• 소성∙가공
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• 제19권3호
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• pp.179-184
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• 2010

The present study is focused on the deep drawability and product qualities of ultra thin beryllium copper sheet metal. The goal of this research is to investigate the limit drawing ratio in deep drawing of ultra thin beryllium copper metal. For the experiment, beryllium copper(C1720, $50{\mu}m$ in thickness) is used. Tensile test are also carried out to find out the material properties. Deep drawing experiments are carried out in Universal Testing Machine(UTM) to obtain limit drawing ratio. Deep drawing tests are carried out for various specimen sizes. Teflon film is used as a lubricant and constant blank holding force is imposed. Sheet thickness and surface hardness are measured along radial direction after deep drawing. Thickness is measured using optical microscope. For beryllium copper(C1720), the maximum LDR of 2.4 is obtained when the die shoulder radius is 20 or 30 times of sheet thickness.

• Journal of Welding and Joining
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• 제13권3호
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• pp.55-64
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• 1995

Metallizing method on ceramic surface is one of the compositing technology of ceramics and metal. The purpose of this study is to make HIC (Hybrid Intergrated Circuit) with copper metallizing method of which copper layer is formed on ceramic substrate by firing in atmosphere in lieu of conventional hybrid microcircuit systems based on noble metal. Metallizing pastes were made from various copper compounds such as Cu$_{2}$O, CuO, Cu, CuS and kaolin. And the screen printing method was used. The characteristics of metallized copper layers were analyzed through the measurement of sheet resistance, SEM, and EDZX. The results obtainted are summarized as follows; 1. The copper metallizing layers on ceramic surface can be formed by firing in air. 2. The metallized layer using Cu$_{2}$O paste showed the smallest sheet resistance among a group of copper chemical compounds. And optimum metallizing conditions are 15 minutes of firing time, 1000.deg.C of firig temperature, and 3 minutes of deoxidation time. 3. The results of EDAX analysis showed mutual diffusion of Cu and Al. 4. The kaolin plays a important role of deepening the penetration of Cu to $Al_{2}$O$_{3}$ ceramics. But if the kaolin content is too much, sheet resistance increases and copper metallizing layer becomes brittle.

• The Korean Journal of Ceramics
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• 제6권3호
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• pp.236-239
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• 2000

Both the X-ray diffraction data of the normal direction in the sample orientation and the pole figure data of three reflections, (111), (200) and (220), were used to do the Rietveld refinement for the copper sheet prepared by a cold rolling process. The agreement between calculated and observed patterns was not satisfactory, which was attributed to the preferred orientation effect of the copper sheet. The Rietveld refinement for the copper sheet could be done successfully by applying the pole density of each reflection obtained from the corresponding inverse pole figure to the X-ray diffraction data of the normal direction. The R-weighted pattern, $R_{wp}$ was 12.99% and the goodness-of-fit indicator, S, was 3.68.

• 센서학회지
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• 제23권4호
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• pp.234-237
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• 2014

In this paper, a copper foil-thick grapheme (thin graphite sheet)-copper foil structure is reported to achieve mechanically strong and high thermal conductive layer suitable for heat spreading components. Since graphene provides much higher thermal conductivity than copper, thick graphene embedded copper layer can achieve higher effective thermal conductivity which is proportional to graphene/copper thickness ratio. Since copper is nonreactive with carbon material which is graphene, chromium is used as adhesion layer to achieve copper-thick graphene-copper bonding for graphene embedded copper layer. Both sides of thick graphene were coated with chromium as an adhesion layer followed by copper by sputtering. The copper foil was bonded to sputtered copper layer on thick graphene. Angstrom's method was used to measure the thermal conductivity of fabricated copper-thick graphene-copper structure. The thermal conductivity of the copper-thick graphene-copper structures is measured as $686W/m{\cdot}K$ which is 1.6 times higher than thermal conductivity of pure copper.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.210.1-210.1
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• 2014

