• Journal of the Korean Ceramic Society
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• v.49 no.5
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• pp.417-422
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• 2012

Copper nano particles have been considered as the materials for conductive ink due to its good thermal, electrical conductivity and low cost. However, copper nanoparticles oxidize easily, decreasing dispersion stability and electrical conductivity. Therefore, it is important to develop a method to minimize oxidation of copper nano particles to improve its dispersion stability property in copper nano ink. In this study, copper nano particles were coated with 1-Octanethiol VSAM(Vaporized Self Assembled Multilayers) to prevent oxidation and coated copper powders were dispersed in conductive ink successfully by studying its relationship of different chain length of solvents to 1-Octanethiol coating layer to fabricate nano ink. Various alcohol solvents, such as 1-Hexanol, 1-Octanol, and 1-Decanol were used. The coating layer was observed using FESEM and TEM. Furthermore, dispersion of copper nano particles in nano inks, was characterized using Turbiscan analyzer, viscometer, and contact angle measurement tool.

• Journal of Power System Engineering
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• v.14 no.4
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• pp.50-55
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• 2010

In order to investigate tribological effects of nano copper particles impregnated(CuN) on surface polytetrafluoroethylene(PTFE) on sealing wear and an experimental study was carried out to determine the wear behavior of copper nano-particles impregnation two kind thickness in super critical $CO_2$ liquid. Experimental results showed that the friction coefficients of CuN PTFE at the low sliding speed(0.44m/s) and the oil temperature ($60^{\circ}C$) were higher than that of virgin PTFE. And a thin nano copper particles impreganated thickness was formed on the surface in the PTFE and the specimen with this treatment has much better friction properties than the original one. Fortunately, at the high load(80 N) and the oil temperature, the friction coefficient of CuN PTFE was lower than that of virgin PTFE. This evidenced the load carrying capacity of CuN PTFE was much better than that of virgin PTFE under the high load condition(80 N) specially. Therefore, it can be concluded that the friction coefficient variation of CuN PTFE is very small but its wear rate decreases greatly with increase in sliding speed.

• Advances in nano research
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• v.5 no.4
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• pp.359-372
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• 2017

Metallic copper nanoparticles were synthesised by reduction of copper ions in aqueous solution, and metal-metal bonding by using the nanoparticles was studied. A colloid solution of metallic copper nanoparticles was prepared by mixing an aqueous solution of $CuCl_2$ (0.01 M) and an aqueous solution of hydrazine (reductant) (0.2-1.0 M) in the presence of 0.0005 M of citric acid and 0.005 M of n-hexadecyltrimethylammonium bromide (stabilizers) at reduction temperature of $30-80^{\circ}C$. Copper-particle size varied (in the range of ca. 80-165 nm) with varying hydrazine concentration and reduction temperature. These dependences of particle size are explained by changes in number of metallic-copper-particle nuclei (determined by reduction rate) and changes in collision frequency of particles (based on movement of particles in accordance with temperature). The main component in the nanoparticles is metallic copper, and the metallic-copper particles are polycrystalline. Metallic-copper discs were successfully bonded by annealing at $400^{\circ}C$ and pressure of 1.2 MPa for 5 min in hydrogen gas with the help of the metalli-ccopper particles. Shear strength of the bonded copper discs was then measured. Dependences of shear strength on hydrazine concentration and reduction temperature were explained in terms of progress state of reduction, amount of impurity and particle size. Highest shear strength of 40.0 MPa was recorded for a colloid solution prepared at hydrazine concentration of 0.8 M and reduction temperature of $50^{\circ}C$.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.434-434
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• 2011

Electrochemical method have been employed in this work to modify the chemical vapour deposited nitrogen doped hydrogen amorphous diamond-like carbon (N-DLC) film to fabricate nickel and copper nano particle modified N-DLC electrodes. The electrochemical behaviour of the metal nano particle modified N-DLC electrodes have been characterized at the presence of glucose in electrolyte. Meanwhile, the N-DLC film structure and the morphology of metal nano particles on the N-DLC surface have been investigated using micro-Raman spectroscopy, X-ray photoelectron spectroscopy and atomic force microscopy. The nickel nano particle modified N-DLC electrode exhibits a high catalytic activity and low background current, while the advantage of copper modified N-DLC electrode is drawn back by copper oxidizations at anodic potentials. The results show that metal nano particle modification of N-DLC surface could be a promising method for controlling the electrochemical properties of N-DLC electrodes.

