients were determined by the fixed interference method (FIM) and could be used in the pH range 4.5-10.5. It was employed as an indicator electrode for direct determination of salicylate in pharmaceutical samples.

• 전기화학회지
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• 제18권3호
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• pp.130-135
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• 2015

흑연 분말을 프탈로시아닌 또는 구리 프탈로시아닌과 함께 비활성 분위기에서 각각 열처리하여 표면처리를 진행하였고, 이의 속도특성과 저온 작동특성을 조사하였다. 표면처리 후 흑연 분말의 표면에 비정질 탄소와 구리의 코팅 층이 균일하게 형성되었다. 표면처리를 통하여 흑연 전극의 속도특성이 개선되는 것을 확인하였는데, 특히 구리 프탈로시아닌으로 처리한 경우 속도특성의 향상이 두드러졌다. 흑연 전극의 저항을 교류 임피던스와 펄스 저항측정법을 활용하여 조사하였는데, 구리 프탈로시아닌으로 처리된 흑연 전극의 경우가 저항이 가장 작았다. 프탈로시아닌으로 부터 유도된 비정질 탄소 층이 리튬이온의 확산을 용이하게 하고, 구리 프탈로시아닌으로부터 유도된 금속상태의 구리는 전자 전도도를 증가시키기 때문에 저항을 감소시키는 것으로 판단된다.

• 조명전기설비학회논문지
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• 제23권9호
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• pp.40-46
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• 2009

비록 접지저항은 접지전극의 접지성능을 좌우하는 지수이기는 하지만, 과도상태에서는 접지 성능을 반영하지 못한다. 동봉은 배전계통에서 가장 많이 쓰이는 접지전극이다. 본 논문에서는 동봉의 접지 임피던스를 주파수 60[Hz]에서 100[kHz] 범위까지 측정하여 등가 접지임피던스 모델을 구하였다. 뇌격서지가 유입되었을 때 MATLAB 프로그램으로 과도접지임피던스의 수치와 파형을 시뮬레이션하였다.

• E2M - 전기 전자와 첨단 소재
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• 제10권3호
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• pp.233-238
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• 1997

We have investigated gas-detection characteristics of CuTBP (Copper-tetra-tert-butylphthalocyanine) chemiresistor devices exposed to air/200ppm N $O_{2}$ gases. The CuTBP films were made by Langmuir-Blodgett (LB) techniques. Sensitivity, response time, recovery time, and reproducibility of the devices were measured by current voltage characteristics. Interdigital electrode was used to improve the sensitivity. It was observed that a conductance G increases monotonically as the number of interdigital electrode finger pairs increases. As the number of interdigital electrode finger pairs increases, the sensitivity S( $G_{gas}$/ $G_{air}$) increases more than 50 times and stable. But the response time was delayed. The average recovery time of the CuTBP chemiresistor devices turned out to be about 100 second. We have also investigated applicability of the CuTBP chemiresistor device for a gas sensor.sor.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1713-1715
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• 1996

The $NO_2$ GAS Sensitivity characteristic of CuTBP(Copper-tetra-tert-butylphthalocyanine) LB films were investigated through a study of current-voltage (I-V) characteristics with a variation of number of electrode finger pairs N ($1{\sim}25$). A concentration of 200ppm $NO_2$ gas was used. It was found that a conductance G increases monotonically as the number of interdigital electrode increases, and a Sensitivity, Reproducibility is stable. As far as a current is concerned, the current when N=25 is greater than that when N=1 by 70 or so. It indicates that the number of interdigital electrodes affects the current, sensitivity and stability. We knew that the $NO_2$ gas detector application possibility using a current of N=25.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.761-762
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• 2006

W-Cu alloy was very useful material for a heat sink, high electric contact and EDM electrode. Powder injection molding (PIM) is the optimum manufacturing technology to provide W-Cu components with low-cost and high-volume. We used various compositions of tungsten coated copper powders (W-Cu with 10 to 80 wt-% of copper) to manufacture W-Cu components by PIM. The optimum mixing, injection molding, debinding and sintering conditions to provide the high performance W-Cu components were investigated. The thermal and mechanical properties of W-Cu parts by PIM were measured. Finally, we can verify the high performance of W-Cu components by PIM with the tungsten coated copper.

