• 한국재료학회지
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• 제12권1호
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• pp.58-67
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• 2002

In this study copper chloride(CuCl$_2$) solution was used as raw material to produce the fine copper oxide powder which has less than 1 $\mu\textrm{m}$ average particle size and has uniform particle size distribution by spray pyrolysis process. In the present study, the effects of reaction temperature, the injection speed of solution and air, the nozzle tip size and the concentration of raw material solution on the properties of produced powder were studied. The structure of the powder became much more compact with increasing the reaction temperature regardless of copper concentration of the raw material solution. The particle size of the powder increased accordingly with increasing the reaction temperature in case of 30 g/$\ell$ copper concentration of the solution. The particle size of the powder increased accordingly, and the surface structure of the powder became more porous with increasing the copper concentration of the raw material solution. When copper concentration in raw material solution was more than 100 g/$\ell$, all produced powder was CuCl regardless of reaction temperatures. When copper concentration in solution was below 30 g/$\ell$ and reaction temperature was higher than 90$0^{\circ}C$, CuO was the main phase. The surface of the powder tended to become porous with increasing the injection speed of solution. Particle size was increased and the surface of the powder showed severely disrupted state with increasing the nozzle tip size. The particle size was decreased and the particle size distribution was more uniform with increasing the air pressure through the nozzle.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1934-1937
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• 1999

A copper-tungsten sintered alloy(Cu-W) has been friction-welded to a tough pitch copper (Cu) in order to investigate friction weldability. The tensile strength of the friction welded joint was increased up to 87% of the Cu base metal under the condition of friction time 1.0 see, friction pressure 40MPa and upset pressure 100MPa, upset time 5.0 sec. And it is related to upset pressure rather than friction time. Mixed layer was formed in the Cu adjacent weld interface and W particles which were included in mixed layer could induce fracture in the Cu adjacent to the weld interface. Thickness of mixed layer was reduced as upset pressure increase.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.138.2-138.2
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• 2013

Copper oxide is a multi-functional material being used in various research areas including catalysis, electrochemical materials, oxidizing agents etc. Among these areas, we have synthesized and utilized graphene based copper oxide nanocomposites (CuOx/Graphene) for the catalytic applications (C-N cross coupling reaction). Briefly, Cu precursors were anchored on the graphite oxide(GO) sheets being exfoliated and oxidized from graphite powder. Two different crystalline structures of Cu2O and CuO on graphene and GO were prepared by annealing them in Ar and O2 environments, respectively. The morphological and electronic structures were systemically investigated using FT-IR, XRD, XPS, XAFS, and TEM. Here, we demonstrate that the catalytic performance was found to depend on oxidative states and morphological structures of CuOx graphene nanocomposites. The relationship between the structure of copper oxides and catalytic efficiency toward C-N cross coupling reaction will be discussed.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.430.1-430.1
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• 2016

We present the concept of reducible fugitive material that conformally surrounds core Cu nanowire (NW) to fabricate transparent conducting electrode (TCE). Reducing atmosphere can corrodes/erodes the underlying/surrounding layers and might cause undesirable reactions such impurity doing and contamination, so that hydrogen-/forming gas based annealing is impractical to make device. In this regards, we introduce novel reducible shell conformally surrounding indivial CuNW to provide a protection against the oxidation when exposed to both air and solvent. Uniform copper lactate shell formation is readily achievable by injecting lactic acid to the CuNW dispersion as the acid reacts with the surface oxide/hydroxide or pure copper. Cu lactate shell prevents the core CuNW from the oxidation during the storage and/or film formation, so that the core-shell CuNW maintains without signficant oxidation for long time. Upon simple thermal annealing under vacuum or in nitrogen atmosphere, the Cu lactate shell is easily decomposed to pure Cu, providing an effective way to produce pure CuNW network TCE with typically sheet resistance of $19.8{\Omega}/sq$ and optical transmittance of 85.5% at 550 nm. Our reducible copper lactate core-shell Cu nanowires have the great advantage in fabrication of device such as composite transparent electrodes or solar cells.