• Journal of Powder Materials
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• v.18 no.6
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• pp.546-551
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• 2011

Ag spot-coated Cu nanopowders were synthesized by a hydrothermal-attachment method (HA) using oleic acid capped Ag hydrosol. Cu nano powders were synthesized by pulsed wire exploding method using 0.4 mm in diameter of Cu wire (purity 99.9%). Synthesized Cu nano powders are seen with comparatively spherical shape having range in 50 nm to 150 nm in diameter. The oleic acid capped Ag hydrosol was synthesized by the precipitation-redispersion method. Oleic acid capped Ag nano particles showed the narrow size distribution and their particle size were less than 20 nm in diameter. In the case of nano Ag-spot coated Cu powders, nanosized Ag particles were adhered in the copper surface by HAA method. The components of C, O and Ag were distributed on the surface of copper powder.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.545-545
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• 2007

Recently, innovative process has been investigated in order to replace the conventional high-cost micro patterning processes on the electronic products. To produce desirable profit margins from this low cost products, printed circuit board(PCB), will require dramatic changes in the current manufacturing philosophies and processes. Innovative process using metal nano particles replaces the current industry standard of subtractive etched of copper as a highly efficient way to produce robust circuitry on low cost substrates. An advantage of using metal nano particles process in patterned conductive line manufacturing is that the process is additive. Material is only deposited in desired locations, thereby reducing the amount of chemical and material waste. Simply, it just draws on the substrate as glass epoxy or polyimide with metal nano particles. Particles, when their size becomes nano-meter scale, show some specific characteristics such as enhanced reactivity of surface atoms, decrease in melting point, high electric conductivity compared with the bulk. Melting temperature of metal gets low, the metal nano particles could be formated onto polymer substrates and sintered under $300^{\circ}C$, which would be applied in PCB. It can be getting the metal line of excellent electric conductivity.

• Journal of Powder Materials
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• v.15 no.3
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• pp.227-233
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• 2008

Dynamic plastic deformation behavior of copper particles occurred during the cold spray processing was numerically analyzed using the finite element method. The study was to investigate the impact as well as the heat transfer phenomena, happened due to collision of the copper particle of $20{\mu}m$ in diameter with various initial velocities of $300{\sim}600m/s$ into the copper matrix. Effective strain, temperature and their distribution were investigated for adiabatic strain and the accompanying adiabatic shear localization at the particle/substrate interface.

• Particle and aerosol research
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• v.6 no.1
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• pp.37-46
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• 2010

Cu nano-colloid was prepared by wire electric explosion process under de-mineralized water and anhydrous ethanol. To control the properties of Cu nano-colloid, experimental conditions such as diameter of Cu wire and applied voltage were changed. The optimal Cu nano-colloid was prepared when the 0.1mm diameter of Cu wire with the applied voltage of 2000 V was used. The shape of Cu particles in colloid was spherical and the XRD result revealed that the phase of Cu particles was cubic phase. About 20nm Cu nanoparticles with high crystallinity were successfully prepared using wire explosion process under anhydrous ethanol and they showed more than 100 hours dispersion stability.

• The Journal of the Korea Contents Association
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• v.20 no.6
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• pp.425-432
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• 2020

For this study copper ions-containing bioactive glass nanoparticles commonly used in mineral trioxide aggregate (MTA) was developed to improve the mechanical properties and promote antibacterial effect of MTA with the original material. The mechanical properties and antibacterial activity of Cu-BGn incorporating varying amounts cooper incorporated bioactive glass nano particles(BGn) 0.5,1.0,2.0 and 4.0 wt% in MTA were characterized composition of the resulting were investigated. The compressive strength was calculated by weighing specimens with a diameter of 4 mm and a thickness of 6 mm according to ISO 6876 (2012). The antimicrobial effect was evaluated using two strains of S. mutans and E. faecalis. The mechanical properties of the test results was Cu-BGn increased no statistically significant difference was observed (p>0.05). Adhesion experiment results S. mutans in contrast to the control group Ortho MTA, 4.0 wt% of Cu-BGn added experimental group showed a significant difference was observed (p<0.05). Also, E. faecalis statistical analysis indicated a significant difference for antibacterial agents between control and Cu-BGn containing(p<0.05). It seems that this Cu-BGn proved that even a antibacterial effect was demonstrated. Therefore, it was suggest that it is necessary for in-depth research into various environments that can reproduce the oral environment.

• Applied Chemistry for Engineering
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• v.33 no.6
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• pp.574-580
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• 2022

While in the process of electroless plating of dendrite-shape copper with silver, various silver-coated copper (Ag@Cu) particles were prepared by using both displacement plating and reducing electroless plating. The physicochemical properties of Ag@Cu particles were analyzed by scanning electron microscope- energy-dispersive X-ray spectroscopy (SEM-EDS), thermogravimetric analysis (TGA), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD) and Brunauer-Emmett-Teller analysis (BET), and it was confirmed that the silver coated by the reducing electroless plating was formed as nano-particles on the copper surface. Ag@Cu particles were compounded with an epoxy resin to prepare a conductive film, and its thermal stability was evaluated. We investigated the effect of the difference between the displacement plating and reducing electroless plating on the initial resistance and thermal stability of conductive films.