• Title/Summary/Keyword: Copper/low k

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Effect of Current Density on Material Removal in Cu ECMP (구리 ECMP에서 전류밀도가 재료제거에 미치는 영향)

  • Park, Eunjeong;Lee, Hyunseop;Jeong, Hobin;Jeong, Haedo
    • Tribology and Lubricants
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    • v.31 no.3
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    • pp.79-85
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    • 2015
  • RC delay is a critical issue for achieving high performance of ULSI devices. In order to minimize the RC delay time, we uses the CMP process to introduce high-conductivity Cu and low-k materials on the damascene. The low-k materials are generally soft and fragile, resulting in structure collapse during the conventional high-pressure CMP process. One troubleshooting method is electrochemical mechanical polishing (ECMP) which has the advantages of high removal rate, and low polishing pressure, resulting in a well-polished surface because of high removal rate, low polishing pressure, and well-polished surface, due to the electrochemical acceleration of the copper dissolution. This study analyzes an electrochemical state (active, passive, transpassive state) on a potentiodynamic curve using a three-electrode cell consisting of a working electrode (WE), counter electrode (CE), and reference electrode (RE) in a potentiostat to verify an electrochemical removal mechanism. This study also tries to find optimum conditions for ECMP through experimentation. Furthermore, during the low-pressure ECMP process, we investigate the effect of current density on surface roughness and removal rate through anodic oxidation, dissolution, and reaction with a chelating agent. In addition, according to the Faraday’s law, as the current density increases, the amount of oxidized and dissolved copper increases. Finally, we confirm that the surface roughness improves with polishing time, and the current decreases in this process.

Energy Spectrum Analysis between Single and Dual Energy Source X-ray Imaging for PCB Non-destructive Test (PCB 비파괴 검사에 있어서 단일 에너지 소스와 이중 에너지 소스의 영상비교를 위한 엑스선 스펙트럼 분석)

  • Kim, Myungsoo;Kim, Giyoon;Lee, Minju;Kang, Dong-uk;Lee, Daehee;Park, Kyeongjin;Kim, Yewon;Kim, Chankyu;Kim, Hyoungtaek;Cho, Gyuseong
    • Journal of Radiation Industry
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    • v.9 no.3
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    • pp.153-159
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    • 2015
  • Reliability of printed circuit board (PCB), which is based on high integrated circuit technology, is having been important because of development of electric and self-driving car. In order to answer these demand, automated X-ray inspection (AXI) is best solution for PCB non-destructive test. PCB is consist of plastic, copper, and, lead, which have low to high Z-number materials. By using dual energy X-ray imaging, these materials can be inspected accurately and efficiently. Dual energy X-ray imaging, that have the advantage of separating materials, however, need some solution such as energy separation method and enhancing efficiency because PCB has materials that has wide range of Z-number. In this work, we found out several things by analysis of X-ray energy spectrum. Separating between lead and combination of plastic and copper is only possible with energy range not dose. On the other hand, separating between plastic and copper is only with dose not energy range. Moreover the copper filter of high energy part of dual X-ray imaging and 50 kVp of low energy part of dual X-ray imaging is best for efficiency.

MINERAL NUTRITION OF GRAZING SHEEP IN NORTHERN CHINA II. SELENIUM, COPPER, MOLYBDENUM, IRON AND ZINC IN PASTURE, FEED SUPPLEMENTS AND SHEEP

  • Masters, D.G.;Purser, D.B.;Yu, S.X.;Wang, Z.S.;Yang, R.Z.;Liu, N.;Lu, D.X.;Wu, L.H.;Ren, J.K.;Li, G.H.
    • Asian-Australasian Journal of Animal Sciences
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    • v.6 no.1
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    • pp.107-113
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    • 1993
  • This study determined the concentrations of micro-minerals in pastures, in feed supplements and in grazing, reproducing ewes, at different times during the year, at three farms in Northern China. Samples were collected 5 to 8 times during the year and analysed for selenium, copper, iron, molybdenum and zinc. On two farms selenium concentrations in both pastures and animal tissues were low for part of the year. The lowest concentrations in pasture (< $30{\mu}g/kg$ DM) and liver (< $100{\mu}g/kg$ wet weight) indicated that productivity of the sheep may be reduced by a deficiency of this element. On one farm copper concentrations in the lever were in the liver were in the deficient range (< $5{\mu}g/kg$ wet weight) for part of the year. It is likely that this is a result of high intakes of iron from pasture (up to 4.5 g Fe/kg DM) and soil, as indicated by high concentrations of iron in faeces (up to 7 g Fe/kg DM). Molybdenum intake is unlikely to have had much influence on copper absorption because pasture concentrations of this element were not unusually high (1 to 5 mg/kg DM). Zinc in pastures on two farms was below 10 mg/kg DM for part of the year. On one of these farms, the concentration of zinc in faeces was below 30 mg/kg DM throughout the year and this is consistent with zinc intakes of 7 to 15 mg/kg. Despite these low intakes, the concentratons of zinc in plasma were consistently above deficient levels. No clinical signs of deficiencies of any of the elements studied were observed.

