• Korean Journal of Metals and Materials
• /
• v.47 no.4
• /
• pp.256-260
• /
• 2009

This study examined the effects of plated temperature on the surface morphology and property of an electrodeposited copper foil. The morphology, crystal structure and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity could be controlled using various temperature of electrolyte. Large particles were observed on the surface of the copper layer electroplated onto the $30^{\circ}C$. However, a uniform surface, lower resistivity and high flexibility were obtained when a $50^{\circ}C$ electrolyte was used.

• Composites Research
• /
• v.35 no.3
• /
• pp.182-187
• /
• 2022

In this paper, the thickness of a multilayer PCB was predicted through an empirical formulation based on the physical properties of the prepreg used in multilayer PCB. Since the thickness of prepreg reduction when manufacturing a PCB due to the physical properties and copper foil residual rate, it is necessary to accurately predict the thickness of the PCB through the thickness empirical formulation. To determine the density of the prepreg, the mass and thickness of the prepreg were measured. To manufacture the CCL, the prepreg and copper foil were laminated using a hot press machine, and the thickness was measured using a microscope and micrometer. An 8-layerd PCB was designed with different circuit densities to measure the change in the thickness with the copper foil residual ratio, and the proposed empirical formulation was verified by comparing the measured thickness with the value obtained using the empirical formulation. As a result, the errors for the CCL and multilayer PCB were 2.56% and 4.48%, respectively, which demonstrated the reliability of the empirical formulation.

• Tribology and Lubricants
• /
• v.21 no.2
• /
• pp.71-76
• /
• 2005

This paper compares of mechanical tensile properties of 6 kinds of copper foil. The beam lead made with copper foil. Different from other package type such as plastic package, Chip Size Package has a reliability problem in beam lead rather than solder joint in board level. A new tensile loading system was developed using voice-coil actuator. The new tensile loading system has a load cell with maximum capacity of 20 N and a non-contact position measuring system based on the principle of capacitance micrometry with 0.1nm resolution for displacement measurement. Strain was calculated from the measured displacement using FE analysis. The comparison of mechanical properties helps designer of package to choose copper for ensuring reliability of beam lead in early stage of semiconductor development.

• Bulletin of the Korean Chemical Society
• /
• v.31 no.8
• /
• pp.2283-2288
• /
• 2010

Nanostructured copper compounds were grown by electrochemical anodization of copper foil in aqueous NaOH under varying conditions including electrolyte concentration, reaction temperature, current density, and reaction time. Their morphology and atomic composition were investigated by using SEM, TEM, XRD, EDS and XPS. At the conditions ([NaOH] = 1 M, $20^{\circ}C$, $2\;mA\;cm^{-2}$), wire-like orthorhombic $Cu(OH)_2$ nanobundles with an average width of 100 - 300 nm and length of $10\;{\mu}m$ were synthesized with the preferential [100] growth direction. Furthermore, when the concentration decreased to 0.5 M NaOH, the 1D nanobundle structure became narrower and longer without any change in compositions or crystalline structure. Side reaction pathways appeared to compete with the 1D nanostructure formation channels: the formation of CuO nanoleaves at $50^{\circ}C$ via the sequential dehydration of $Cu(OH)_2$, CuO/$Cu_2O$ aggregates in 4 M NaOH, and $Cu_2O$ nanoparticles and CuO nanosheets at lower current density.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.30 no.2 s.245
• /
• pp.157-163
• /
• 2006

Our research dealt with micro fabrication using micro forming process. The goal of the research was to establish the limit of forming process concerning the size of forming material and formed shape. Flat-rolled ultra thin metallic foils of pure copper(3.0 and $1.0{\mu}m$ in thickness)and stainless steel($2.5{\mu}m$ in thickness) were used for forming material. We obtained the various shapes of micro channels as using designed forming process. $12-14{\mu}m$ wide and $9{\mu}m$ deep channels were made on $3.0{\mu}m$ thick foil and $6{\mu}m$ wide and $3{\mu}m$deep channels were made on $1.0{\mu}m$ thick foil. Si wafer die for forming was fabricated by using etching technique. And the relation of etching time and die dimension was investigated for fabricating precisely die groove. For the forming, die and metal foil were vacuum packed and the forming was conducted with a cold isostatic press. The formed channels were examined in terms of their dimension, surface qualities and potential for defects. Base on the examinations, formability of ultra thin metallic foil was also discussed. Finally, we compared the forming result with simulation. The result of research showed that metal forming technology is promising to produce micro parts.

