• Nuclear Engineering and Technology
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• v.56 no.7
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• pp.2740-2747
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• 2024

The sintering process acquired ferromagnetic copper ferrite ceramic material with a small concentration of Ni ion at 1100 ℃ for 1 h. Previously, copper ferrite with Ni proportions powder was acquired by the wet chemical process according to the relation CuFe_2-xNi_xO₄ where x takes values 0.0, 0.015, 0.03, 0.04, and 0.05. The role of Ni ion in the copper ferrite structure was investigated by X-ray analysis, Scanning electron microscope, EDX analysis, and density measurements. The gamma-ray shielding properties for the fabricated CuFeNiO ceramics samples were evaluated using the Monte Carlo simulation method. The obtained results show an enhancement in the linear attenuation coefficient for the fabricated ceramics with increasing the insertions of Ni ions within the fabricated samples, where increasing the Ni ions concentration between 0 and 1.19 wt% increases the linear attenuation by between 1.581 and 1.771 cm^-1 (at 0.103 MeV), 0.304-0.338 cm^-1 (at 0.662 MeV), and 0.160-0.178 cm^-1 (at 2.506 MeV), respectively. Simultaneously, the radiation protection efficiency for a 1 cm thickness of the fabricated samples increased between 14.8 and 16.3% with increasing the Ni ions between 0 and 1.19 wt%. Although the Ni doping concentration does not exceed 1.5 wt% of the total composition of the fabricated ceramics, the shielding capacity of the fabricated ceramics was enhanced by more than 11%, along the studied energy interval. Therefore, the fabricated samples can be used in gamma-ray shielding applications.

• Journal of The Korean Society of Grassland and Forage Science
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• v.29 no.1
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• pp.51-62
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• 2009

This study was carried out development a new composting system to lower copper and zinc concentration in plg sludge compost and conduct an inquiry into the possibility of crop cultivation. The concentrations of nitrogen, phosphorus and pH averaged 4.4%, 6.3% and 7.57, respectively, which were higher concentrations than in commercial organic fertilizers, and the concentrations of copper and zinc averaged 805 and 1,704 mg/kg, respectively, which were beyond the heavy metal concentration limit in byproduct compost. Hydrated citric acid I lowered the concentrations of copper and zinc by 58% and 97%, respectively and hydrated oxalic acid II lowered the concentrations of copper and zinc by 48% and 56%, respectively in pig sludge compost. Lower concentrations of copper and zinc in pig sludge resulted from the enhanced hydrated-citric acid concentration in organic acid solution mixed with distilled water. The concentrations of copper and zinc were 330, and 41 mg/kg in the pig sludge treated with 100% hydrated citric acid. Agitation composting system stabilized the compost earlier than the stationary composting system, in which the stabilization condition was confirmed by higher temperature by $4^{\circ}C$ at highest temperature and 7 days earlier cooling down after highest temperature. The levels of germination index (G.I) 80 were obtained 15 and 20 days after composting in agitation and stationary composting system, respectively. The concentrations of copper and zinc were 2.4 and 4.26 mg/kg respectively in soils amended with pig sludge compost after removing process of heavy metals by citric acid, but 8.0 and 22.37 mg/kg, respectively in soils amended with Pig Sludge. The concentrations of heavy metals was highest in com cultivated in soils amended with pig sludge. The copper and zinc concentrations In corn leaves were 75.2 and 50.56 mg/kg respectively, which were 4 and 2 fold higher than the com cultivated in soils amended with pig sludge compost after heavy metal removing process by hydrated citric acid.

• Polymer(Korea)
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• v.31 no.2
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• pp.93-97
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• 2007

Phenyl styryl ketone ligands 1-5 containing different functional groups were synthesized and attached to the aminated poly (styrene-divinvlbenzene) copolymer through diazotization. The coupling of the ligand with polymer was confirmed by FT-IR. The variation of the uptakes of Pb (II) or Cu (II) ions loaded in the prepared polymers (6-10) was examined at different pH values. An increase of metal uptake in the polymers was observed with the increase in pH value in aqueous solution.

