• Journal of the Korean institute of surface engineering
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• v.24 no.3
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• pp.125-136
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• 1991

a mathematical model is presented to describe the current distribution on a rotaing disk electrode under the galvanostatic pulse conlitions. A numerical technique by finite difference method to the transient convective diffusion equation, coordinate transformation and separation of variables to Laplace equation, and an iterative algorithm to solve the above equations simtltaneously with approximate boundary conditions were developed. An experimental investigated based on copper deposition in a copper sulfate-sulfuric acid system was performed and satisfactory agreement was obtained between expermental and theoretical current distribution. The current distribution of copper deposition is secondary current distribution within the experimental conditions. Dimensionless variables, N and J as well as Wagner number were used to determine the criteria for the uniformity of current distribution.

• Journal of the Korean institute of surface engineering
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• v.18 no.3
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• pp.95-104
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• 1985

A study has been made of preferred orientation, crose sectional microstructure, surface morphology and mechanical properties of copper foils fabricated by electrodeposition on 304 stainless steel plate from copper sulfate baths for high speed plating. The preferred orientation of the copper foils changed from the [110] to the [111] to ture with decreasing bath temperature and increasing cathode current density. The foils with the [110] texture had the field oriented texture type structure and the surface of many asperities grooved approximately perpendicular to the subtrate. A specimen with the [111]+[311] texture had the lower strength than one with the [10] texture, if they were obtained under similar electrolysis conditions.

• Journal of the Korean institute of surface engineering
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• v.17 no.1
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• pp.1-6
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• 1984

The fluidized bed electrode reactor(FBER) with conducting particles has been made use of the removal of metals from dilute electroplating rinse water. The electrolysis was carried out under the conditions of diaphragm current density with 2~28A/$dm^2$ and bed expansion with 20~50%. Recirculating batch operations have been shown that the metal concentration dropped exponentially and may be taken down to 10 ppm. And then, the current efficiency at a concentration of 10 ppm copper was 37% under the conditions of 30% bed expansion and 6 A/$dm^2$, and at concentrated electrolyte (2000ppm copper) was over 80% in the range of 8~28A/$dm^2$ and 20~50% bed expansion. One of the technical possibilities of fluidized bed electrolysis is the separation of copper and nickel from a mixed solution of copper and nickel.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.12
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• pp.919-923
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• 2010

Copper pillar tin bump (CPTB) was developed for high density chip interconnect technology. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM -1250 dry film photoresist (DFR), copper electroplating method and Sn electro-less plating method. Mechanical shear strength measurements were introduced to characterize the bonding process as a function of thermo-compression. Shear strength has maximum value with $330^{\circ}C$ and 500 N thenno-compression process. Through the simulation work, it was proved that when the copper pillar tin bump decreased in its size, it was largely affected by the copper oxidation.

• Polymer(Korea)
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• v.25 no.2
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• pp.302-310
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• 2001

Cu/PET film composites were prepared by electroless copper plating method. In order to improve adhesion between electroless Cu plated layer and polyester (PET) film, the effect of pretreatment conditions such as etching method and mixed catalyst composition, and accelerator was investigated. Compared to NaOH etching medium, PET film was more finely etched by HCl solution, resulting in an improvement in adhesion between Cu layer and PET film. However, there were no significant differences in electromagnetic interference shielding effectiveness as a function of etching medium. The surface morphology of Cu plated PET film revealed that Pd/Sn colloidal particles became more evenly distributed in the smaller size by increasing the molar ratio of PdCl$_2$ : SnCl$_2$ from 1 : 4 to 1 : 16. With increasing the molar ratio of mixed catalyst, the adhesion and the shielding effectiveness of Cu plated PET film were increased. Furthermore, HCl was turned out to be a better accelerator than NaOH in order to enhance the activity of the mixed PdCl$_2$/SnCl$_2$ catalyst, which facilitated the formation of more uniform copper deposit on the PET film.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.9-10
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.223-224
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• 2011

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.11-16
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• 2004

Electronic devices are getting smaller due to integration of electronic chip, and heat generated in electronic devices can cause loss of performance and/or reliability of the devices. In this research, metals such as gold, nickel and copper are plated onto a porous membrane by electroless plating method to make an efficient micro-heatsinks. Electroless plating includes sensitization and activation steps in pre-treatment steps. A polycarbonate(PC) membrane was sensitizied, activated and deposited in each metal solution for plating. Among manufactured microfibrils, heat transfer and radiation properties of Ni-microfibril with high surface area were more effective than those of $Au^-$ and Cu-microfibril.

• Polymer(Korea)
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• v.27 no.3
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• pp.235-241
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• 2003

The polyacrylonitrile (PAN)-based activated carbon fibers (ACFs) containing copper metal were electrolytically prepared in introducing the antibacterial activity into ACFs. The antibacterial activity was investigated by dilution test against Staphylococous aureus (S. aureus; gram positive and virulence) and Klebsiella pnemoniae (K. pnumoniae: gram negative and avirulence). The micropore and textural properties of the ACFs containing copper metal were characterized by BET, t-plot, and H-K methods. The ACFs showed slight decreases in BET's specific surface area, micropore volume, and total pore volume as copper metal increased. However, the antibacterial activities of the ACFs were strongly increased against S. aureus as well as K. pnumoniae, which could be attributed to the presence of copper metal in CU/ACFs systems.

• Korean Journal of Materials Research
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• v.20 no.10
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• pp.555-558
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• 2010

This study examined the effect of current density on the surface morphology and physical properties of copper plated on a polyimide (PI) film. The morphology, crystal structure, and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity was controlled using current density. Large particles were observed on the surface of the copper layer electroplated onto a current density of 25 mA/$cm^2$. However, a uniform surface and lower resistivity were obtained with a current density of 10 mA/$cm^2$. One of the important properties of FCCL is the flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density rather than a high current density. Moreover, a reasonable current density is 20 mA/$cm^2$ considering the productivity and mechanical properties of copper foil.