A Study on the Corrosion Effects by Addition of Complexing Agent in the Copper CMP Process

  • Kim, Sang-Yong;Kim, Nam-Hoon;Kim, In-Pyo;Chang, Eui-Goo;Seo, Yong-Jin;Chung, Hun-Sang
    • Transactions on Electrical and Electronic Materials
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    • v.4 no.6
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    • pp.28-31
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    • 2003
  • Copper CMP in terms of the effect of slurry chemicals (oxidizer, corrosion inhibitor, complexing agent) on the process characteristics has been performed. Corrosion inhibitors, benzotriazole (BTA) and tolytriazol (TTA) were used to control the removal rate and avoid isotropic etching. When complexing agent is added with H$_2$O$_2$ 2 wt% in the slurry, the corrosion rate was presented very well. In the case of complexing agent, it was estimated that the proper concentration is 1 wt%, because the addition of tartaric acid to alumina slurry causes low pH and the slurry dispersion stability become unstable. There was not much change of the removal rate. It was assumed that BTA 0.05 wt% is suitable. Most of all, it was appeared that BTA is possible to be replaced by TTA. TTA was distinguished for the effect among complexing agents.

Analysis of Ni/Cu Metallization to Investigate an Adhesive Front Contact for Crystalline-Silicon Solar Cells

  • Lee, Sang Hee;Rehman, Atteq ur;Shin, Eun Gu;Lee, Doo Won;Lee, Soo Hong
    • Journal of the Optical Society of Korea
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    • v.19 no.3
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    • pp.217-221
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    • 2015
  • Developing a metallization that has low cost and high efficiency is essential in solar-cell industries, to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the cost of solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electroless plating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel deposition process, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In the subsequent step, a nickel sintering process was carried out in $N_2$ gas atmosphere; however, copper was plated by light-induced plating (LIP). Plated nickel has different properties under different bath conditions because nickel electroless plating is a completely chemical process. In this paper, plating bath conditions such as pH and temperature were varied, and the metal layer's structure was analyzed to investigate the adhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achieved for samples with no nickel sintering process.

Molecular Genetic Testing and Diagnosis of Wilson Disease (윌슨병의 진단과 분자유전학적 검사)

  • Seo, Jeong Kee
    • Pediatric Gastroenterology, Hepatology & Nutrition
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    • v.11 no.sup1
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    • pp.72-82
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    • 2008
  • Wilson disease (WD) is an autosomal recessive disorder of copper metabolism that results in accumulation of copper primarily in the liver, the brain and the cornea. Mutations in the WD gene, ATP7B cause failure of copper excretion from hepatocyte into bile and a defective synthesis of ceruloplasmin. More than 370 mutations are now recognized, scattering throughout the ATP7B gene. Since WD has protean clinical presentations, awareness of WD in clinical practice is important for the early diagnosis and prevention of accumulated copper toxicity. None of the laboratory parameters alone allows a definite diagnosis of WD. There are numerous pitfalls in the diagnosis of WD. Low serum ceruloplasmin concentrations, increased 24 hour urinary copper excretion, increased hepatic copper concentrations and the presence of Kayser-Fleischer rings in the cornea are major diagnostic points. A combination of any two of these 4 laboratory findings is strong support for a diagnosis of WD. Molecular methods are now being used to aid diagnosis. Molecular genetic testing has confirmed the diagnosis in individuals in whom the diagnosis is not clearly established biochemically and clinically. Siblings should be screened for WD once an index case has been diagnosed. Discrimination of heterozygotes from asymptomatic patients is essential to avoid inappropriate lifelong therapy for heterozygotes. Genetic testing, either by haplotype analysis or by mutation analysis, is the only reliable tool for differentiating heterozygote carriers from affected asymptomatic patients. Currently, genetic testing is of limited value in the primary diagnosis. However, genetic testing will soon play an essential role in diagnosing WD as rapid advancement of biomedical technology will allow more rapid, easier and less expensive mutation detection.

