• 한국세라믹학회지
• /
• 제51권6호
• /
• pp.549-553
• /
• 2014

$CoSb_3$-based skutterudite compounds are candidate materials for thermoelectric power generation in the mid-temperature range (600 - 900 K) because their thermoelectric properties can be enhanced by doping and filling. The joining property of thermoelectric module electrodes containing thermoelectric materials is of great importance because it can dominate the efficiency of the thermoelectric module. This study examined the properties of $CoSb_3$/Al/Ti/CuMo joined by the spark plasma sintering technique. Titanium thin foil was used to prevent the diffusion of copper into $CoSb_3$ and Aluminum thin foil was used to improve the adhesion between $CoSb_3$ and Ti. The insertion of an Aluminum interlayer between the Ti and $CoSb_3$ was effective for joining $CoSb_3$ to Ti by forming an intermediate layer at the Al-$CoSb_3$ boundary without any micro cracks. Specifically, the adhesion strength of the Ti/Al/$CoSb_3$ joining interface showed a remarkable improvement compared with our previous results, without deterioration of electrical property in the interface.

• 청정기술
• /
• 제21권3호
• /
• pp.200-206
• /
• 2015

산화세륨의 첨가가 수성가스전이반응 효율에 미치는 영향을 조사하기 위해서, Cu-ZnO-CeO₂촉매를 공침법을 사용하여 제조하였다. 일련의 Cu-ZnO-CeO₂ 촉매는 Cu 함량(50 wt%)을을 고정시키고 산화세륨(CeO₂ 기준으로, 0, 5, 10, 20, 30, 40 wt%)의 함량을 조절하면서 제조되었고 이를 이용하여 GHSV 95,541 h^-1의 기체 유량범위, 200~400 ℃의 온도범위에서 수성가스전이반응 촉매활성이 측정되었다. 또한, BET, SEM, XRD, H₂-TPR, XPS 분석을 통하여 촉매특성이 분석되었다. CeO₂가 첨가된 촉매는 구리 분산도와 결합에너지 같은 촉매특성의 다양한 변화를 나타내었다. 10wt%의 CeO₂가 최적의 첨가량으로 판단되며 이때 촉매는 가장 낮은 온도에서 환원이 일어났으며 반응에서 가장 높은 촉매 활성을 보였다. 또한 CeO₂가 첨가된 촉매는 CeO₂가 첨가되지 않는 촉매와 비교하여 높은 온도영역에서 활성이 향상되었다. 따라서, 최적 조성의 CeO₂첨가는 높은 구리 분산도, 낮은 결합에너지, 구리 금속의 응집 방지를 유도하여 높은 촉매활성을 유도하였다.

• 한국재료학회지
• /
• 제19권2호
• /
• pp.61-67
• /
• 2009

Electrolessly deposited Co (Re,P) was investigated as a possible capping layer for Cu wires. 50 nm Co (Re,P) films were deposited on Cu/Ti-coated silicon wafers which acted as a catalytic seed and an adhesion layer, respectively. To obtain the optimized bath composition, electroless deposition was studied through an electrochemical approach via a linear sweep voltammetry analysis. The results of using this method showed that the best deposition conditions were a $CoSO_4$ concentration of 0.082 mol/l, a solution pH of 9, a $KReO_4$ concentration of 0.0003 mol/l and sodium hypophosphite concentration of 0.1 mol/L at $80^{\circ}C$. The thermal stability of the Co (Re,P) layer as a barrier preventing Cu was evaluated using Auger electron spectroscopy and a Scanning calorimeter. The measurement results showed that Re impurities stabilized the h.c.p. phase up to $550^{\circ}C$ and that the Co (Re,P) film efficiently blocked Cu diffusion under an annealing temperature of $400^{\circ}C$ for 1hr. The good barrier properties that were observed can be explained by the nano-sized grains along with the blocking effect of the impurities at the fast diffusion path of the grain boundaries. The transformation temperature from the amorphous to crystal structure is increased by doping the Re.