• Bulletin of the Korean Chemical Society
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• v.21 no.11
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• pp.1085-1089
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• 2000

The effect of 2-hydroxyacetophenone-aroyl hydrazone derivatives on the inhibition of copper corrosion in 3N nitric acid solution at 303 K was investigated by galvanostatic polarization and thermometric techniques. A significant decrease in the cor rosion rate of copper was observed in the presence of the investigated compounds. The corrosion rate was found to depend on the nature and concentrations of the inhibitors. The degree of surface coverage of the adsorbed inhibitors is determined from polarization measurements, and it was found that the results obey the Frumkin adsorption isotherm. The inhibitors acted as mixed-type inhibitors, but the cathode is more polarized. The relative inhibitive efficiency of these compounds has been explained on the basis of structure dependent electron donor properties of the inhibitors and the nature of the metal-inhibitor interaction at the surface. Also, some thermodynamic data for the adsorption process ( ΔGa* and f ) are calculated and discussed.

• Corrosion Science and Technology
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• v.9 no.6
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• pp.276-280
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• 2010

Copper(Cu) as an interconnecting metal layer can replace aluminum (Al) in IC fabrication since Cu has low electrical resistivity, showing high immunity to electromigration compared to Al. However, it is very difficult for copper to be patterned by the dry etching processes. The chemical mechanical polishing (CMP) process has been introduced and widely used as the mainstream patterning technique for Cu in the fabrication of deep submicron integrated circuits in light of its capability to reduce surface roughness. But this process leaves a large amount of residues on the wafer surface, which must be removed by the post-CMP cleaning processes. Copper corrosion is one of the critical issues for the copper metallization process. Thus, in order to understand the copper corrosion problems in post-CMP cleaning solutions and study the effects of DC biases and post-CMP cleaning solution concentrations on the Cu film, a constant voltage was supplied at various concentrations, and then the output currents were measured and recorded with time. Most of the cases, the current was steadily decreased (i.e. resistance was increased by the oxidation). In the lowest concentration case only, the current was steadily increased with the scarce fluctuations. The higher the constant supplied DC voltage values, the higher the initial output current and the saturated current values. However the time to be taken for it to be saturated was almost the same for all the DC supplied voltage values. It was indicated that the oxide formation was not dependent on the supplied voltage values and 1 V was more than enough to form the oxide. With applied voltages lower than 3 V combined with any concentration, the perforation through the oxide film rarely took place due to the insufficient driving force (voltage) and the copper oxidation ceased. However, with the voltage higher than 3 V, the copper ions were started to diffuse out through the oxide film and thus made pores to be formed on the oxide surface, causing the current to increase and a part of the exposed copper film inside the pores gets back to be oxidized and the rest of it was remained without any further oxidation, causing the current back to decrease a little bit. With increasing the applied DC bias value, the shorter time to be taken for copper ions to be diffused out through the copper oxide film. From the discussions above, it could be concluded that the oxide film was formed and grown by the copper ion diffusion first and then the reaction with any oxidant in the post-CMP cleaning solution.

• Journal of the Korean Chemical Society
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• v.51 no.1
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• pp.31-35
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• 2007

The tripodal copper(II) complex [Cu(pmea)(H2O)](ClO4)2·H2O (1) (pmea = bis[(2-pyridyl)methyl]-2-(2-pyridyl)ethylamine) has been synthesized and structurally characterized by X-ray diffraction method. It crystallizes in the triclinic system P-1 with a = 9.9362(9), b = 15.7299(17), c = 18.0562(11) A, α = 68.760(8), β = 76.331(6), γ = 77.092(9)°, V = 2526.2(4) A3, Z = 2. Each copper atom reveals a distorted square pyramidal with three nitrogen atoms of the pmea ligand and water molecule occupying the basal plane and one nitrogen atom from the pyridine ring according the axial position. The cyclic voltammogram of 1 undergoes reversible one-electron oxidation to the CuIII and reversible one-electron reduction to the CuI.

• Journal of the Korean Chemical Society
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• v.32 no.2
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• pp.122-129
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• 1988

The rates of aquation of sparteine cobalt(II) halide and sparteine copper(II) halide were investigated in the citrate buffer solutions. The aquation of cobalt(II) complexes proceeds via D-mechanism and the catalytic effect of halide ions is not observed. The aquation of copper(II) complexes proceeds via $I_d$-mechanism and is catalyzed by the presence of cyanide and halide ions, and the aquation rate is pH dependent. The different mechanistic behavior of cobalt(II) complexes from corresponding copper(II) complexes seems to be attributed to the weakness of Co-N bond in the coordination sphere.

• Journal of the Korean Institute of Gas
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• v.27 no.1
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• pp.78-85
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• 2023

Fixed-bed reactor Computational Fluid Dynamics (CFD) simulation of methanol steam reforming reaction was performed using the intrinsic kinetic data of the copper-impregnated hydrotalcite catalyst. The activation energy of the copper hydrotalcite catalyst obtained from the previous study results was 97.4 kJ/mol, and the pre-exponential was 5.904 × 10¹⁰. Process simulation was performed using the calculated values and showed a similar tendency to the experimental results. And the conversion rate according to the change of the reaction temperature (200 - 450 ℃) and the molar ratio of methanol and water was observed using the intrinsic kinetic data. In addition, mass and heat transfer phenomena analysis of a commercial reactor (I.D. 0.05 - 0.1m, Length 1m) was predicted through axial 2D Symmetry simulation using the power law model of the above kinetic constants.

