• 청정기술
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• 제2권1호
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• pp.47-52
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• 1996

인쇄회로기판(Printed Circuit Board) 생산 공정에서 발생하는 동폐액을 재활용, 재이용하기 위하여 유기 용매 추출법을 이용하였으며 유기용매로 Lix 64 N을 사용하였다. 산성인 동폐액과 염기성인 동폐액을 혼합하여 pH=2에서 부피 비율로 30%인 Lix 64 N은 17.1gr/l의 동을 추출하였다. 벤치 규모의 연속공정에서 추출단 4단, 세척단 4단, 역추출단 2단이 사용되었다. 회수된 동은 유산동으로 재활용되고 추잔액은 동부식액으로 재이용되었으며 동의 회수율과 유산동의 순도는 모두 99.9% 이상이었다.

• 접착 및 계면
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• 제4권3호
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• pp.1-8
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• 2003

철판에 도금한 아연을 구리이온으로 치환하는 치환도금법과 철판에 직접 구리를 증착하는 진공증착법으로 두께가 다른 구리박막 피복철판을 제조하여 배합고무와 접착성질을 조사하였다. 구리박막 피복철판과 배합고무의 접착세기는 제조방법에 관계없이 구리박막 두께에 따라 결정되었다. 구리박막이 75 nm보다 얇으면 안정한 접착층이 형성되어 황동판에 못지 않게 고무와 강하게 접착되었으나, 90 nm보다 두터우면 구리황화물이 지나치게 성정하여 접착세기가 약하였다.

• 마이크로전자및패키징학회지
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• 제27권3호
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• pp.55-60
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• 2020

최근 참단 반도체 패키징 기술은 고성능 SIP(system in packaging) 구조로 발전해 가고 있고, 이를 실현시키기 위해서 구리 대 구리 접합은 가장 핵심적인 기술로 대두되고 있다. 구리 대 구리 접합 기술은 아직 구리의 산화 특성과 고온 및 고압력 공정 조건, 등 해결해야 할 문제점들이 남아 있다. 본 연구에서는 아르곤과 질소를 이용한 2단계 플라즈마 공정을 이용한 저온 구리 접합 공정의 접합 계면 품질을 정량적 접합 강도 측정을 통하여 확인하였다. 2단계 플라즈마 공정은 구리 표면에 구리 질화막을 형성하여 저온 구리 접합을 가능하게 한다. 구리 접합 후 접합 강도 측정은 4점 굽힘 시험법과 전단 시험법으로 수행하였으며, 평균 접합 전단 강도는 30.40 MPa로 우수한 접합 강도를 보였다.

• 미생물학회지
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• 제12권1호
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• pp.25-30
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• 1974

It was convinced that with a relatively small capital investment and with a low operating cost, appreciable amounts of cement copper could be produced from low-grade minerals by the application of a bacterial leaching method. For the recovery of cement copper from the impure pregnant solution, direct precipitation of copper with tin plates by a bacterial leaching method was feasible. The results obtained were as follows: 1)In order to remove the cement copper from the reducing metal, aeration and agitation method were more effective and economic than shaking method. 2)The rate of copper recovery from the pregnant solution was accerelated according to increasing quantities of reducing metal. However, the excess of reducing metal reduced the grade of cement copper. 3)Among the comparative experiments of copper recovery at each reaction temperature of $10^{\circ}C$, $20^{\circ}C$, and $30^{\circ}C$, the recovery rate of copper at $30^{\circ}C$from the pregnant solution was highest. 4)Direct cementation method on iron-containing metal was an excellent method for the recovery of cement copper in bacterial leaching.

• Journal of Electrochemical Science and Technology
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• 제8권2호
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• pp.146-154
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• 2017

In this study, copper (II) oxide was prepared for use in a copper electroplating solution. Copper chloride powder and copper (II) oxide are widely used as raw materials for electroplating. Copper (II) oxide was synthesized in this study using a two-step chemical reaction. Herein, we developed a method for the preparation of copper (II) oxide without the use of sintering. In the first step, copper carbonate was prepared without sintering, and then copper (II) oxide was synthesized without sintering using sodium hydroxide. The optimum amount of sodium hydroxide used for this process was 120 g and the optimum reaction temperature was $120^{\circ}C$ regardless of the starting material.

• 약학회지
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• 제26권2호
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• pp.97-103
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• 1982

This paper presents anti-inflammatory effects of nonsteroidal anti-inflammatory drugs and their copper complexes, and the change of content of copper in serum, liver, brain and edema foot induced by 1% carrageenan in rats, and also investigation of stomach hemorrhage. The results were as follows. 1. The content of copper decreased in liver and brain, however, the concentration of copper significantly increased in serum and edema site after carrageenan injection in rats. 2. The content of copper in serum and edema site was decreased after administration of anti-inflammatory drugs. 3. Edema inhibition rate of aspirin was, higher than that of copper (II) aspirinate, but edema inhibition rate of copper complex of naproxen was markedly higher than that of naproxen. 4. Hemorrhage of stomach of copper salicylate was higher than that of sodium salicylate, but hemorrhage of stomach of sodium naproxen was higher than that of copper naproxen.

