• Restorative Dentistry and Endodontics
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• v.20 no.1
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• pp.1-16
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• 1995

The purpose of this study was to investigate the effect of dentin bonding agents on the bond strength of composite resin restorations in case of applying the dentin bonding agents to acid etched enamel surfaces. Freshly extracted 364 bovine anterior teeth were selected as a adherents. 320 enamel specimens were divided into two groups(unetched group (1) and etched group (2) for testing the shear bond strength, 40 specimens were used for the hardness testing, and 4 specimens of rest were to observe the resin-tag formation into etched enamel surfaces. All surfaces of enamel specimens were polished with 320~1500 SiC paper under continuous running water. In Group (1), 100 enamel specimens were polished and unetched. 220 polished enamel specimens in Group (2) were etched with 37 % phosphoric acid solution for 60 seconds, washed with water for 20 seconds, and dried with a light air pressure for 60 seconds. Three kinds of dentin bonding agents(Gluma, Prisma, Scotchbond 2) were evaluated the effect on the bond strength to conditioned enamel surfaces. Shear bond strengths were measured on the three cases such as a coating of primer only, a coating of sealer only, and a sequential coating of primer and sealer to acid etched enamel surfaces were compared with the bond strengths measured by the coating of enamel bonding agent followed by the bonding of composite resin (Photo clearfil bright, Kuraray, Japan) to unetched and acid etched enamel surfaces. In addition, the hardness tested on the adhesive fractured surface between composite resin enamel as a mean of evaluation of a factor whether the mechanical bond strengths were affected and the penetration of dentin bonding agents into etched enamel surfaces was also observed. Bond strengths were measured using the method of shear bond strength by a universal testing machine (Instron-4467, USA), statistical test were applied to the results using a one way analysis variance(ANOVA), and hardness was measured by the Vicker's Hardness Tester(MHT-i, Matsuzawa, Japan) and the penetration of the resins were observed by the SEM (Hitachi, S-2300, Japan). The following conclusions were drawn; 1. Enamel bonding agent showed to affect the improvement of bond strength of composite resin to enamel surface both unetched and etched. 2. Dentin bonding agents could be resulted in increase of bond strength to unetched enamel surface, but there were no statistical significances. 3. Bond strengths to etched enamel surface were significantly decreased with a coating of dentin primer only. 4. Coating of sealer only and coating of primer and sealer noticed the similar bond strengths of composite resin to etched enamel using the enamel bonding agents. 5. The applying method proved to be more effective than the kinds of dentin bonding agents on the bond strength of composite resin to etched enamel than the kind of dentin. 6. Vicker's hardness numbers of dentin bonding agents were lower than that of composite resin, but the degree of penetration of dentin bonding agents into etched enamel surfaces was excellent.

• Journal of Welding and Joining
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• v.30 no.6
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• pp.113-119
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• 2012

Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.04a
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• pp.25-28
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• 2002

Contact type Ic measurement system is needed to measure Ic continuously for long Bi-2223 tapes. Voltage and current terminals were designed several shapes for 4-probe method Ic measurement. Voltage terminals were made with brass and current terminals were made with Cu. We used 2 kinds of Bi-2223 tapes with different strength. When we measured Ic of Bi-2223 tape with Ag-Mg sheath, The proper weight was 0.3 kg and sharp pin type was better. according to voltage terminal shape and load. In case of Bi-2223 tape with Ag-Mn sheath, the proper terminal weight was 4 kg and sharp pin type was bad. It was possible to make continuous contact type Ic measurement system because We could get proper data - terminal shapes and loads - through these experiments.

• Computational Structural Engineering
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• v.10 no.4
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• pp.349-358
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• 1997

The present paper describes an investigation into the application of the genetic algorithm (GA) in the optimum design of composite laminated structure. Stochastic processes generate an initial population of designs and then apply principles of natural selection/survival of the fittest to improve the designs. The five test functions are used to verify the robustness and reliability of the GA, and as a numerical example, minimum weight of a cantilever composite laminated beam with a mix of continuous, integer and discrete design variables is obtained by using the GA with exterior penalty function method. The design problem has constraints on strength, displacements, and natural frequencies, and is formulated to a multidimensional nonlinear form. From the results, it is found that the GA search technique is very effective to find the good optimum solution as well as has higher robustness.

• Journal of IKEEE
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• v.26 no.1
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• pp.19-26
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• 2022

In this paper, we propose an algorithm that applies a different variable lambda to each loss value to solve the performance degradation caused by domain differences in LwF, and show that the retention of past knowledge is improved. The lambda value could be variably adjusted so that the current task to be learned could be well learned, by the variable lambda method of this paper. As a result of learning by this paper, the data accuracy improved by an average of 5% regardless of the scenario. And in particular, the performance of maintaining past knowledge, the goal of this paper, was improved by up to 70%, and the accuracy of past learning data increased by an average of 22% compared to the existing LwF.

