• Title/Summary/Keyword: Cooling device

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A Study on cooling technology of electronics communication device consoles using heat pipe exchangers (히트파이프 열교환기를 이용한 전자통신장비 콘솔의 냉각 기술에 관한 연구)

  • Choi, Jee-Hoon;Ryoo, Seong-Ryoul;Sung, Byung-Ho;Lee, Jung-Hwan;Kim, Jong-Man;Chun, Ji-Hwan;Suh, Myung-Won;Kim, Chul-Ju
    • 유체기계공업학회:학술대회논문집
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    • 2006.08a
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    • pp.483-486
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    • 2006
  • The fan is widely used to cool high heat flux generated as of the electronic communication device consoles. It, however, makes a lot of noises that interfere considerably with the operation environment. This study was conducted to obtain the cooling design technology of the consoles through being equipped with the Heat Pipe Heat Exchangers (HPHE) together with low revolution fans in place of existing fans for the cooling technology of the forced convection. Not only the sealed type consoles but the HPHE were also designed so as to cool effectively the heat generated from the inside of the console. The simulation was conducted by computational numerical analysis along with its experiments. The results of the numerical analysis and experiments were compared in order to improve the cooling technology of the consoles mounted with the HPHE. Consequently, instead of loud fan noise generated as of existing forced convection methods, the cooling technology of HPHE can remarkably improve many problems such as the operation environment, indoor dust, malfunction caused by pollution sources and so on.

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Effect of Groove and Channel Size on the Thermal Transport Capacity of Micro-Capillary Pumped Loop for Mobile Electronic Device Cooling System (모바일 전자장비 냉각용 Micro-CPL내 형상크기변화에 따른 열성능 해석)

  • Kim, Byeong-Gi;Seo, Jeong-Se;Hwang, Geon;Mun, Seok-Hwan;Bae, Chan-Hyo
    • Proceedings of the SAREK Conference
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    • 2005.11a
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    • pp.329-334
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    • 2005
  • As more high power wide band gap devices are being utilized. the thermal management issues associated with these devices need to be resolved. High power small devices dissipate excessive heat that must be cooled, but traditional cooling methods are insufficient to provide such a cooling means. This paper will evaluate a micro-capillary pumped loop thermal management system that is incorporated into the shim of the device, taking advantage of phase-change to increase the thermal conductivity of the system. The results of the modeling of the thermal management system will be discussed.

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A study on the monitoring of cooling time using the change in the magnitude of mold vibration in injection molding (사출성형에서 공정 중 금형의 진동 크기 변화를 활용한 냉각시간 모니터링에 대한 연구)

  • Yeung, Chris;Kim, Jong-Sun
    • Design & Manufacturing
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    • v.15 no.3
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    • pp.45-49
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    • 2021
  • In this study, during the injection molding process, a device was manufactured and evaluated that calculates a cooling time by measuring a vibration signal generated from a mold using an acceleration. The last two parts, one of which has a large magnitude change in the measured vibration signal of a mold, were divided into a cooling start section (paking end section) and a mold opening section, and the time difference at the relevant points was calculated as the cooling time. The cooling time was monitored on a 5-inch light guide plate mold by applying the method. The manufactured device was attached to a fixed base of mold to measure the cooling time, and data was obtained remotely using Bluetooth technology. Then, the measured cooling time was compared with the cooling time set in the injection molding machine to evaluate the accuracy. As a result of the experiment, the cooling times measured by the devices were 15.675±0.024 sec, 20.637±0.014 sec and 25.623±0.079 sec of each conditions. Also, the measurement results were shown with errors of 0.655±0.044 sec, 0.637±0.014 sec, and 0.662±0.013 sec, respectively.

Development of Automatic Wax-Ring Manufacturing System for Silk Coating (섬유코팅용 왁스링 성형을 위한 자동화 시스템 개발)

  • Cho, Young Hak;Maeng, Heeyoung
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.22 no.3_1spc
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    • pp.531-536
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    • 2013
  • An automatic wax-ring manufacturing system for silk coating was developed, which consisted of a container, pallet with a cooling part, injection port, and removing device. The removing device is a system to load, lift, and cut the wax-ring, which is widelyused for various silk-coating industrial purposes. A novel removing device equipped with a water cooling circulation system is proposed in this paper. It has the benefit of easy control, as well as the convenience of loading and unloading without the use of other equipment. Three-dimensional modeling techniques were adopted to develop integrated functions for the automatic wax-ring manufacturing system, which made it possible to confirm the smooth integration/interface of each part and the system's interrelations with other manufacturing systems.