• Bulletin of the Korean Chemical Society
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• 제22권4호
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• pp.379-382
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• 2001

A new ligand containing the long aliphatic hydrocarbon chain, dipyridylstearylamine (dps) and its copper(Ⅱ) complex, Cu(dps)(NO3)2 have been prepared. The copper complex was characterized structurally and spectroscopically. The XRD crystal structure of the copper complex reveals that copper is octahedrally coordinated by dps and two nitrato ligands. The nitrato groups ligate asymmetrically to the copper. Crystal data are P1bar, a=8.249(2), b=10.416(3), $c=20.915(4)\AA$, $\alpha=86.54(2)$, $\beta=84.026(2)$, $\gamma=72.32(2)^{\circ}$, V=1702.7(7) $\AA3$ , Z=2, ${\lambda}$(Mo $K\alpha)=0.71073\AA$, $\mu=0.689$ mm-1 , T=293(2) K, R=0.0560 for 3529 reflections. The dps and the copper complex are stable in the air and the copper complex exhibits features of typical of other copper(Ⅱ) complexes containing dipyridylamine-based ligand.

• 한국환경과학회지
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• 제1권2호
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• pp.157-166
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• 1992

The biosorptlon perFormances of copper were Investigated by the immobilized biomass of nonliving marine brown algae Undaria pinnatifida by each of the Ca-alginate method(Ca-ALG), Ba-alginate method(Ba-ALG), polyethylene glycol method(PEG), and carrageenan method (CARR). The copper removal performance increased but the copper uptake decreased as the biomass amount was increased. However, the copper uptake by the immobilized biomass increased with increasing initial copper concentration. Among the immobilization methods, the copper uptake decreased in the following sequence: Ca-ALG > Ba-ALG > PEG > CARR. The pattern of copper uptake by the immobilized biomass fitted the Langmuir isotherm better than the Freundlich isotherm. Desorption of deposited copper with 0.05 ~0.5M HCI, resulted in no changes of the copper uptake capacity of the immobilized biomass by the immobilization methods except for PEG, through five subsequent biosorptioydesorption cycles. There was no damage to the immobilized biomass which retained its macroscopic appearance in repeated copper uptake/elution cycles.

• 한국환경과학회지
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• 제19권9호
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• pp.1119-1127
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• 2010

The behavior of copper throughout the whole process of wastewater treatment plant that uses the activated sludge process to treat the wastewater of petrochemical industry that contains low concentration of copper was investigated. Total inflow rate of wastewater that flows into the aeration tank was $697\;m^3$/day with 0.369 mg/L of copper concentration, that is, total copper influx was 257.2 g/day. The ranges of copper concentrations of the influent to the aeration tank and effluent from the one were 0.315 ~ 0.398 mg/L and 0.159 ~ 0.192 mg/L, respectively. The average removal rate of copper in the aeration tank was 50.8 %. The bioconcentration factor (BCF) of copper by microbes in the aeration tank was 3,320. The accumulated removal rate of copper throughout the activated sludge process was 71.3%, showing a high removal ratio by physical and chemical reactions in addition to biosorption by microbes. The concentration of copper in the solid dehydrated by filter press ranged from 74.8 mg/kg to 77.2 mg/kg and the concentration of copper by elution test of waste was 2.690 ~ 2.920 mg/L. It was judged that the copper concentration in dehydrated solid by bioconcentration could be managed with the control of that in the influent.

• 한국표면공학회지
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• 제49권5호
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• pp.401-407
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• 2016

In this work, effect of zincate treatment of AZ91 Mg alloy on the following electrodeposition of copper was examined in a non-cyanide bath containing pyrophosphate ions in view of surface morphology and adhesion of the electrodeposited copper layer. Without zincate treatment, the electrodeposited copper layer showed very porous structure and poor adhesion. On the other hand, the copper layer electrodeposited on the zincate-treated surface showed dense structure and good adhesion. The dissolution rate of AZ91 Mg alloy after the zincate treatment appeared to decrease about 40 times in the copper pyrophosphate bath, as compared to that of the surface without zincate treatment. The porous morphology and poor adhesion of a copper layer on the AZ91 Mg alloy surface without zincate treatment were attributed to small number of nucleation sites of copper because of rapid dissolution of the magnesium substrate in the pyrophosphate bath. Based on the experimental results, it is concluded that the zincate treatment to form a conducting and protecting layer on the AZ91 Mg alloy surface is essential for successful electrodeposition of a copper layer on AZ91 Mg alloy with good adhesion and dense structure in the copper pyrophosphate bath.