• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.17 no.5
• /
• pp.508-514
• /
• 2004

A fluxgate magnetic sensor consists of a solenoid excitation coil, pick-up coil, and magnetic core. We presents the effect of magnetic core shape in a micromachined fluxgate sensor. To observe the performance of fluxgate sensor with magnetic core side width and gap, side width of 125 ${\mu}{\textrm}{m}$, 250 ${\mu}{\textrm}{m}$, and 500 ${\mu}{\textrm}{m}$ were designed in a rectangular-ring shaped core and the gaps of 0 ${\mu}{\textrm}{m}$, 50 ${\mu}{\textrm}{m}$, and 100 ${\mu}{\textrm}{m}$ were also fabricated in a racetrack shaped core. The solenoid coils and magnetic core were separated by benzocyclobutane(BCB) which had high insulation and good planarization characters. Copper coil patterns of 10 ${\mu}{\textrm}{m}$ width and 6${\mu}{\textrm}{m}$ thickness were electroplated on Ti(300 $\AA$) / Cu(1500 $\AA$) seed layers. 3 ${\mu}{\textrm}{m}$ thick N $i_{0.8}$F $e_{0.2.}$(permalloy) film for the magnetic core was also electroplated under 2000 gauss to induce the magnetic anisotropy. The magnetic core had the high DC effective permeability of ∼1,300 and coercive field of ∼0.1 Oe. Because the magnetic cores of 500 ${\mu}{\textrm}{m}$ side width and 0 gap had a low magnetic flux leakage, high sensitivity of ∼350 V/T were measured at excitation condition of 3 $V_{P-P}$ and 2 MHz square wave. The power consumption of ∼14 ㎽ was measured. The fabricated fluxgate sensor had the very small actual size of 3.0${\times}$1.7 $\textrm{mm}^2$. When two fluxgates were perpendicularly aligned in terrestrial field, their two-axis output signals were very useful to commercialize an electronic azimuth compass for the portable navigation system.m.m.m.

• Progress in Superconductivity
• /
• v.10 no.1
• /
• pp.45-49
• /
• 2008

For the development of superconducting fault current limiters (SFCLs), fault current limiting elements were fabricated out of Bi-2212 bulk tubes and tested. The SFCL elements consisted of tube shaped Bi-2212 bulks and metal shunts for the stabilizers. Firstly, the Bi-2212 bulk tubes were processed based on a design of monofilar coils in order to acquire large resistance and high voltage rating. 300 mm-long Bi-2212 tubes were designed to have the current path of 410 cm in length with 24 turns and 41 mm in diameter. The processed monofilar coil, as designed, had 300 A $I_c$ at 77 K. The fabricated superconducting monofilar coils were affixed to Cu-Ni alloy as that of stabilizers. The Cu-Ni alloys were processed to have the same shape of the superconducting monofilar coils. The Cu-Ni coil had resistivity of 32 ${\mu}{\Omega}$-cm at 77 K and 37 ${\mu}{\Omega}$-cm at 300 K. The metal shunts were attached to the outside of the Bi-2212 monofilar coil by a soldering technique. After the terminals made of copper were attached to both ends of the superconductor-metal shunt composite, the gap between the turns and the surface of the elements was filled with an epoxy and a dense mesh made of FRP in order to enhance the mechanical strength. The completed SFCL elements went through fault tests, and we confirmed that the voltage rating of 143 $V_{rms}$ (E =0.35 $V_{rms}$/cm) could be accomplished.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2015.11a
• /
• pp.249-249
• /
• 2015

Silver films have been of considerable interest for years due to their better performance relative to other metal films for engineering applications. A series of multi-layer silver coatings with different thickness (i.e. 0.3 um to 1.5 um) were prepared on Aluminium substrate containing copper undercoat by direct current (DC) magnetron sputtering method. For the comparative purpose, similar thickness silver coatings were prepared by electrolytic deposition method. Microstructural, morphological, and mechanical characteristics of the silver coatings were evaluated by means of scanning electron microscope (SEM), X-ray diffraction (XRD), Surface roughness test, microhardness test and nano-scratch test. From the results, it has been elucidated that the silver films prepared by DC magnetron sputtering method has superior properties in comparison to the wet coating method. On the other hand, DC magnetron sputtering method is relatively easier, faster, eco-friendly and more productive than the electrolytic deposition method that uses several kinds of hazardous chemicals for bath formulation. Therefore, a New Work Item Proposal (NWIP) for the test methods standardization of DC magnetron sputtered silver coatings has recently been proposed via KATS, Korea and a NP ballot is being progressed within a technical committee "ISO/TC107-metallic and other inorganic coating".