• Restorative Dentistry and Endodontics
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• v.35 no.2
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• pp.125-133
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• 2010

Objectives: Rapid polymerization of overlying composite resin causes high polymerization shrinkage stress at the adhesive layer. In order to alleviate the shrinkage stress, increasing the light intensity over the first 5 seconds was suggested as an exponential curing mode by an LED light curing unit (Elipar FreeLight2, 3M ESPE). In this study, the effectiveness of the exponential curing mode on reducing stress was evaluated with measuring microtensile bond strength of three adhesives after the overlying composite resin was polymerized with either continuous or exponential curing mode. Methods: Scotchbond Multipurpose Plus (MP, 3M ESPE), Single Bond 2 (SB, 3M ESPE), and Adper Prompt (AP, 3M ESPE) were applied onto the flat occlusal dentin of extracted human molar. The overlying hybrid composite (Denfil, Vericom, Korea) was cured under one of two exposing modes of the curing unit. At 48h from bonding, microtensile bond strength was measured at a crosshead speed of 1.0 mm/min. The fractured surfaces were observed under FE-SEM. Results: There was no statistically significant difference in the microtensile bond strengths of each adhesive between curing methods (Two-way ANOVA, p > 0.05). The microtensile bond strengths of MP and SB were significantly higher than that of AP (p < 0.05). Mixed failures were observed in most of the fractured surfaces, and differences in the failure mode were not observed among groups. Conclusion: The exponential curing method had no beneficial effect on the microtensile dentin bond strengths of three adhesives compared to continuous curing method.

• Korean Journal of Materials Research
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• v.10 no.10
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• pp.665-670
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• 2000

Linear annealing method was developed to increase the bond strength of Si wafer pair mated at room tem­perature instead of conventional furnace annealing method. It has been known that the interval of the two mating wafer surfaces decreases and the density of gaseous phases generated at the interface increases with increase in an-nealing temperature. The new annealing method consisting of one heat source and light reflecting mirror used these two phenomena and was applied to Si$\mid$$\mid$Si and Si$\mid$$\mid$$SiO_2/Si$ bonding. The bonding interface observed directly by using IR camera and HRTEM showed clear bonding interface without any unbonded areas except the area generated by the dusts inserted into the mating interface at the room temperature. Crack opening method and direct tensile test was ap­pplied to measure the bond strength. The two methods showed similar results. The bond strength increased continuous­tly with the increase of annealing temperature.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2005.05a
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• pp.185-190
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• 2005

Safe, economical and environment-friendly tunnel construction are required again along with social continuous development, the importance of waterproof work that is portion that actually all of user and builder can find that is embossed by tunnel construction's one of important construction. Also, ECB (Ethylen Copolymer Bitumen) sheet that is used in existing tunnel waterproofing method (ECB waterproofing method) being black because asphalt (Bitumen) is added, by purpose that make illumination of tunnel interior brightly and scar discovery eases in sheet with coating white film, but ECB that is used present according as ECB that asphalt is added does not satisfy high tensile strength of construction field, quality standard of extension. Also ECB denigrates color of black M/B that asphalt is excepted.

• Journal of Welding and Joining
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• v.15 no.4
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• pp.143-153
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• 1997

In this study, bending test was performed on the real-scale, built-up beam test model fabricated by the $CO_2$ arc spot welding to evaluate the applicability of the welding method to the production of the stiffened plate in car-carrying ship. The built-up beam models which were fixed at both ends in longitudinal direction or simply supported to the rigid foundation, depending on the restraint condition of the corresponding car decks considered, were subjected to simulated design vehicle loads or concentrated point loads. During the test, the central deflection and the longitudinal bending stresses were measured from several points on the longitudinal flange face to predict the section properties of the built-up beams. The longitudinal bending stress on each spot weld were also measured to calculate the average horizontal shear force subjected to spot welds. Test results revealed that the shear strength of spot welds with their current weld nugget size and welding pitch was adequate enough to withstand the horizontal shear forces under the design vehicle loads. Although the built-up beam fabricated by the arc spot welding was a discontinuous beam, its mechanical behavior was well explained by the continuous beam theory using the effective breadth of plate. Based on test results, the criterion for the size of spot weld of which the average shear stress might meet the allowable stress requirement of AWS Code could be established.

• Geomechanics and Engineering
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• v.5 no.5
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• pp.379-399
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• 2013

In practice, analysis of laterally loaded piles is carried out using beams on non-linear Winkler springs model (often known as p-y method) due to its simplicity, low computational cost and the ability to model layered soils. In this approach, soil-pile interaction along the depth is characterized by a set of discrete non-linear springs represented by p-y curves where p is the pressure on the soil that causes a relative deformation of y. p-y curves are usually constructed based on semi-empirical correlations. In order to construct API/DNV proposed p-y curve for clay, one needs two values from the monotonic stress-strain test results i.e., undrained strength ($s_u$) and the strain at 50% yield stress (${\varepsilon}_{50}$). This approach may ignore various features for a particular soil which may lead to un-conservative or over-conservative design as not all the data points in the stress-strain relation are used. However, with the increasing ability to simulate soil-structure interaction problems using highly developed computers, the trend has shifted towards a more theoretically sound basis. In this paper, principles of Mobilized Strength Design (MSD) concept is used to construct a continuous p-y curves from experimentally obtained stress-strain relationship of the soil. In the method, the stress-strain graph is scaled by two coefficient $N_C$ (for stress) and $M_C$ (for strain) to obtain the p-y curves. $M_C$ and $N_C$ are derived based on Semi-Analytical Finite Element approach exploiting the axial symmetry where a pile is modelled as a series of embedded discs. An example is considered to show the application of the methodology.