• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2004년도 학술대회지
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• pp.296-300
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• 2004

현재 구조용 세라믹에 대한 연구는 여려 가지 작동 조건에 의해 도출된 마멸 데이터를 정량적으로 제시하고 이들의 마멸기구의 변화가 일어나는 사용 조건의 시점을 파악하였다. 이전의 연구들은 주로 동질 재료끼리 마찰 마멸 실험으로 제한되었다. 그러나 상대 운동하는 세라믹 재료들의 특성 상 기계적, 화학적 물성차이에 의해 마멸 기구와 트라이볼로지적 거동(마찰계수, 마멸율)등 이 다르게 나타날 확률이 높다. 이에, 본 연구에서는 볼 온 디스크 마멸 실험을 통해 여러 가지 작동환경에 따라 서로 상대 운동하는 세라믹의 재료를 달리하여 실험하여 다른 세라믹 재료간의 트라이볼로지적 특성을 고찰하였다. 지르코니아 시편에 대해 지르코니아, 알루미나, 실리콘카바이드 3종의 상대재를 사용하여 속도와 하중조건을 변화하여 마멸실험을 수행한 결과, 지르코니아-실리콘카바이드 조합의 실험에서 저마찰 저마멸 특성이 나타났다.

• Structural Engineering and Mechanics
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• 제74권4호
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• pp.567-576
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• 2020

Considerable controversy surrounds the choice of the best abutment type for implant prosthetics. The two most common structures are hex and non-hex abutments. The non-hex abutment typically furnishes a larger contact area between itself and the implant than that provided by a hex structure. However, when a hex abutment is loaded, the position of its contact area may be deeper than that of a non-hex abutment. Hence, the purpose of this study is to determine the different biomechanical behaviors of an internal bone-level implant based on the abutment type-hex or non-hex-and clinical crown length under static and cyclic loadings using finite element analysis (FEA). The hex structure was found to increase the implant and abutment stability more than the nonhex structure among several criteria. The use of the hex structure resulted in a smaller volume of bone tissues being at risk of hypertrophy and fatigue failure. It also reduced micromovement (separation) between the implant components, which is significantly related to the pumping effect and possible inflammation. Both static and fatigue analyses, used to examine short- and long-term stability, demonstrated the advantages of the hex abutment over the non-hex type for the stability of the implant components. Moreover, although its impact was not as significant as that of the abutment type, a large crown-implant ratio (CIR) increased bone strain and stress in the implant components, particularly under oblique loading.

• Journal of Periodontal and Implant Science
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• 제34권1호
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• pp.35-48
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• 2004

Since the occlusal loading is transmitted to the surrounding bone, the success of an implant treatment is closely related to the distribution of the stress on the implant. The finite element analysis method is often used in order to produce a model for dispersion of stress. Assessment of the success of the implant is usually based on the degree of osseointegration which is a bone and implant surface interface. Implant used in this research was designed through the method of shape optimization after the stress on implant was anaylzed by the finite element analysis method. This study was pertinently assessed by a clinical, histologic, histomorphometric analysis after the shape optimized implant was installed on beagle dog tibia. The results are as follows 1. It clinically showed a good result without mobility and imflammatory reaction. 2. Implant was supported by dense bone and bone remodeling showed on the surrounding area of the implant 3. The average percentage of bone-implant contact was 58.1%.The percentage of bone density was 57.6%. Having above results, shape optimized implant showed the pertinence through clinical and histologic aspects. However, to use the shape optimized implant, the further experiment is required for finding problems, improvement.