• 비파괴검사학회지
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• 제30권5호
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• pp.444-450
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• 2010

본 연구에서는 전류 4단자 전위차법을 이용한 전기비저항을 측정하여 반복피로손상을 받은 구리와 구리합금의 미시적 열화를 평가하였다. 서로 매우 다른 적층결함 에너지를 갖는 구리(Cu)와 구리합금(Cu-35Zn)에 대해 반복피로손상을 가하고 이들 재료에서 발달한 전위구조와 전기비저항 간의 관계를 연구하고자 하였다. Cu는 전위셀 하부구조를 형성하였지만, Cu-35Zn 합금은 피로사이클에 따라서 전위밀도는 증가하고 평면배열의 전위구조를 형성하였다. 전기비저항은 두 재료 모두에서 피로변형 초기 단계에서 급격하게 증가하였다. 더욱이, 피로시험 후 구리는 약 7 % 그리고 구리 합금은 약 6.5 % 변하였다. 이러한 일관적인 결과들로부터, 반복적인 피로에 의해 발달한 전위 셀구조는 평면배열의 전위구조보다도 전기비저항에 매우 민감한 것으로 판단된다.

• 공업화학
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• 제7권6호
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• pp.1053-1060
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• 1996

Sodium amide에 의한 methyl propyl ketone과 ethyl formate의 반응으로 킬레이트 추출제의 하나인 $\beta$-ketohexanal(이하 KHA)를 합성하고, KHA-클로로포름에 의한 구리의 추출평형 실험을 통하여 추출특성을 고찰하였다. 흡광도를 측정하여 추출제 KHA의 상간 분배계수와 해리상수, KHA와 구리간 킬레이트의 안정도 상수와 분배계수 및 총괄 추출 평형상수등을 구하고, 추출기구를 구명하였다 합성한 추출제에 의한 구리의 추출율은 pH 5 이상에서 거의 100%이었고, Cu-Zn-Cd 혼합 금속으로부터 구리의 선택적 추출이 가능하였다. KHA-클로로포름에 의한 구리의 추출 화학종은 $CuR_2$였으며 추출 평형 식은 $Cu^{2+}+2{\overline{HR}}{\rightarrow}{\overline{CuR{_2}}}+2H^+$로 표시되었다.

• Bulletin of the Korean Chemical Society
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• 제29권9호
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• pp.1711-1716
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• 2008

The reaction of copper(II) chloride with phenyl-N-[(pyridine-2-yl)methylene]methaneamide (ppmma) leads to a new $\mu$ -chloro bridged dimeric [Cu(ppmma)$Cl_2$]$_2$ complex, whereas a reaction of copper(II) bromide with ppmma affords a monomeric Cu(ppmma)$Br_2$ complex. Both complexes have been characterized by X-ray crystallography and electronic absorption spectroscopy. The crystal structural analysis of [Cu(ppmma)$Cl_2$]$_2$ shows that the two Cu(II) atoms are bridged by two chloride ligands, forming a dimeric copper(II) complex and the copper ion has a distorted square-pyramidal geometry ($\tau$ = 0.2). The dimer units are held through a strong intermolecular $\pi-\pi$ interactions between the nearest benzyl rings. On the other hand, Cu(ppmma)Br2 displayed a distorted square planar geometry with two types of strong intermolecular π-π interaction. EPR spectrum of [Cu(ppmma)$Cl_2$]$_2$ in frozen glas s at 77 K revealed an equilibrium between the mononuclear and binuclear species. The magnetic susceptibilities data of [Cu(ppmma)$Cl_2$]$_2$ and Cu(ppmma)$Br_2$ follow the Curie-Weiss law. No significant intermolecular magnetic interactions were examined in both complexes, and magnetic exchange interactions are discussed on the basis of the structural features.