• Korean Journal of Materials Research
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• v.15 no.1
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• pp.1-5
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• 2005

Copper-based leadframe sheets were immersed in two kinds of hot alkaline solutions to form brown-oxide or black-oxide layer on the surface. The oxide-coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched double-cantilever beam (SDCB) specimens. The SDCB specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under quasi-Mode I loading conditions. Fracture surfaces were analyzed by various equipment to investigate failure path. The present paper deals with the failure path, and the cause of the failure path formation with an adhesion model will be treated in the succeeding paper.

• Progress in Superconductivity and Cryogenics
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• v.9 no.4
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• pp.11-15
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• 2007

In practical applications of HTS tapes for electric devices such as coils and power cables, the jointing of HTS tapes is inevitable even though long length tapes have recently been achieved. The critical current, $I_c$, degradation behaviors with tensile and bending deformations were investigated in commercially available YBCO coated conductor tapes. When the V-I relationship was measured at the jointed section of the lap-jointed YBCO CC tapes, the resistance at the joint decreased with increasing joint length. The critical load for 95% $I_c$ retention were determined for the IBAD and RABiTS YBCO tapes and they were 175 and 355N, respectively. Fracture occurred at the unjointed part which represents strong copper lamination and solder jointing. The electro-mechanical properties of lap-jointed CC tapes depended on the properties of single tapes. The V-I behavior under bending strain was similar with the tensile case.

• Journal of the Korean Chemical Society
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• v.18 no.3
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• pp.202-209
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• 1974

Polarographic behaviors of copper and cadmium complexes with 2,2'-bipyridine and ethylenediamine in acetonitrile have been investigated by the DC and AC polarography. The reduction processes are estimated as follows; $Cu(II)-bipy. \;complex\;{\longrightarrow^{e^-}_{E_{1/2}\risingdotseq+0.1V}}\;Cu(I)-bipy.\;complex\;{\longrightarrow^{e^-}_{E_{1/2}=-0.43V}}\;Cu(Hg)$$Cu(II)-en.\;complex\;{\longrightarrow^{e^-}}\;Cu(I)-en.\;complex\;{times}\;{\longrightarrow^{e^-}_{E_{1/2}=-0.56V}}\;Cu(Hg)$$Cu(II)-bipy. \;complex\;{\longrightarrow^{e^-}_{E_{1/2}=-0.57V}}\;Cu(I)-bipy.\;complex\;{\longrightarrow^{2e^-}_{E_{1/2}=-0.97V}}\;Cd(I)-bipy\;complex$$Cu(II)-en.\;complex\;{\longrightarrow^{e^-}_{E_{1/2}=+0.05V}\;Cu(I)-en.\;complex{\longrightarrow^{e^-}_{E_{1/2}=-0.92V}}\;Cu(Hg)$ The limiting currents of all steps are controlled by diffusion. The number of ligand and the dissociation constant for Cu(Ⅰ)-bipy. complex were found to be n = 2 and $K_d=(1.5{\pm}0.1){\times}10^{-7}$, respectively.

• Journal of the Korean Chemical Society
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• v.30 no.1
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• pp.51-56
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• 1986

Polarographic behavior of cadmium(II) and copper (II) complexes of 1,5-diphenylcarbohydrazide in dimethylsulfoxide have been investigated by the DC polarography. The reduction processes are estimated as follows; Cd(II)${\cdot}$DPH Complex$\frac{e^-}{(E_{\frac{1}{2}}=-0.12V)}$${\to}$Cd(I)${\cdot}$DPH Complex. Cd(I)${\cdot}$DPH Complex$\frac{e^-}{(E_{\frac{1}{2}}=-0.74V)}$${\to}$Cd(Hg) + nDPH. Cu(II)${\cdot}$DPH Complex$\frac{e^-}{(E_{\frac{1}{2}}=-0.44V)}$${\to}$Cu(I)${\cdot}$DPH Complex. Cu(I)${\cdot}$DPH Complex$\frac{e^-}{(E_{\frac{1}{2}}=-0.84V)}$${\to}$Cu(Hg) + nDPH. The limiting currents of all reduction wave are irreversible. The number of ligand and the dissociation constant for Cu(I)${\cdot}$1.5-diphenylcarbohydrazide complex were found to be 2 and 5.12 ${\times}10^{-8}$, respectively. All reduction waves of complexes are irreversible. Based on the experimental results, the polarographic reductions of complexes in dimethylsulfoxide solution occurred in two one-electron steps.