• 대한기계학회논문집A
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• 제20권10호
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• pp.3048-3057
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• 1996

Analysis model containing two inclined surface cracks on semi-infinite elastic body is established and analyzed on the basis of linear fracture mechanics to examine mutual interference of two surface cracks. Muskhelishvili's complex stress functions are introduced and a set of singular integral equations is obtained for a dislocation density function. The stress intensity factors at crack tip are obtained by using the Gerasoulis'method. When two surface cracks are parallel and have the same length, the values of $K_1$and $\Delta K_11$(variation of $K_11$) for crack 1 and crack 2 decrease by the mutual interference of two surface cracks as the distance between the two surface cracks shortens. The effect of mutual interference is remarkable in high friction coefficient. In case that two surface cracks are parallel, the values of $K_1$and $\Delta K_11$for crack 2 decrease as the length ratio ot crack 2 to crack 1 becomes small. As the crack inclination angle rises, the value of $K_1$ and the mutual interference of $K_1$for crack 2 increase and the value of$\Delta K_11$ for crack 1 becomes smaller than that for crack 2.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Composites Research
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• 제15권1호
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• pp.41-52
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• 2002

이 논문에서는 탄소/탄소 브레이크 제동중 시스템의 거동을 열탄성 해석을 수행하여 살펴보았고. 파손에 안정적인 디스크의 형상을 찾기 위하여 다양한 형상에 대한 3차원 응력해석을 수행하였다. 탄소/탄소 복합재료의 기계적 물성치가 적층면방향과 두께방향으로 측정되었다. 측정긴 기계적 물성치는 열탄성 해석과 3차원 응력해석을 위한 입력으로 사용 되었다. 로터 클립과 클립 리테이너 사이의 간격은 회전판의 하중전달 미케니즘에 있어서 중요만 인자이다. 간격변화는 기계적 변형과 열 변형으로 분리하여 고려하였다. 클립과 리테이터는 서로 접촉이 발생하지 않았으므로 해석 모델에서 리테이너와 리벳은 제외되었다. 로터 디스크는 반복대칭조건을 사용하여 모델링되었고, 로터 디스크와 로터 클립, 로터 클립과 키 드럼사이의 2중 접촉문제가 고려되었다. 3차인 응력해석의 결과로부터 브레이크 디스크의 키 홀 부분에 응력집중현상이 발생하는 것을 확인하였다. 응력분포는 키 홀 부분에서 접촉면의 회전각과 곡률반경의 변화에 따라 연구 되었다.

• 한국정밀공학회지
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• 제28권5호
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• pp.537-542
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• 2011

The thermo-mechanical interaction between brake block and wheel tread during braking has been found to cause thermal crack on the wheel tread. Due to thermal expansion of the rim material, the thermal cracks will protrude from the wheel tread and be more exposed to wear during the wheel/block contact than the rest of the tread surface. The wheel rim is in residual compression stress when is new. After service running, the region in the tread has reversed to tension. This condition can lead to the formation and growth of thermal cracks in the rim which can ultimately lead to premature failure of wheel. In the present paper, the thermal cracks of railway wheel, one of severe damages on the wheel tread, were evaluated to understand the safety of railway wheel in running condition. The residual stresses for damaged wheel which are applied to tread brake are investigated. Mainly X-ray diffusion method is used. Under the condition of concurrent loading of continuous rolling contact with rails and cyclic frictional heat from brake blocks, the reduction of residual stress is found to correlate well with the thermal crack initiation.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• 한국가스학회지
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• 제12권2호
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• pp.92-98
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• 2008

가스배관 열화부재의 실시간 역학물성 측정기술로 계장화 압입과 압입흔적 입체측정의 융합이 시도되었다. 압입하중-변위곡선을 계장화 압입시험으로 획득한 후 반사식 레이저 스캔너를 이용하여 압입흔적을 3차원으로 관찰하였다. 압흔 단면프로파일로부터 소성역 크기와 실제 접촉경계를 분석할 수 있었고, 두 값을 이용하여 소재의 항복강도와 경도를 계산하였다. 항복강도는 단축 인장시험에서 얻어진 값과 유사한 경향을 나타내었고, 경도는 재료쌓임 영향으로 압입곡선에서 계산된 값에 비해 $20{\sim}30%$ 낮은 값을 나타내었으나 최대 인장강도와 정량적인 관련성이 있음을 확인할 수 있었다. 덧붙여 압입하중 인가부의 형태를 수정하여 압입시험과 동시에 압흔주변 형상변화를 측정하기 위한 시스템도 고안되었다.