• Restorative Dentistry and Endodontics
• /
• v.18 no.2
• /
• pp.431-445
• /
• 1993

The purpose of this study was to observe corrosion characteristics of six dental amalgams and was to analyse corrosion products electrochemically. After each amalgam alloy and Hg was triturated as the direction of the manufacturer by using mechanical amalgamator, the triturated mass was inserted into the cylinderical metal mold ($12{\times}10mm$) and was condensed with 160kg/$cm^2$ by using the hydrolic press. The specimen was removed from the mold and was stored at room temperature for 1 week, and was polished with amalgam polishing kit. The anodic and cathodic polarization curve was obtained by using cyclic voltammetric method with 3-electrode potentiostat in saline for each amalgam and Ag, Sn, Cu plate specimen at $37{\pm}0.5^{\circ}C$. The potential sweep range was -1.7V~0. 4V(vs SCE) in working electrode and scan rate was 50mV/s and the exposed surface area of each specimen to the electrolytic solution was $0.79cm^2$. The results were as follows. 1. In anodic-cathodic polarization curve of amalgam specimens, two anodic current rising areas and two cathodic current peaks were obtained at the low Cu amalgam(CF, CS) specimen and three anodic current rising areas and three cathodic current peaks were obtained at the high Cu amalgam (TY, DS, HV) specimen. 2. As this compared with the anodic and cathodic current peak potentials of Sn, Cu and Ag specimen, the first cathodic current peak I c was caused by the reduction of divalent tin salt, second cathodic current peak IIIc results from the reduction of quadravalent tin salt, and third cathodic current peak me results from the reduction of copper salt. 3. As reverse potential sweeping was done repeatedly, anodic current was decreased slightly in all amalgam specimens.

• Journal of the Korean Chemical Society
• /
• v.54 no.4
• /
• pp.402-410
• /
• 2010

New complexes cis-[$Mo_2O_5(Hapdhba)_2$], trans-[$UO_2(Hapdhba)_2$], [Pd(Hapdhba)Cl($H_2O$)], [Pd(bpy)(Hapdhba)]Cl, [Ag(bpy)(Hapdhba)], [$Ru(Hapdhba)_2(H_2O)_2$], [$Rh(Hapdhba)_2Cl(H_2O)$] and [Au(Hapdhba)$Cl_2$] are reported, where $H_2$apdhba is the Schiff-base derived from 2-aminopyrimidine and 2,4-dihydroxy benzaldehyde. The complexes were characterized by IR, electronic, $^1H$ NMR and mass spectra, conductivity, magnetic and thermal measurements. The inhibitive effect of $H_2$apdhba for the corrosion of copper in 0.5 M HCl was also determined by potentiodynamic polarization measurements.

• Korean Journal of Materials Research
• /
• v.8 no.5
• /
• pp.444-449
• /
• 1998

There are various shielding materials that have been considered; the use of a metallic plate or the layering of a conductive material on a plastic surface and the insertion of filler in plastics. All of these methods have shown their merits and weakness. Therefore, many studies have concentrated on developing materials that effectively cut down EMI without increase in weights of housing materials. In these respects, this study has focused on investigations of the shielding effect of materials that have electroless nickel plating on the lamella structured micro particles surface with low specific gravity. When a film of electroless nickel were plated on a micro particle surfaces and then mixed with paint, the electromagnetic shielding effects were measured as 63dB. Although these effects were less than that 90dB of the copper plate, trials in a series of 6 times increased the shielding effect by IOdB and is applicable to wide range of EMI shielding.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.04a
• /
• pp.45-47
• /
• 2001

