• 제목/요약/키워드: Contact point

검색결과 1,219건 처리시간 0.039초

고속 전철 급전기의 접촉 분리를 고려한 동역학적 해석 (Dynamic Analysis of the Pantograph of a High-speed Electrical Train Considering Contact and Separation)

  • 이기수
    • 한국소음진동공학회논문집
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    • 제16권6호
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    • pp.634-642
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    • 2006
  • For the analysis of dynamic contact between a catenary and a pantograph of high-speed electrical train, the numerical solution of the equations of motion of the vehicle pantograph and the catenary system subjected to the contact condition is obtained. The whole equations of motion of the catenary and the pantograph are simultaneously time integrated with the strict application of the contact condition. For the stability of the numerical solution, with the cubic spline interpolation of the catenary displacement, the velocity and acceleration constraints as well as the displacement constraint are imposed on the contact point. Especially it is shown that the Coriolis and centripetal accelerations are critical for the accuracy and stability of the computation.

Progressive Multi-Leaf Spring의 소음저감 방안에 관한 연구 (A Study on the Method for Reducing the Noise of the Progressive Multi-Leaf Spring)

  • 김성수;문원규;유영일
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2000년도 추계학술대회논문집
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    • pp.636-642
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    • 2000
  • A method for reducing the contact noise of the Progressive Multi-Leaf Spring was investigated. It was found that the contact noise between the main and the help springs is the main source of the noise through our experiments. The conclusions from our experiments were compared with those from our numerical analysis by use of ABAQUS. The main parameters for the unexpected noise in the leaf spring were investigated through structural analysis to make describing noise generation. The contact process between the two leaves is examined by numerical calculations by ABAQUS. The noise produced by the leaf spring could be dramatically reduced by changing the shape of help spring so as to remove a translational jump of the contact point between the main and the help springs. Even with the help spring of the new proposed shape the stiffness of the whole spring did not change much.

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Interface slip of post-tensioned concrete beams with stage construction: Experimental and FE study

  • Low, Hin Foo;Kong, Sih Ying;Kong, Daniel;Paul, Suvash Chandra
    • Computers and Concrete
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    • 제24권2호
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    • pp.173-183
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    • 2019
  • This study presents experimental and numerical results of prestressed concrete composite beams with different casting and stressing sequence. The beams were tested under three-point bending and it was found that prestressed concrete composite beams could not achieve monolith behavior due to interface slippage between two layers. The initial stress distribution due to different construction sequence has little effect on the maximum load of composite beams. The multi-step FE analyses could simulate different casting and stressing sequence thus correctly capturing the initial stress distribution induced by staged construction. Three contact algorithms were considered for interaction between concrete layers in the FE models namely tie constraint, cohesive contact and surface-to-surface contact. It was found that both cohesive contact and surface-to-surface contact could simulate the interface slip even though each algorithm considers different shear transfer mechanism. The use of surface-to-surface contact for beams with more than 2 layers of concrete is not recommended as it underestimates the maximum load in this study.

Dynamic modeling issues for contact tasks of flexible robotic manipulators

  • 최병오
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1993년도 춘계학술대회 논문집
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    • pp.175-180
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    • 1993
  • The nonlinear integro-differential equations of motion of a two-link structurally flexible planar manipulator executing contact tasks are presented. The equations of motion are derived using the extended Hamilton's principle and the Galerkin criterion. Also, Models for the wrist-force sensor and impact that occurs when the manipulator's end point makes contact withthe environment are presented. The dynamic models presented can be used to studythe dynamics of the system and to design controllers.

2 Dimensional Modeling of Centerless Grinding -Interference Phenomena-

  • Kim, Kang
    • International Journal of Precision Engineering and Manufacturing
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    • 제4권4호
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    • pp.32-38
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    • 2003
  • An analytical model of the interference phenomena in the centerless grinding process is developed to investigate their effects on the roundness profile of a centerless ground workpiece. In this work, the regulating wheel and work-rest blade interferences are modeled as a single point contact. The grinding wheel interference is modeled as multiple points contact because material removal is determined by the duration of contact. The computer simulation results show good agreement with the experimental data. From this work, the existence and effects of the interference phenomena in the centerless grinding process are found.