• Journal of the Korean Wood Science and Technology
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• v.45 no.5
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• pp.544-558
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• 2017

The objective of this research is to investigate preservative efficacy for refractory species in field tests. The field tests were set up to evaluate the preservative performance of western hemlock and white spruce preservative-treated to the residential products group C and D of Canadian standard (CSA O80 Series-08) that have been developed for residential use in above-ground and ground-contact conditions, respectively. They were incised and pressure-treated with alkaline copper quaternary (ACQ) or copper azole (CA). Treated samples for the ground contact stake test and ground proximity test were installed in Jinju, Korea on November 2010 according to AWPA E7-09 and AWPA E18-06, respectively. Each sample has been annually assigned ratings for decay and termite attack, based on AWPA E7 grading system. After six years and five months of exposure, the untreated samples showed decay and particularly severe damage by termite attack but all the preservative-treated samples showed no decay. The results showed that the 5-mm penetration depths may be applicable for the treatment of refractory species. This paper discusses what to consider for the use of refractory species in Korean wood preservation industry from the penetration and retention points of view.

• Applied Chemistry for Engineering
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• v.23 no.6
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• pp.554-560
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• 2012

Recently, it has been increasing trend to use conductive materials as electronics and communication technology in electronics industry are developing. The noble metal such as Ag, Pt, Pd etc. are mostly used as conductive materials, To reduce production cost, alternative materials with similar characteristics of noble metals are needed. Copper has advantages, i.e its electronic properties are similar to noble metals and low cost than noble metal, but its use has been restricted because of oxidation in air. In this study, the tin film was coated on copper by electroless plating to protect copper from oxidation and to confirm the effects of temperature, pH, amount of $SnCl_2$, and feeding speed in plating conditions. Additionally, we apply $Cu_{core}Sn_{shell}$ powder as conductive filler with low-temperature densification and analysis by SEM, XRD, FIB and 4-Point Probe techniques. As result of the study, tin film was coated well on copper and was protected from oxidation. After low-temperature densification treatment, the meted tin made chemical interconnections with copper. Accordingly, conductivity was increased than before condition. We hope $Cu_{core}Sn_{shell}$ powder to replace noble metals and use in the electronic field.

• Journal of Conservation Science
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• v.34 no.4
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• pp.245-257
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• 2018

To investigate the deterioration of textiles with metal thread, I surveyed 40 textile objects, dating from the 11th to the 19th century from Korea, China, Japan, and Central Asia at the Metropolitan Museum of Art, New York. This survey included various types, widths, and thicknesses of metal thread. In addition, deterioration was examined under the microscope and color information was collected using the spectrophotometer. While investigating metal thread in the collections, I fabricated 12 different types of metal samples with metal leaf(24K gold, silver, and copper leaf), adhesive (hide animal glue and a mixture of hide animal glue and iron oxide red), and paper substrate(Korean mulberry and Taiwanese kozo paper). The accelerated deterioration process of those fabricated samples was carried out using a light box(UV and daylight), and a humidity cabinet. In the light experiment with blue scales textile fading card(aka, blue wool standard), the metal leaf began to peel off during the deterioration process with 756,000 lux-hours UV and daylight. In the temperature and humidity experiment, I could observe the reddish tarnish on copper, and some part of it began to peel off. Color reading on the light exposed samples showed that the degree of color change on the surface follows the amount of exposure as it increased over time. On the other hand, color change on the samples after artificial deterioration using temperature and humidity factors showed random change of color with occasional spikes. Distortion of original shape worsened in the samples exposed to temperature and humidity.