• 제목/요약/키워드: Copper

검색결과 6,578건 처리시간 0.04초

Recovery of Nickel and Copper from Scraped Nickel Condensers

  • Liang, Ruilu;Kikuchi, Eiji;Kawabe, Yoshishige;Sakamoto, Hiroshi;Fujita, Toyohisa
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2001년도 The 6th International Symposium of East Asian Resources Recycling Technology
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    • pp.188-192
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    • 2001
  • Magnetic separation and sulphidization-flotation for recovery of nickel and copper from two types of scraped condenser wastes, containing 8- l4% nickel and 2-4% copper, were studied. The effects of magnetic field intensities, classification, and grinding on the recovery of nickel and copper were investigated. According to the characteristics of nickel and copper in the scraps, classification-magnetic separation, different magnetic field intensities, and stages-grinding-cleaning of rough concentrate were investigated. The nickel concentrates containing 38-65% nickel with 84-97% recoveries and the copper concentrates containing 25-43% nickel with 35-60% recoveries were obtained by classification-magnetic separation. In addition, copper concentrates containing 26-45% copper with 76-88% recoveries were obtained by sulphidization-flotation from magnetic tailings and middling products.

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황산구리/치오요소 후처리에 희한 직접염료의 견뢰도 증진에 관한 연구(II) (A Study on Improvement of Fastness on Cotton-dyed Fabric by Aftertreatment with Copper Sulfate/Thiourea)

  • Yoon, Jung Im;Kim, Kyung Hwan
    • 한국염색가공학회지
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    • 제5권4호
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    • pp.1-9
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    • 1993
  • The Cotton fabric was dyed with various directd dyes, and then treated with copper sulfate or copper sulfate/thiourea. Munsell color system, dye exhaustion, tensile strength, light fastness, washing fastness and rubbing fastness were investigated for the treated fabrics. The results obtaind are as follows: 1. The color variation of the cotton-dyed fabric by aftertreatment with copper sulfate was shown redish, but original color with copper sulfate/thiourea. 2. Copper sulfate/thiourea was much more effective than copper sulfate only to increase the light fastness, washing fastness and rubbing fastness. 3. Dye exhaustion of the cotton-dyed fabric by aftertreatment with copper sulfate was decreased about 20% more than those of untreated. 4. Tensile stregth of cotton-dyed fabric by aftertreatment with copper sulfate/thiourea was decrease about 10% more than those of untreated.

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Copper Electrode Material using Copper Formate-Bicarbonate Complex for Printed Electronics

  • Hwang, Jaeeun;Kim, Sinhee;Ayag, Kevin Ray;Kim, Hongdoo
    • Bulletin of the Korean Chemical Society
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    • 제35권1호
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    • pp.147-150
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    • 2014
  • Copper ink has been prepared by mixing copper(II) formate and 2-ethyl-1-hexylammonium bicarbonate (EHABC) to overcome some weak points such as aggregation and degradation of copper nano-type ink. Ink was coated on glass substrate and calcined at $110^{\circ}C$ to $150^{\circ}C$ to generate electrically conductive copper film under two different atmospheres such as nitrogen gas and gaseous mixture of formic acid and methanol. The lowest resistivity of $1.88{\mu}{\Omega}{\cdot}cm$ of copper film was obtained at $150^{\circ}C$ in gaseous formic acid condition. The long-term resistivity shows to increase from $1.88{\mu}{\Omega}{\cdot}cm$ to $2.61{\mu}{\Omega}{\cdot}cm$ after one month.

Copper CMP에서 Electrochemical Plating 두께에 따른 Defect 특성 연구 (Study of defect characteristics by electrochemical plating thickness in copper CMP)

  • 김태건;김남훈;김상용;장의구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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    • pp.125-126
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    • 2005
  • Recently semiconductor devices are required more smaller scale and more powerful performance. For smaller scale of device, multilayer structure is proposed. And, for the higher performance, interconnection material is change to copper, because copper has high EM(Electro-migration)and low resistivity. Then copper CMP process is a great role in a multilayer formation of semiconductor. Copper process is different from aluminum process. ECP process is one of the copper processes. In this paper, we focused on the defects tendency by copper thickness which filled using ECP process. we observed hump high and dishing. Conclusively, hump hight reduced at copper thickness increased Also dishing reduced.