• Korean Journal of Materials Research
• /
• v.16 no.5
• /
• pp.297-301
• /
• 2006

Si/Mo multilayer anode consisting of active/inactive material was prepared using rf/dc magnetron sputtering. Molybdenum acts as a buffer against the volume change of the Silicon. Multilayer deposited on RT (reversible treatment) copper foil current collector to enhance adhesion between Silicon and copper foil. Deposited Silicon was identified as an amorphous. Amorphous has a relatively open structure than crystal structure, thus prevents the lattice expansion and has many diffusion paths of Li ion. When deposited time of Silicon and Molybdenum is 30 second and 2 second respectably, electrode has more capacity and good cycle stability. A 3000 nm thick multilayer was maintained 99% of the initial capacity (1624 $mAhg^{-1}$) after 100 cycles. As the increase of the multilayer thickness (4500 nm, 6000 nm), Si/Mo mutilayer anodes show aggravation cycle stability.

• Proceedings of the KWS Conference
• /
• 2005.11a
• /
• pp.213-215
• /
• 2005

• Journal of the Korean Ceramic Society
• /
• v.54 no.5
• /
• pp.438-442
• /
• 2017

This paper reports the facile synthesis of microlamella-structured porous copper (Cu)-oxide-based electrode and its potential application as an advanced anode material for lithium-ion batteries (LIBs). Nanowire-like Cu oxide, which is created by a simple thermal oxidation process, is radially and uniformly formed on the entire surface of Cu foam that has been fabricated using a combination of water-based slurry freezing and sintering (freeze casting). Compared to the Cu foil with a Cu oxide layer grown under the same processing conditions, the Cu foam anode with 63% porosity exhibits over twice as much capacity as the Cu foil (264.2 vs. 131.1 mAh/g at 0.2 C), confirming its potential for use as an anode electrode for LIBs.

• 한국신재생에너지학회:학술대회논문집
• /
• 2006.06a
• /
• pp.166-169
• /
• 2006

We fabricated hexagonal copper sulfide $Cu_2S$ nanowires to obtain a larger contact area of $Cu_2S/CdS$ solar cell. Copper sulfide nanowires were grown on Cu foil at room temperature by gas-sol id reaction. The size, density and shape of nanowires seemed to be affected by the change or reaction time temperature, crystallographic orientation of Cu foil, and molar ratio of the mixed gas. We controled the length and the diameter of the nanowires and we obtained suitable nanowire arrays which has fitting size for uniform deposition with n-type CdS. CdS layer was deposited on the nanowire array by electrodeposition and it seemed to be uniform. The $Cu_2S/CdS$ nanowires/CdS junction showed diode characteristics, A large contact area is expected with the $Cu_2S/CdS$ nanowire structure as compared with the $Cu_2S/CdS$ thin film.

• Korean Journal of Metals and Materials
• /
• v.47 no.11
• /
• pp.740-747
• /
• 2009

The purpose of this study is to identify the effect of electrolyte compositions on electrodeposited copper foil. First of all, the polyimide substrate was pretreated with plasma. Finally, copper foil was deposited on a Cu/Ni/Polyimide substrate using the electroplating technique. As the quantity of Cu increased, preferred orientations changed into (111). Increasing sulfuric acid, on the other hand, brought down the preferred orientation of (111). The lowest sheet resistance, surface roughness, and fine adhesion were detected when the ratio of $Cu^{2+}$ and $H_2SO_4$ is 50:50(g/l).