• Asian-Australasian Journal of Animal Sciences
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• v.12 no.4
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• pp.579-584
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• 1999

The trace mineral status of cattle in the smallholder grazing areas of Sanyati and Chinamhora in Zimbabwe was evaluated during the rainy and dry seasons of 1994 and 1995. The evaluation was done in terms of mineral concentration in blood plasma. Plasma copper in calves, steers and cows in the dry season was; Sanyati: 0.55, 0.59, and 0.61; Chinamhora: 0.59, 0.58, and $0.60{\mu}g/ml$, respectively versus a normal of $0.65{\mu}g/ml$. In the rainy season, copper was deficient at both sites (averaging $0.56{\mu}g/ml$ and $0.59{\mu}g/ml$ at Sanyati and Chinamhora, respectively). Plasma selenium in the dry season was 0.017, 0.025, and $0.017{\mu}g/ml$ for calves, steers and cows, respectively at Sanyati versus a normal of $0.03{\mu}g/ml$ and therefore considered to be deficient. Iron, zinc and cobalt were found to be generally high and therefore unlikely to be deficient. Copper and selenium are recommended in salt licks in these environments.

• Journal of Power Electronics
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• v.14 no.2
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• pp.351-361
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• 2014

The discrete torque generation mechanism and inherently nonlinear magnetic characterization of switched reluctance motors lead to unacceptable torque ripples and limit the application of these motors. In this study, a phase current profiling technique and torque sharing function are proposed in consideration of magnetic saturation effects and by minimizing power loss in the commutation area between the adjacent phases. Constant torque trajectories are considered in incoming and outgoing phase current planes based on nonlinear T-i-theta curves obtained from experimental measurements. Optimum points on constant torque trajectories are selected by improving drive efficiency and minimizing copper loss in each rotor position. A novel analytic invertible function is introduced to express phase torque based on rotor position and its corresponding phase current. The optimization problem is solved by the proposed torque function, and optimum torque sharing functions are derived. A modification method is also introduced to enhance the torque ripple-free region based on simple logic rules. Compared with conventional torque sharing functions, the resultant reference current from the proposed method has less peak and effective values and exhibits lower copper loss. Experimental and simulation results from a four-phase 4 KW 8/6 SRM validate the effectiveness of the proposed method.

• Advances in materials Research
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• v.4 no.3
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• pp.165-178
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• 2015

Friction coefficient of epoxy metal matrix composites were investigated. The main objective was to increase the friction coefficient through rubber sole sliding against the epoxy floor coating providing appropriate level of resistance. This was to avoid the excessive movement and slip accidents. Epoxy metal matrix composites were reinforced by different copper wire diameters. The epoxy metal matrix composites were experimentally conducted at different conditions namely dry, water and detergent wetted sliding, were the friction coefficient increased as the number of wires increased. When the wires were closer to the sliding surface, the friction coefficient was found to increase. The friction coefficient was found to increase with the increase of the copper wire diameter in epoxy metal matrix composites. This behavior was attributed to the fact that as the diameter and the number of wires increased, the intensity of the electric field, generated from electric static charge increased causing an adhesion increase between the two sliding surfaces. At water wetted sliding conditions, the effect of changing number of wires on friction coefficient was less than the effect of wire diameter. The presence of water and detergent on the sliding surfaces decreased friction coefficient compared to the dry sliding. When the surfaces were detergent wetted, the friction coefficient values were found to be lower than that observed when sliding in water or dry condition.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.188-188
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• 2011

Recently, scaling down of ULSI (Ultra Large Scale Integration) circuit of CMOS (Complementary Meta Oxide Semiconductor) based electronic devices, the electronic devices, become much faster and smaller size that are promising property of semiconductor market. However, very narrow interconnect line width has some disadvantages. Deposition of conformal and thin barrier is not easy. And metallization process needs deposition of diffusion barrier and glue layer for EP/ELP deposition. Thus, there is not enough space for copper filling process. In order to get over these negative effects, simple process of copper metallization is important. In this study, Cu-V alloy layer was deposited using of DC/RF magnetron sputter deposition system. Cu-V alloy film was deposited on the plane SiO2/Si bi-layer substrate with smooth surface. Cu-V film's thickness was about 50 nm. Cu-V alloy film deposited at $150^{\circ}C$. XRD, AFM, Hall measurement system, and AES were used to analyze this work. For the barrier formation, annealing temperature was 300, 400, $500^{\circ}C$ (1 hour). Barrier thermal stability was tested by I-V(leakage current) and XRD analysis after 300, 500, $700^{\circ}C$ (12 hour) annealing. With this research, over $500^{\circ}C$ annealed barrier has large leakage current. However vanadium-based diffusion barrier annealed at $400^{\circ}C$ has good thermal stability. Therefore thermal stability of vanadium-based diffusion barrier is desirable for copper interconnection.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.1
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• pp.39-43
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• 2015

The cement mixtures such as flyash, iron-slag and silica fume have been actively studied in order to increase the quality of concrete. In this study, the grinded copper-slag with different proportion was added to portland cement. The physical properties of the cement mortars, (i.e.) flowability, absorption, compressive strength and flexural strength, were investigated for the potential application to the cement. Also, the influence of the acid on the chemical resistance of the cement mortars with copper-slag was evaluated by monitoring the weight variation of the cement mortars under 5 % sulfuric acid for 28 days.