• Title/Summary/Keyword: Copper catalyst

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Synthesis of 2-Substituted Benzofurans from o-Iodophenols and Terminal Alkynes with a Recyclable Palladium Catalyst Supported on Nano-sized Carbon Balls under Copper- and Ligand-Free Conditions

  • Yum, Eul Kgun;Yang, Ok-Kyung;Kim, Ji-Eun;Park, Hee Jung
    • Bulletin of the Korean Chemical Society
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    • v.34 no.9
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    • pp.2645-2649
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    • 2013
  • We have developed a one-step synthesis of benzofurans from o-iodophenol and various terminal alkynes, by using Pd catalyst supported on nano-sized carbon balls (NCB) under copper- and ligand free conditions. This recyclable catalyst could be reused more than 5 times in the same heteroannulation reaction. The results have demonstrated that diverse 2-substituted benzofurans with tolerant functional groups can be prepared simply and conveniently under these conditions.

Effects of Hardeners and Catalysts on the Reliability of Copper to Copper Adhesive Joint (Cu-Cu 접착부의 고온고습 내구성에 미치는 경화제 및 촉매제의 영향)

  • Min, Kyung-Eun;Kim, Hae-Yeon;Bang, Jung-Hwan;Kim, Jong-Hoon;Kim, Jun-Ki
    • Korean Journal of Materials Research
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    • v.21 no.5
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    • pp.283-287
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    • 2011
  • As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.

Effect of Pt Layers on the Photoelectrochemical Properties and Stability of a Copper Oxide/n-Si Electrode (Copper oxide/n-Si 전극의 광전기화학 변환 특성과 안정성에 미치는 Pt 층의 영향)

  • 윤기현;홍석건;강동헌
    • Journal of the Korean Ceramic Society
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    • v.37 no.3
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    • pp.263-270
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    • 2000
  • The Pt/copper oxide/n-Si electrodes were fabricated by depositing copper oxide thin film of 500${\AA}$ and very thin Pt layer on the n-type (100) Si substrate. hotoelectrochemical properties and stability profiles of the electrodes were investigated as a function of deposition time of Pt layer. As the deposition time of Pt layer increased up to 10 seconds, the photocurrent and quantum efficiency were increased and then decreased with further depositing time. The better cell stability was observed for the electrode with longer deposition time. The improvements in above photoelectrochemical properties indicate that Pt layer acts as a catalyst layer at electrode/electrolyte interface as well as a protective layer. The decreasing tendency of the photocurrent and efficiency for the electrode with Pt layer deposited above 20 seconds was explained as an increases in probbility of electron-hole pair recombination and also the absorbing photon loss at electrode surface due to the excessive thickness of Pt layer. The results were confirmed by impedance spectroscopy, mutiple cycle voltammograms and microstructural analyses.

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Synthesis of C9-Alcohol through C9-Aldehyde Hydrogenation over Copper Catalysts (구리 촉매 상에서 C9-알데히드의 수소화 반응에 의한 C9-알코올 합성)

  • Park, Young-Kwon;Noh, Sang Gyun;Cho, Kyu Sang;Jeon, Jong-Ki
    • Korean Chemical Engineering Research
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    • v.44 no.4
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    • pp.363-368
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    • 2006
  • This study selected the optimal catalyst for the process of producing $C_9$-alcohol by hydrogenating $C_9$-aldehyde, and carried out an experiment in order to establish the operating condition for maximizing the yield of $C_9$-alcohol. The BET surface area and the specific area of copper were most excellent in $CuO/ZnO/Al_2O_3$ (60:30:10 wt%) catalyst produced using acetate as a precursor of copper and $Na_2CO_3$ as a precipitant, and the catalyst also showed the highest performance in $C_9$-aldehyde hydrogenation. Using a trickle bed reactor loaded with optimized catalyst, we attained 94.1 wt% yield of $C_9$-alcohol under the condition of $175^{\circ}C$, 800 psi and $WHSV=3hr^{-1}$. According to the result of comparing with other catalysts used in the hydrogenation of aldehyde, the catalyst showed similar performance to that of Ni/kieselghur and higher than that of $Cu-Ni-Cr-Na/Al_2O_3$ and $Ni-Mo/Al_2O_3$. According to the result of examining the stability of the catalyst through a long-term catalysis test, the yield of $C_9$-alcohol decreased slowly after around 72 hours due to the increasing production of high boiling-point byproducts.