Due to pressure from threatened legislation in Europe, consumer and governmental pressure in Japan, and glob머 market considerations in the US, there is a rapidly growing interest in lead-free solderinger, Although the move to lead free soldering seems inevitable, many problems will arise in production assembly. It is generally acknowledged that the lead-free solders available offer a much s smaller process window than lead/tin, related mainly to the higher soldering temperatures which naturally result from increases of liquidus temperatures of at least 300 C. However, raising reflow temperatures from the current 220-2300 C to 250 2600 C will lead to problems with the boards and components as well as i increasing oxidation effects. There is a need to keep reflow temperatures low without reducing solderablity. Some results on benefits of inert atmospheres are discussed in this paper. For example, testing in a nitrogen atmosphere, with 300 ppm oxygen, by the N National Physical Laboratory (NPU has revealed clear benefits for ine$\pi$mg lead-free alloys, by restoring the solderability to lead/tin levels, by enabling lower soldering temperatures. However, there has been little testing over a range of oxygen levels in nitrogen and this is an important issue in determining n nitrogen supply and oven costs. Some results are reported here from work by NPL conducted for BOC in w which solderability was evaluated for tin기ead and tin/silver/copper eutectic a alloys in a wetting balance over a range of oxygen levels form 10 ppm to 21% ( (air). The studies confirm that acceptable wetting times occur in inert atmospheres a at soldering temperatures 20 to 300 C lower than are possible in air.

• Korean Journal of Veterinary Service
• /
• v.29 no.4
• /
• pp.459-467
• /
• 2006

This study was designed to investigate if there were groundwater contamination in 17 landfill where slaughtered animals were buried during the crisis of 2002 foot-and-mouth-disease (FMD) outbreaks in Gyeonggi province. From March to August 2005 groundwater was collected once a month from 17 sites, and examined with potential for hydrogen (pH), colour, turbidity, lead (Pb), arsenic (As), mercury (Hg), cadmium (Cd), copper (Cu), zinc (Zn) , iron (Fe), manganese (Mn) , aluminium (Al), nitrate-nitrogen $(NO_3-N)$, ammonia-nitrogen $(NH_3-N)$, microbial pathogen and Escherichia spp. In the examination of $NH_3-N$ which of the mean concentration was from not-detected (ND) to 0.05 mg/l. The range of $NH_3-N$ level was $0.3-24.1mg/{\ell}$. However, groundwater from four sites was to go beyond the drinking water quality standard (DWQS), i.e., the mean concentration of those were $15.5mg/{\ell}\;(site\;1),\;20.7mg/{\ell}\;(site\;9),\;24.1mg/{\ell}\;(site\;13)\;and\;10.6mg/{\ell}\;(site\;17)$. In the investigation of pH, colour and turbidity, all of the pH were below of DWQS (pH 5.8-6.6), but one site in color test and four sites in turbidity test were over the standard level. Among 9 metal ions examined, Mn was in excess of DWQS, and its concentration was $2.4mg/{\ell}$. Pb, Cd, Hg and As were not traced. The contents of Cu, Zn, Fe and Al were $ND-0.22mg/{\ell},\;0.01-0.05mg/{\ell},\;ND-0.05mg/{\ell}\;and\;0.03-0.16mg/{\ell}$, respectively. Escherichiae spp were not identified, but bacterial colonies were detected at 3 groundwater including 2 sites over the DWQS at the level of $491CFU/m{\ell}\;(site\;4)\;and\;217CFU/m{\ell}\;(site\;15)$.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.34 no.3
• /
• pp.341-346
• /
• 2010

The effect of specimen geometry on the bending and tensile strengths of dissimilar joints ($\beta-Si_3N_4/S45C$) with copper interlayers was evaluated. The average bending strength of specimens with circular cross sections was higher than that of specimens with rectangular cross sections. The crack initiation stress ($\sigma_i$) was successfully determined by the acoustic emission (AE) method and was approximately 60~80% of the bending strength. The residual stresses near the interfaces on the ceramic side were measured by X-ray diffraction before conducting the bending test. The bending strength and the crack initiation stress decreased with an increase in the residual stresses. The effect of the bending strain component was evaluated by the tensile testing; the tensile strength decreased with an increase in the bending strain component and was approximately 80% of the bending strength.

• Journal of Digital Convergence
• /
• v.15 no.2
• /
• pp.355-360
• /
• 2017

This study, which was begun in order to create a metal molding by using lines, a basic element of design, examined various characteristics and concept of line and the beauty of lines based on previous research on the subject. The result showed that formative interpretation of lines largely depends on intentional expression by using thickness and rhythm of lines. In order to obtain a metal molding that provides both visual freedom and beauty, rather than the conventional formative expression of lines, I used red copper plate and Phosphor bronze line for creating a pattern based on transformation and repetition of lines and an artwork based on the pattern. The result was not only a creation of a plane but the senses of three-dimension, speed, and unity in the overall shape. Further research will need to be conducted regarding formative interpretation of lines and emotional and intrinsic beauty through expression of lines.