• Asian-Australasian Journal of Animal Sciences
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• 제29권11호
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• pp.1608-1615
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• 2016

This study was conducted to determine the solubility of copper (Cu) in two sources of copper(II) sulfate ($CuSO_4$) including monohydrate and pentahydrate and three sources of dicopper chloride trihydroxide (dCCTH) including ${\alpha}$-form (dCCTH-${\alpha}$), ${\beta}$-form (dCCTH-${\beta}$), and a mixture of ${\alpha}$- and ${\beta}$-form (dCCTH-${\alpha}{\beta}$) at different pH and a 3-step in vitro digestion assay for pigs. In Exp. 1, Cu sources were incubated in water-based buffers at pH 2.0, 3.0, 4.8, and 6.8 for 4 h using a shaking incubator at $39^{\circ}C$. The $CuSO_4$ sources were completely dissolved within 15 min except at pH 6.8. The solubility of Cu in dCCTH-${\alpha}$ was greater (p<0.05) than dCCTH-${\beta}$ but was not different from dCCTH-${\alpha}{\beta}$ during 3-h incubation at pH 2.0 and during 2-h incubation at pH 3.0. At pH 4.8, there were no significant differences in solubility of Cu in dCCTH sources. Copper in dCCTH sources were non-soluble at pH 6.8. In Exp. 2, the solubility of Cu was determined during the 3-step in vitro digestion assay for pigs. All sources of Cu were completely dissolved in step 1 which simulated digestion in the stomach. In Exp. 3, the solubility of Cu in experimental diets including a control diet and diets containing 250 mg/kg of additional Cu from five Cu sources was determined during the in vitro digestion assay. The solubility of Cu in diets containing additional Cu sources were greater (p<0.05) than the control diet in step 1. In conclusion, the solubility of Cu was influenced by pH of digesta but was not different among sources based on the in vitro digestion assay.

• Imaging Science in Dentistry
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• 제30권2호
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• pp.101-108
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• 2000

Purpose : The effects of step numbers of copper wedge and exposure on the coefficient of determination (r²) of the conversion equation to Cu-equivalent image and on the Cu-equivalent value (mmCu) and it's coefficient of variation measured at each copper step and the mandibular premolar area were evaluated. Method: Digital image analyzing system consisted of scanner, personal computer, and a stepwedge with 10 steps of 0.03 mm copper in thickness as reference material was prepared for quantitative assessment of the bone mineral density. NIH image program was used for analyzing images. Results : The film having moderately high film density showed the discrepancy between the real thickness and the measured Cu-equivalent value of each copper step. The Cu-equivalent image was dependent on the determinational coefficient of the conversion equation than the coefficient of variance of the measured value. Conclusion : Obtaining conversion equation with high coefficient of determination and proper film exposure are supposed to be neccessary for quantitative assessment of bone density. Multiple steps in the range of the corresponding copper thickness to the bone density of the area to be measured should be prepared.

• 한국재료학회지
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• 제4권4호
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• pp.393-400
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• 1994

1$\mu \textrm{m}$이하의 텅스텐 분말에 구리를 균일하게 코팅하는 공정을 새로이 개발했다. 구리가 코팅된 $\mu \textrm{m}$이하의 텅스텐 분말을 이용하여 액상소결하였으며, 구리가 균일하게 분포된 W-Cu합금을 얻을 수있었다. 본 연구에서 개발된 방법에 의해 구리의 함유량을 10wt.%이하로 낮추면서도 균일한 W-Cu합금을 얻을 수 있었으며, 특히 코발트를 같은 방식에 의해 첨가하면 구리액상이 형성된 후 급격히 치밀화하여 96% 이상의 상대밀도를 갖는 W-Cu 합금을 제작하는데 성공하였다. 코발트 첨가에 의한 급격한 치밀화의 증가는 텅스텐과 구리액상 사이의 접착성 향상에 기인하는 것으로 밝혀졌다.