Temperature Control in Autothermal Reforming Reactor (메탄올 자열 개질 반응기에서의 온도제어)

  • Kim, Song Joo;Nam, Ji Hoon;Lee, Jietae;Kim, Dong Hyun
    • Korean Chemical Engineering Research
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    • v.45 no.1
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    • pp.12-16
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    • 2007
  • Temperature control of an autothermal methanol reforming reactor which uses the copper-zinc oxide catalyst was studied. Temperature at 1cm below the hot-spot point in the reactor was used for the controlled variable, and the air flow rate was used for the manipulated variable. A first order plus time delay model was identified and controller parameters were obtained by applying the IMC-PI tuning rule to the identified model. With this controller, we could control the reforming reactor temperature within ${\pm}5^{\circ}C$ over 100 hours. Change of the hot-spot point due to the catalyst degradation was investigated and it could be used to design an adaptive controller.

Hydrogenation of Methyl Dodecanoate Using Copper Chromite (분산액에서의 Copper Chromite 합성 및 Methyl Dodecanoate의 수소화반응)

  • Kang, Ho-Cheol;Lee, Sang-Hoon;Park, Jong-Mok;Kim, Dong-Pyo;Lee, Byung Min
    • Applied Chemistry for Engineering
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    • v.20 no.2
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    • pp.201-207
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    • 2009
  • The hydrogenation reaction of methyl dodecanoate for the synthesis of 1-dodecanol has been carried out in the presence of a copper chromite catalyst. The catalysts were synthesized by ceramic method, co-precipitation, and improved co-precipitation method and the particles were characterized by SEM and XRD. Also, the products of the reaction were assigned by GC, GC/MSD and NMR. The particles synthesized by each method showed (1) a spherical shape with the size of 3.2 to $7.0{\mu}m$, (2) an agglomerated spherical shape with the size of 50 to 500 nm and (3) a spherical shape with smaller particle size, respectively. Especially, in order to control the size of particles, the particles were synthesized in various dispersant solutions as Span 80, polyacrylate, and polyethyleneglycols (PEGs). The particles synthesized in PEG (Mw = 4000) solution showed the smallest particle size of 30 to 50 nm and the regularity of the particle size distribution. Our experimental results elucidated that the activity of catalyst for hydrogenation increases with decreasing the size of catalyst particle. The highest yield of dodecanol in the hydrogenation reaction was 95.5% when copper chromite synthesized in the PEG solution was used as a catalyst in the optimized reaction condition.

Ultrasound Assisted Sn-Ag-Pd Activation Process for Electroless Copper Plating (무전해 동 도금을 위한 초음파 적용 주석-은-팔라듐 활성화 공정에 대한 연구)

  • Lee, Chang-Myeon;Hur, Jin-Young;Lee, Hong-Kee
    • Journal of the Korean institute of surface engineering
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    • v.47 no.6
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    • pp.275-281
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    • 2014
  • An ultrasound-assisted Sn-Ag-Pd activation method for electroless copper plating was presented in this study. With this activation process, it was shown that the fine catalyst particles were homogeneously distributed with high density on the entire specimen. In addition, it was observed that incubation period occurred during the electroless plating step was decreased owing to the absorption of Ag which holds high catalytic activity. Resulting from the refinement and high densification of catalyst, the defect-free gap-fill was achieved within the 20x nm trench.