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Surface Modification of Silica Spheres for Copper Removal

  • Kim, Byoung-Ju;Park, Eun-Hye;Kang, Kwang-Sun
    • 대한화학회지
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    • 제60권5호
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    • pp.317-320
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    • 2016
  • Efficient copper removal from water was achieved by using surface modified silica spheres with 3-mercaptopropyltrimethoxysilane (MPTMS) using base catalyst. The surface modification of silica spheres was performed by hydrolysis and condensation reactions of the MPTMS. The characteristic infrared absorption peaks at 2929, 1454, and 1343 cm−1 represent the −CH2 stretching vibration, asymmetric deformation, and deformation, respectively. The absorption peaks at 2580 and 693 cm−1 corresponding the −SH stretching vibration and the C-S stretching vibration indicate the incorporation of MPTMS to the surface of silica spheres. Field emission scanning electron microscope (FESEM) image of the surface modified silica sphere (SMSS) shows nano-particles of MPTMS on the surface of silica spheres. High concentration of copper solution (1000 ppm) was used to test the copper removal efficiency and uptake capacity. The FESEM image of SMSS treated with the copper solution shows large number of copper lumps on the surface of SMSS. The copper concentration drastically decreased with increasing the amount of SMSS. The residual copper concentrations were analyzed using inductively coupled plasma mass spectrometer. The copper removal efficiency and uptake capacity with 1000 ppm of copper solution were 99.99 % and 125 mg/g, respectively.

Xanthine oxidase 활성 및 형전환에 미치는 구리이온의 영향 (Effect of Copper ion on Xanthine Oxidase Activity and Type Conversion)

  • 허근;이상일;박진우
    • 약학회지
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    • 제38권2호
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    • pp.211-217
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    • 1994
  • Copper intoxication and disturbance of copper metabolism induced various oxygen-derived free radicals related damages. The effect of copper ion on xanthine oxidase activity and type conversion of the enzyme which is concerned to generation of reactive oxygen species, was investigated, It was observed that xanthine oxidase activity was increased by addition of copper ion in the reaction mixture in proportional to the concentration of the metal ion until $60\;{\mu}M$, while the enzyme activity was inhibited in higher concentration of copper treatment. On the other hand, xanthine dehydrogenase activity was inhibited by copper ion addition with concentration dependently. Preincubation of enzyme source with $30\;{\mu}M$ of copper ion, which concentration marked increased the xanthine oxidase activity, unchanged the enzyme activity and type conversion compare to control in vitro system. It was also observed that copper induced xanthine oxidase activity and the enzyme type conversion was protected by dithiothreitol and penicillamine. These results indicate that the increment of the type conversion of xanthine oxidase necessarilly need the presence of copper ion in enzyme assay system.

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유기 킬레이터들을 이용한 구리 식각에 대한 반응성 평가 (Reactivity Evaluation on Copper Etching Using Organic Chelators)

  • 김철희;임은택;박찬호;박성용;이지수;정지원;김동욱
    • 한국재료학회지
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    • 제31권10호
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    • pp.569-575
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    • 2021
  • The reactivity evaluation of copper is performed using ethylenediamine, aminoethanol, and piperidine to apply organic chelators to copper etching. It is revealed that piperidine, which is a ring-type chelator, has the lowest reactivity on copper and copper oxide and ethylenediamine, which is a chain-type chelator, has the highest reactivity via inductively coupled plasma-mass spectroscopy (ICP-MS). Furthermore, it is confirmed that the stable complex of copper-ethylenediamine can be formed during the reaction between copper and ethylenediamine using nuclear magnetic resonance (NMR) and radio-thin layer chromatography. As a final evaluation, the copper reactivity is evaluated by wet etching using each solution. Scanning electron micrographs reveal that the degree of copper reaction in ethylenediamine is stronger than that in any other chelator. This result is in good agreement with the evaluation results obtained by ICP-MS and NMR. It is concluded that ethylenediamine is a prospective etch gas for the dry etching of the copper.