원자층 식각방법을 이용한, Contact Hole 내의 Damage Layer 제거 방법에 대한 연구

  • 김종규;조성일;이성호;김찬규;강승현;염근영
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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    • pp.244.2-244.2
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    • 2013
  • Contact Pattern을 Plasma Etching을 통해 Pattering 공정을 진행함에 있어서 Plasma 내에 존재하는 High Energy Ion 들의 Bombardment 에 의해, Contact Bottom 의 Silicon Lattice Atom 들은 Physical 한 Damage를 받아 Electron 의 흐름을 방해하게 되어, Resistance를 증가시키게 된다. 또한 Etchant 로 사용되는 Fluorine 과 Chlorine Atom 들은, Contact Bottom 에 Contamination 으로 작용하게 되어, 후속 Contact 공정을 진행하면서 증착되는 Ti 나 Co Layer 와 Si 이 반응하는 것을 방해하여 Ohmic Contact을 형성하기 위한 Silicide Layer를 형성하지 못하도록 만든다. High Aspect Ratio Contact (HARC) Etching 을 진행하면서 Contact Profile을 Vertical 하게 형성하기 위하여 Bias Power를 증가하여 사용하게 되는데, 이로부터 Contact Bottom에서 발생하는 Etchant 로 인한 Damage 는 더욱 더 증가하게 된다. 이 Damage Layer를 추가적인 Secondary Damage 없이 제거하기 위하여 본 연구에서는 원자층 식각방법(Atomic Layer Etching Technique)을 사용하였다. 실험에 사용된 원자층 식각방법을 이용하여, Damage 가 발생한 Si Layer를 Secondary Damage 없이 효과적으로 Control 하여 제거할 수 있음을 확인하였으며, 30 nm Deep Contact Bottom 에서 Damage 가 제거될 수 있음을 확인하였다. XPS 와 Depth SIMS Data를 이용하여 상기 실험 결과를 확인하였으며, SEM Profile 분석을 통하여, Damage 제거 결과 및 Profile 변화 여부를 확인하였으며, 4 Point Prove 결과를 통하여 결과적으로 Resistance 가 개선되는 결과를 얻을 수 있었다.

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인쇄회로기판 검사용 프로브시스템의 광학센서 (An optical sensor of a probing system for inspection of PCBs)

  • 심재홍;조형석;김성권
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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    • pp.1742-1745
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    • 1997
  • We have developed a highly responsible probing system for inspection of electrical properties of assemble PCB$_{s}$ (printed circuit boards). However, as the duration of the impact occurring between a probe and a solder joint on PCB is very short, it is very difficult to control the harmful peak impact force and the slip motion of the probe to sufficient level only by its vorce feedback control with high gains. To overcome these disadvantages of the prototype, it needs ot obtain some information of the solder joint in advance before the contact. In addition, to guarantee the reliability of the probing task, the probing system is required to measure several points around the probale target point at high speed. There fore, to meet such requirements, we propose a new noncontaet sensor capable of detecting simultaneously position and normal vectors of the multiple points around the probable target point in real time. By using this information, we can prepare a control strategy for stable contact motion on impact. In this paper, we described measuring priniciple, design, and development of the sensor. The effectiveness of the proposed sensor is verified through a series of experiments.s.

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3점 방식 불평형량 측정법에서의 오차보상 기법 (Error-compensating Techniques in 3-Point Weighing Method to Measure Unbalance Properties)

  • 이선표
    • 한국정밀공학회지
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    • 제23권11호
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    • pp.42-49
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    • 2006
  • In this paper error-compensating techniques in three-point weighing method to precisely measure unbalance properties such as center of gravity and unbalance moment. In the conventional static methods, 1) fixture-errors, 2) effects of the contact between the fixture and the load scales, and 3) side effect due to the lateral frictional forces acting on the contact points between the fixture and the load scales are the major factors that lead to measurement errors. The proposed error-compensating method perfectly eliminates both the fixture-error and the contact-error simultaneously by manipulating the three measured reaction forces at three different angular locations. Also the friction-error is calibrated by comparing the sum of three reactions with the actual mass of the specimen. A set of measurement is performed using the same measuring system as Lee's, and a comparison of the results from the convectional, Lee's, and the proposed method is provided. The results show that the proposed method effectively compensates the errors listed above.

고효율 단결정 실리콘 태양전지 (High Efficiency Crystalline Silicon Solar Cells)

  • 김동섭;조은철;조영현;;민요셉;이수홍
    • 태양에너지
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    • 제17권1호
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    • pp.17-26
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    • 1997
  • 단결정 실리콘 태양전지는 PESC(Passivated Emitter Solar Cell), PERC(Passivated Emitter and Rear Cell), Point Contact Cell, PERL(Passivated Emitter and Rear Locally-Diffused Cell) 형태로 기술적인 발전을 해왔다. BCSC(Buried Contact Solar Cell)는 낮은 제조 단가로 높은 효율을 얻을 목적으로 개발되었으며 개량된 형태인 DSBC(Double Sided Buried Contact Cell)는 양면으로 빛을 흡수할 수 있는 장점이 있다.

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Solvent 용접에 의한 무정형 고분자 계면의 접착강도 변화에 관한 연구 (Adhesion Strength of Amorphous Polymer Interfaces by Solvent Welding)

  • 정연호;강두환;강호종
    • 폴리머
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    • 제24권1호
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    • pp.23-28
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    • 2000
  • Solvent 용접에 따른 무정형 고분자 폴리스티렌/폴리스티렌 계면의 접착강도의 변화를 butt joint실험을 통하여 살펴보았다. 폴리스티렌과 용해도 상수가 유사한 용매를 계면에 코팅함으로써 계면 분자쇄의 유동성 증가와 계면의 거침정도의 변화에 따른 접촉표면의 증가로 인하여 접착 강도가 증가함을 확인하였다. 사용용매의 비등점이 접착온도보다 높은 경우, 접착강도의 증가는 용매에 의한 분자쇄의 유동성 증가에 기인되는 반면 용매의 비등점이 접착온도에 비해 낮을 경우 접착강도의 증가는 용매에 의한 접촉표면의 증가에 의존함을 알 수 있었다. 접착온도가 높을수록, 접착시간이 길어질수록 접착강도는 증가되며, 사용용매가 접착강도에 미치는 영향은 감소함을 알 수 있었다.

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