Development of the closed-loop Joule-Thomson cryoablation device for long area cooling

  • Lee, Cheonkyu;Park, Inmyong;Yoo, Donggyu;Jeong, Sangkwon;Park, Sang Woo
    • Progress in Superconductivity and Cryogenics
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    • v.15 no.3
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    • pp.40-48
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    • 2013
  • Cryoablation device is a surgical instrument to produce the cooling effect to destroy detrimental biological tissue by utilizing low temperature around 110 K. Usually, this device has the concentrated cooling region, so that it is suitable for concentrated and thick target. Accordingly, it is hard to apply this device for the target which is distributed and thin target. In this study, the design procedure of a closed-loop cryoablation device with multiple J-T expansion part is developed for the treatment of incompetent of great saphenous vein. The developed cyoablation device is designed with the analysis of 1-dimensional (1-D) bio-heat equation. The energy balance is considered to determine the minimum mass flow rate of refrigerant for consecutive flow boiling to develop the uniform cooling temperature. Azeotropic mixed refrigerant R410A and zeotropic mixed refrigerant (MR) of R22 ($CHClF_2$) and R23 ($CHF_3$) are utilized as operating fluids of the developed cryoablation device to form the sufficient temperature and to verify the quality of the inside of cryoablation probe. The experimental results of R410A and the zeotropic MR show the temperature non-uniformity over the range are $244.8K{\pm}2.7K$ and $239.8K{\pm}4.7K$ respectively. The experimental results demonstrate that the probe experiences the consecutive flow boiling over the target range of 200 mm.

A Study on the Warpage of Injection Molded Parts for the rapid Cooling and Heating Device (급속냉각·가열장치에 따른 사출성형품의 휨에 관한 연구)

  • Lee, Min;Kim, Tae-Wan
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.16 no.8
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    • pp.5074-5081
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    • 2015
  • A method for improving the warpage of the plastic part is a method of removing residual stress of the plastic product. that a non-uniform cooling are appeared in the injection molding process make uniform cooling. this study was developed the Rapid heating and cooling device used peltier module for uniform cooling. Make the Rapid heating and cooling device(RCHD), for Traditional water cooling device(TWCD) method and the Rapid heating and cooling method warpage were compared and were analyzed and the materials used amorphous ABS polymer. various warpage were compared for the process parameters such as packing pressure, packing time, resin temperature, mold temperature, In the amorphous ABS polymer, TWCD method has higher warpage than RCHD method and show the result to be a bit more uniform cooling. The distribution state of the ABS polymer was confirmed Through the Scanning electron microscope. In the TWCD method the distribution state of the polymer be densely distributed, and RCHS method be distributed wider than TWCD method. this is that injection molded parts be seen that cooling was made uniformly, As the temperature of the mold is gradually progress, Particles of the polymer is increased this is that internal stress was reduced.

The application of separate type thermosyphon for cooling of electronic equipments (전자 장비 냉각에 있어서의 분리형 써모사이펀의 적용)

  • Kim J.H;Park S.B.;Yoon J.H.;Kim S.P;Jun C.H
    • Proceedings of the KSME Conference
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    • 2002.08a
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    • pp.725-728
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    • 2002
  • A separate type thermosyphon can be utilized as a cooling device of electronic equipments (such as CPU of a personal computer or notebook). This study was carried out to investigate the cooling effect of separate type thermosyphon and to find the adequate parameters affecting the separate type thermosyphon. The heat transfer characteristics of separate type thermosyphon were obtained from experimental results. A $50{\times}50{\times}2 mm$ heat source was copied after CPU for the experiments. The results indicate that the device is capable of dissipating 60W of thermal energy and keeping the heat plate surface temperature under 50'E and the device can transfer heat from the evaporator to the condenser through natural circulation (without any external driving forces). Some transport phenomena of the working fluid and the heat transfer characteristics of the loop were observed in the experiments and are discussed in detail below.

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Experimental Study on Coefficient of Flow Convection (유수대류계수에 관한 실험적 연구)

  • 정상은;오태근;양주경;김진근
    • Proceedings of the Korea Concrete Institute Conference
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    • 2000.04a
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    • pp.297-302
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    • 2000
  • Pipe cooling method is widely used for reduction of hydration heat and control of cracking in mass concrete structures. However, in order to effectively apply pipe cooling systems to concrete structure, the coefficient of flow convection relating the thermal transfer between inner stream of pipe and concrete must be estimated. In this study, a device measuring the coefficient of flow convection is developed. Since a variation of thermal distribution caused by pipe cooling has a direct effect in internal forced flows, the developed testing device is based on the internal forced flow concept. Influencing factors on the coefficient of flow convection are mainly flow velocity, pipe diameter and thickness, and pipe material. finally a prediction model of the coefficient of flow convection is proposed using experimental results from the developed device. According to the proposed prediction model, the coefficient of flow convection increases with increase in flow velocity and decreases with increase in pipe diameter and thickness. Also, the coefficient of flow convection is largely affected by the type of pipe materials.

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Development of Cooling/Warming System Using Thermoelectric Device (열전소자를 이용한 냉·온장시스템 개발)

  • Kim, Kee-Hwan
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.9 no.3
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    • pp.131-136
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    • 2009
  • The thermoelectric effect is the direct conversion of temperature differences to electric voltage and vice versa. A thermoelectric device creates a voltage when there is a different temperature on each side. Conversely when a voltage is applied to it, it creates a temperature difference. This effect is used in this paper to cool objects or to heat them. A cooling/warming system with thermoelectric device is introduced and controlled with PC and LabVIEW.

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