Spatial Pattern of Copper Phosphate Precipitation Involves in Copper Accumulation and Resistance of Unsaturated Pseudomonas putida CZ1 Biofilm

  • Chen, Guangcun;Lin, Huirong;Chen, Xincai
    • Journal of Microbiology and Biotechnology
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    • 제26권12호
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    • pp.2116-2126
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    • 2016
  • Bacterial biofilms are spatially structured communities that contain bacterial cells with a wide range of physiological states. The spatial distribution and speciation of copper in unsaturated Pseudomonas putida CZ1 biofilms that accumulated 147.0 mg copper per g dry weight were determined by transmission electron microscopy coupled with energy dispersive X-ray analysis, and micro-X-ray fluorescence microscopy coupled with micro-X-ray absorption near edge structure (micro-XANES) analysis. It was found that copper was mainly precipitated in a $75{\mu}m$ thick layer as copper phosphate in the middle of the biofilm, while there were two living cell layers in the air-biofilm and biofilm-medium interfaces, respectively, distinguished from the copper precipitation layer by two interfaces. The X-ray absorption fine structure analysis of biofilm revealed that species resembling $Cu_3(PO_4)_2$ predominated in biofilm, followed by Cu-Citrate- and Cu-Glutathione-like species. Further analysis by micro-XANES revealed that 94.4% of copper were $Cu_3(PO_4)_2$-like species in the layer next to the air interface, whereas the copper species of the layer next to the medium interface were composed by 75.4% $Cu_3(PO_4)_2$, 10.9% Cu-Citrate-like species, and 11.2% Cu-Glutathione-like species. Thereby, it was suggested that copper was initially acquired by cells in the biofilm-air interface as a citrate complex, and then transported out and bound by out membranes of cells, released from the copper-bound membranes, and finally precipitated with phosphate in the extracellular matrix of the biofilm. These results revealed a clear spatial pattern of copper precipitation in unsaturated biofilm, which was responsible for the high copper tolerance and accumulation of the biofilm.

Fe-Cu계 소결합금의 이상팽창에 관한 연구 (I) (A Study on Abnormal Expansion of Fe-Cu Sintered Alloy)

  • 송영준;김윤채
    • 한국분말재료학회지
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    • 제11권5호
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    • pp.383-390
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    • 2004
  • In order to investigate behavior of abnormal expansion of the iron-copper compacts, we compared the dilatometric curves of the compacts which mixed the copper powder to the iron powder with those of compacts which mixed the copper powder to the iron-copper alloy powder. The dilatometric curves were obtained below the sintering conditions, which heated up to 115$0^{\circ}C$ by a heating rate of 1$0^{\circ}C$/min, held for 60min at 115$0^{\circ}C$ and cooled down at a rate of 2$0^{\circ}C$/min to room temperature. The dilatometric curves of the compacts showed the different expansion behavior at temperatures above the copper melting point in spite of same chemical composition. All of the compacts of former case showed large expansion, but all of the compacts in latter case showed large contraction. The microstructures of sintered compacts also showed the different progress in alloying of the copper into the iron powder. Namely we could observe the segregation at alloy part of copper into iron powder in case of the sintered compacts, which mixed the copper powder to the iron powder, but could not observe the segregation in compacts which mixed the copper powder to the iron-copper alloy powder. But the penetration of liquid copper into the interstices between solid particles was occurred at both cases. Therefore, the showing of the different dimensional changes in the compacts in spite of same chemical composition is due to more the alloying of copper into iron powder than the penetration of liquid copper into the interstices between solid particles.

염화동 폐액으로부터 양이온격막 전해 채취된 구리 분말을 이용한 황산동의 제조방법 연구 (Study on the Preparation of Copper Sulfate by Copper Powder using Cation Membrane Electrowinning Prepared from Waste Cupric Chloride Solution)

  • 강용호;현승균
    • 자원리싸이클링
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    • 제28권1호
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    • pp.62-72
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    • 2019
  • 일반적으로, 황산동을 제조하기 위한 원료는 $H_2SO_4$ 및 Cu 금속이 사용된다. 본 연구는 폐산, 폐염화동 폐기물부터 전해 채취법을 이용하여 황산동을 제조하는 방법에 관한 것이다. 황산구리의 용도는 공업용, 도금용, 사료용, 농업용, 전자급 PCB 동도금에 사용된다. 종래의 황산동 제조법은 다량의 폐수 및 에너지 비용이 높은 문제점이 있다. 구리(Cu) 화합물 중에서 가장 사용이 많이 되는 황산동($CuSO_4$)의 제조 방법에 관한 연구로서, 공정 운전비가 적고, 폐수 발생이 적으며, 제조 공정이 간단하다. 양이온 맴브레인을 이용하여 Na, Ca, Mg, Al을 불순물로서 제거하기 쉽다. 또한 동시에 전해 채취 방법으로 고 순도 구리 분말을 회수 할 수 있었다. 회수 된 구리 분말을 사용하여 고 순도 황산동을 제조 할 수 있었다.