The hexagonal boron nitride (h-BN) sheet, a 2D material like graphene sheet, is comprised of boron and nitrogen atoms. Similar to graphene, h-BN sheet has attractive mechanical properties while it has a wide band gap unlike graphene. Recently, many experimental groups studied the growth of single BN layer by chemical vapor deposition (CVD) method on the copper substrate. To study the initial stage of h-BN growth on the copper surface, we have performed density functional theory calculations. We investigate several adsorption sites of a boron or nitride atom on the Cu surfaces. Then, by increasing the number of adsorbed B and N atoms, we study formation behaviors of the BN flakes on the surface. Several types of BN flakes atoms such as triangular, linear, and hexagonal shapes are considered on the copper surface. We find that the formation of the BN flake in triangular shape is most favorable on the surface. On the basis of the theoretical results, we discuss the growth mechanism of h-BN layer on the copper surfaces in terms of its shapes in the initial stage of growth.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2008년도 추계 학술논문 발표대회
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• pp.173-178
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• 2008

This is green roof bottom system which composed by aluminum valve and glass fiber together as major reinforcement, so the cooper sheet can have root proof, and using recycled tire gel-type membrane waterproofing system which dost not contains VOCs. The copper sheet reduce the plants' root growing, so it helpes to maintain the waterproofing layer and stability of root proofing. Gel type membrane waterproofing system can do waterproofing, stress dispersion, and reducing leakage expansion. So those two materials can help each other to make green roof bottom layer would have the stability and durability.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.439-440
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• 2008

• 열처리공학회지
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• 제21권3호
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• pp.144-149
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• 2008

It has been reported that copper and copper alloys have a large anisotropy of functional properties such as electrical, thermal and mechanical properties, which means that the texture of polycrystalline alloy should be considered to achieve better properties. In this study, the determination of grain growth orientation and texture formation in the cold-rolled, heat-treated and Ni-plated hybrid copper sheets was investigated. Grain growth direction and texture formation were analyzed by the X-ray pole figure. The influence of texture on the mechanical properties could be quantitatively confirmed by the results from the orientation distribution function and the tensile test. The heat-treated texture in the cold-rolled hybrid copper sheet is also investigated and discussed.

• Journal of Magnetics
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• 제20권2호
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• pp.148-154
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• 2015

48-V ISG (Integrated Starter Generator) system has attracted attention to improve the fuel efficiency of ICE (Internal Combustion Engine) vehicle. One of the key components that significantly affects the cost and performance of the 48-V ISG system is the motor. In an ISG motor, the core and copper loss make the motor efficiency change because the motor has a broad driving operated range and more diverse driving modes compared with other motors. When designing an ISG motor, the selection of an electrical steel sheet is important, because the electrical steel sheet directly influences the efficiency of the motor. In this paper, the efficiency of the ISG motor, considering core loss and copper loss, is analyzed by testing different types of electrical steel sheets with respect to the driving speed range and mode. Using the results of a finite element method (FEM) analysis, a method to select the electrical steel sheet is proposed. This method considers the cost of the steel sheet and the efficiency according to driving mode frequency during the design process of the motor. A wound rotor synchronous machine (WRSM) was applied to the ISG motor in this study.

• 한국재료학회지
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• 제29권5호
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• pp.311-316
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• 2019

Transparent conducting electrodes are essential components in various optoelectrical devices. Although indium tin oxide thin films have been widely used for transparent conducting electrodes, silver nanowire network is a promising alternative to indium tin oxide thin films owing to its lower processing cost and greater suitability for flexible device application. In order to widen the application of silver nanowire network, the electrical conductance has to be improved while maintaining high optical transparency. In this study, we report the enhancement of the electrical conductance of silver nanowire network transparent electrodes by copper electrodeposition on the silver nanowire networks. The electrodeposited copper lowered the sheet resistance of the silver nanowire networks from $21.9{\Omega}{\square}$ to $12.6{\Omega}{\square}$. We perform detailed X-ray diffraction analysis revealing the effect of the amount of electrodeposited copper-shell on the sheet resistance of the core-shell(silver/copper) nanowire network transparent electrodes. From the relationship between the cross-sectional area of the copper-shell and the sheet resistance of the transparent electrodes, we deduce the electrical resistivity of electrodeposited copper to be approximately 4.5 times that of copper bulk.