• 한국표면공학회지
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• 제17권1호
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• pp.1-6
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• 1984

The fluidized bed electrode reactor(FBER) with conducting particles has been made use of the removal of metals from dilute electroplating rinse water. The electrolysis was carried out under the conditions of diaphragm current density with 2~28A/$dm^2$ and bed expansion with 20~50%. Recirculating batch operations have been shown that the metal concentration dropped exponentially and may be taken down to 10 ppm. And then, the current efficiency at a concentration of 10 ppm copper was 37% under the conditions of 30% bed expansion and 6 A/$dm^2$, and at concentrated electrolyte (2000ppm copper) was over 80% in the range of 8~28A/$dm^2$ and 20~50% bed expansion. One of the technical possibilities of fluidized bed electrolysis is the separation of copper and nickel from a mixed solution of copper and nickel.

• 한국수소및신에너지학회논문집
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• 제4권2호
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• pp.23-28
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• 1993

The $(LM)Ni_{4.5}Co_{0.1}Mn_{0.2}Al_{0.2}$ hydrogen storage alloy powders were conducted 25wt% electroless copper plating in an acidic bath. For the preparation of a hydride electrodes, the copper coated alloy powder was mixed with Si-sealant(organosilicon) and compacted with $6t/cm^2$ at room temperature. The electrode characteristics were examined through electrochemical measurements in a half cell. As a sealant contents increased, the initial discharge capacity of si-sealant bounded electrode was lower and the activation rate in high current density was slower. For extended cycles, however, the electrodes with the Si-sealant were superior in a high rate discharge and useful range of temperature over the sealant-free electrode. In addition, the cycle life increased with increasing the amount of Si-sealant added. It can be suggested from the results that the Si-sealant as a binder could be applied to the preparation of the metal hydride electrode.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.121-121
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• 2018

Copper is a promising electronic material due to low cost and high electrical conductivity. However, the oxidation problem in an ambient condition makes a crucial issue in practical applications. In here, we developed a simple and cost-effective Cu patterning method on a flexible PET film by combining a solution processable Cu nanoparticle patterning and a low temperature post-processing using acetic acid treatment, laser sintering process and acid-assisted laser sintering process. Acid-assisted laser sintering processed Cu electrode showed superior characteristics in electrical, mechanical and chemical stability over other post-processing methods. Finally, the Cu electrode was applied to the flexible electronics applications such as flexible and transparent heaters and touch screen panels.

• 대한전기학회논문지
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• 제44권10호
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• pp.1311-1316
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• 1995

The electrical properties of the Langmuir-Blodgett (LB) films layered with arachidic acid were studied at the room temperature. The sample was formed with 2 different structure ; One was Al/LB/Al and the other was Au/LB/Au. The precise structure of Al/LB/Al was considered as Al/Al$_{2}$O$_{3}$/LB/Al, because the natural oxide layer was formed on surface of lower Al electrode. The electrical conductivity of Al/Al$_{2}$O$_{3}$/LB/Al structure was determined the value of 3.5 * 10$^{-14}$ S/cm from the measurement of current-voltage (I-V) characteristics. The sample with the structure of Au/LB/Au was made to eliminate the influence of oxide layer in the electrical properties of the LB films. The short circuit current was observed in this sample from the I-V characteristics. To verify the reason of short circuit current generation, copper decoration method was employed to the 15 layers of LB films deposited on the Al and Au electrode each. The defects were shown on the films deposited with Au electrode. This results means that the defects on the LB films which layered with the Au electrode were contributed to the short circuit current. Several films (15, 31, 51, 71L) were deposited on the Au electrode and measured the size of defects with the copper decoration method. The size of defects becomes smaller as the film layer was increased. We conclude that the existence of defects affects the short circuit current generation.