• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.59-61
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• 2015

본고에서는 전해동박의 개발 연혁, 제조 공정 및 주요 적용 사례에 대해 소개한다. 전해동박이 전자 소재에 적용되는 대표적인 사례는 Li 이차전지의 음극 집전체 및 인쇄회로기판의 회로이다. Mobile Device의 슬림화 및 다기능화에 따라 Li 이차전지의 용량 증대 및 인쇄회로기판의 협피치화가 필요하다. 따라서 Li 이차전지의 단위 부피당 용량 증대를 위해서는 음극 집전체로 적용되는 동박은 극박화 및 고강도 특성이 요구되고 있다. 인쇄회로기판의 협피치화에 따라 이들 제품에 적용되고 있는 동박은 두께 및 조도를 저감시키는 방향으로 기술이 전개되고 있다. 본고에서는 전자 소재용으로 적용되고 있는 전해 동박의 최근 제품 및 기술 동향과 향후 제품 전개 방향에 대해 논의하고자 한다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.134-134
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• 2012

패키징용 PCB를 비롯한 대부분의 PCB는 동박을 소재로 사용하게 된다. 패키징용 PCB를 중심으로 한 PCB의 협피치화에 대응하기 위해서 전해동박의 저조도화, 박형화에 대한 필요성이 증대되고 있다. 동박의 제조공정은 드럼상에 Cu를 도금하는 공정(EM 공정), 표면에 조도를 부여하고 내열, 방청성 등을 부여하는 공정(TM공정), 절단하는 공정(SM공정)으로 이루어진다. 동박의 저조도화를 위해서는 EM 및 TM공정의 첨가제 개발 및 저조도 도금 공정 개발이 필요하다. 박형화를 위해서는 얇은 두께에서도 핸들링이 가능하도록 동박의 강도를 높이거나 제조공정을 개선하는 연구가 필요하다. 본 발표에서는 이러한 전해동박의 제조공정을 소개하고 협피치화 대응을 비롯한 전해동박의 개발 방향에 대해서 소개하고자 한다.

• Korean Chemical Engineering Research
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• v.56 no.5
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• pp.705-710
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• 2018

An electrochemical glucose sensor with enzyme-free was fabricated using Pt nanoparticles (Pt NPs) decorated CuO nanoflowers (CuO NFs). 3-D CuO nanoflowers film was directly synthesized on Cu foil by a simple hydrothermal method and Pt NPs were dispersed on the petal surface of CuO NFs through electrochemical deposition. This prepared sample was noted to Pt NPs-CuO NF. Morphology of the Pt NPs-CuO NFs layer was analyzed using scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS). The electrochemical properties and sensing performances were investigated using cyclic voltammetry (CV) and chronoamperometry (CA) under alkaline condition. The sensor exhibited a high sensitivity, wide liner range and fast response time. Its excellent sensing performance was attributed to the synergistic effect of the Pt NPs and CuO nanostructure.

• Journal of the Optical Society of Korea
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• v.13 no.1
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• pp.37-41
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• 2009

We observe the proton signals produced by laser interaction with thin-foil targets of polyimide and of copper. We change the thickness of the polyimide target to $7.5{\mu}m$, $12.5{\mu}m$, and $50{\mu}m$. High-energy protons with the maximum energy of ${\sim}2.3\;MeV$ from $7.5{\mu}m$ thick polyimide are observed. This proton beam with the maximum energy of multi-MeV has various applications such as a proton shadowgraphy.

• Journal of the Korean Ceramic Society
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• v.51 no.6
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• pp.549-553
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• 2014

$CoSb_3$-based skutterudite compounds are candidate materials for thermoelectric power generation in the mid-temperature range (600 - 900 K) because their thermoelectric properties can be enhanced by doping and filling. The joining property of thermoelectric module electrodes containing thermoelectric materials is of great importance because it can dominate the efficiency of the thermoelectric module. This study examined the properties of $CoSb_3$/Al/Ti/CuMo joined by the spark plasma sintering technique. Titanium thin foil was used to prevent the diffusion of copper into $CoSb_3$ and Aluminum thin foil was used to improve the adhesion between $CoSb_3$ and Ti. The insertion of an Aluminum interlayer between the Ti and $CoSb_3$ was effective for joining $CoSb_3$ to Ti by forming an intermediate layer at the Al-$CoSb_3$ boundary without any micro cracks. Specifically, the adhesion strength of the Ti/Al/$CoSb_3$ joining interface showed a remarkable improvement compared with our previous results, without deterioration of electrical property in the interface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.421-421
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• 2008