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Planar Shock Wave Compaction of Oxidized Copper Nano Powders using High Speed Collision and Its Mechanical Properties (고속 충돌 시 발생하는 평면 충격파를 이용한 산화 나노 분말의 치밀화 및 기계적 특성 평가)

  • Ahn, Dong-Hyun;Kim, Wooyeol;Park, Lee Ju;Kim, Hyoung Seop
    • Journal of Powder Materials
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    • v.21 no.1
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    • pp.39-43
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    • 2014
  • Bulk nanostructured copper was fabricated by a shock compaction method using the planar shock wave generated by a single gas gun system. Nano sized powders, average diameter of 100 nm, were compacted into the capsule and target die, which were designed to eliminate the effect of undesired shock wave, and then impacted with an aluminum alloy target at 400 m/s. Microstructure and mechanical properties of the shock compact specimen were analyzed using an optical microscope (OM), scanning electron microscope (SEM), and micro indentation. Hardness results showed low values (approximately 45~80 Hv) similar or slightly higher than those of conventional coarse grained commercial purity copper. This result indicates the poor quality of bonding between particles. Images from OM and SEM also confirmed that no strong bonding was achieved between them due to the insufficient energy and surface oxygen layer of the powders.

Galvanic Sensor System for Detecting the Corrosion Damage of the Steel in Concrete

  • Kim, Jung-Gu;Park, Zin-Taek;Yoo, Ji-Hong;Hwang, Woon-Suk
    • Corrosion Science and Technology
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    • v.3 no.3
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    • pp.118-126
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    • 2004
  • The correlation between sensor output and corrosion rate of reinforcing steel was evaluated by laboratory electrochemical tests in saturated $Ca(OH)_2$ with 3.5 wt.% NaCl and confirmed in concrete environment. In this paper, two types of electrochemical probes were developed: galvanic cells containing of steel/copper and steel/stainless steel couples. Potentiodynamic test, weight loss measurement, monitoring of open-circuit potential, linear polarization resistance (LPR) measurement and electrochemical impedance spectroscopy (EIS) were used to evaluate the corrosion behavior of steel bar embedded in concrete. Also, galvanic current measurements were conducted to obtain the charge of sensor embedded in concrete. In this study, steel/copper and steel/stainless steel sensors showed a good correlation in simulated concrete solution between sensor output and corrosion rate of steel bar. However, there was no linear relationship between steel/stainless steel sensor output and corrosion rate of steel bar in concrete environment due to the low galvanic current output. Thus, steel/copper sensor is a reliable corrosion monitoring sensor system which can detect corrosion rate of reinforcing steel in concrete structures.

Desorption Characteristics for Previously Adsorbed Gold and Copper-Cyanide Complexes onto Dowex21K XLT Resin Using Mixed Solvent with HCl and Acetone (염산과 아세톤의 혼합용매를 이용한 Dowex21K XLT 수지에 흡착된 금과 구리-시안 착화합물의 탈착 특성)

  • Jeon, Choong
    • Clean Technology
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    • v.19 no.4
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    • pp.487-491
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    • 2013
  • To efficiently desorb gold and copper-cyanide complexes adsorbed onto Dowex21K XLT resin, the mixed solvent with HCl and acetone which is a kind of dipolar aprotic solvent was used as a desorbing agent. The desorption efficiency for gold-cyanide complex was the highest as about 94% when the mixing ratio of HCl and acetone based on volume was the 7:3, however, the value decreased as the ratio of acetone increased. In the case of copper-cyanide complex, most of them was desorbed when the amount of HCl was relatively higher than that of acetone, however, desorption efficiency decreased as the ratio of acetone increased. The desorption efficiency for gold and copper-cyanide complexes was the 94 and 100%, respectively at the 0.6 M of HCl with the 7 (HCl) : 3 (Acetone) of mixing ratio and desorption efficiency for gold-cyanide complex not increased any more even though higher HCl concentration was used. And the desorption efficiency for gold and copper-cyanide complexes was about 100% at the S/L raio ${\leq_-}1.0$ whereas desorption efficiency for gold-cyanide complex was very low as about 20-29% at the S/L ratio > 1.0. Also, most of desorption process for gold and copper-cyanide complexes was completed within 120 min.