Generally, the polymer thick-film resistors for embedded organic or hybrid substrate are patterned by screen printing so that the accuracy of resistor pattern is not good and the tolerance of resistance is too high(${\pm}$20~30%). To reform these demerits, a method using Fodel$^{(R)}$ technology, which is the patterning method using a photosensitive resin to be developable by aqueous alkali-solution as a base polymer for thick-film pastes, was recently incorporated for the patterning of thermosetting thick-film resistor paste. Alkali-solution developable photosensitive resin system has a merit that the precise patterns can be obtained by UV exposure and aqueous development, so the essential point is to get the composition similar to PSR(photo solder resist) used for PCB process. In present research, we made the photopatternable resistor pastes using 8 kinds of epoxy acrylates and a conductive carbonblack (CDX-7055 Ultra), evaluated their developing performance, and then measured the resistance after final curing. To become developable by alkali-solution, epoxy acrylate oligomers with carboxyl group were prepared. Test coupons were fabricated by patterning copper foil on FR-4 CCL board, plating Ni/Au on the patterned copper electrode, applying the resistor paste on the board, exposing the applied paste to UV through Cr mask with resistor patterns, developing the exposed paste with aqueous alkali-solution (1wt% $Na_2CO_3$), drying the patterned paste at $80^{\circ}C$ oven, and then curing it at $200^{\circ}C$ during 1 hour. As a result, some test compositions couldn't be developed according to the kind of oligomer and, in the developed compositions, the measured resistance showed different results depending on the paste compositions though they had the same amount of carbonblack.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.1
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• pp.30-34
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• 2010

$CoSb_3$-based skutterudite compounds are promising candidates as thermoelectric (TE) materials used in intermediate temperature region. In this study, sintering of $CoSb_3$ powder and joining of $CoSb_3$ to copper-molybdenum electrode have been simultaneously performed by spark plasma sintering technique. The Ti foil was used for preventing the diffusion of copper into $CoSb_3$ and the Cu : Mo = 3 : 7 Vol. ratio composition was selected by the consideration of thermal expansion coefficients. The insertion of Ti interlayer between Cu-Mo and $CoSb_3$ was effective to join $CoSb_3$ to Cu-Mo by forming an intermediate layer of $TiSb_2$ at the Ti-$CoSb_3$ boundary. However, the formation of TiSb and TiCoSb intermediate layers deteriorated the joining properties by the generation of cracks in the interface of intermediate layer/$CoSb_3$ and intermediate/intermediate layers.

• Korean Journal of Metals and Materials
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• v.50 no.3
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• pp.206-211
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• 2012

Graphene has recently received high attention as a promising material for various applications, and many related studies have been undertaken to reveal its basic mechanical properties. However, the tribological properties of graphene film fabricated by the chemical vapor deposition (CVD) method are barely known. In this study, the contact angle and frictional wear characteristics of graphene coated copper film were investigated under room temperature, normal air pressure, and no lubrication condition. The contact angle was measured by sessile drop method and the wear test was carried out under normal loads of 660 mN and 2940 mN, respectively. The tribological behaviors of a graphene coating layer were also examined. Compared to heat treated bare copper foil, the graphene coated one shows a higher contact angle and lower friction coefficient.

• Korean Journal of Metals and Materials
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• v.49 no.8
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• pp.657-663
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• 2011

This study represents the results of the peel strength and surface morphology according to the preprocessing times of polyimide (PI) in a Cu/Ni/PI structure flexible copper clad laminate production process based on the polyimide. Field emission scanning electron microscopy, X-ray diffraction, and X-ray photoelectron spectroscopy were used to analyze the surface morphology, crystal structure, and interface binding structure of sputtered Ni, Cu, and electrodeposited copper foil layers. The surface roughness of Ni, Cu deposition layers and the crystal structure of electrodeposited Cu layers were varied according to the preprocessing times. In the RF plasma times that were varied by 100-600 seconds in a preprocessing process, the preprocessing applied by about 300-400 seconds showed a homogeneous surface morphology in the metal layers and that also represented high peel strength for the polyimide. Considering the effect of peel strength on plastic deformation, preprocessing times can reasonably be at about 400 seconds.

• Journal of Conservation Science
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• v.35 no.3
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• pp.187-196
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• 2019

Bronzes excavated from a Gulsansa temple site in Gangneung were investigated in order to study the production of technology and provenance in this area. The bronze artifacts were discovered to consist of copper-tin or copper-tin-lead alloys using chemical analysis(EDS and EPMA). The excavated bronzes were manufactured using a casting or hammering process, and a bronze belt was gilded with gold foil. The provenance of 25 bronzes was studied using lead isotope analysis(TIMS and LA-MC-ICPMS). The results reveal the use of raw materials found near the excavated site. The object of this study was to investigate the manufacturing techniques and provenance in Gangneung without the need for a lot of data. Our results will contribute to the study of Gulsansa and bronze artifacts in Goryo(12-13th century).