• 한국신뢰성학회:학술대회논문집
• /
• 한국신뢰성학회 2004년도 정기학술대회
• /
• pp.139-145
• /
• 2004

용접산업이 발전함에 따라 가스메탈아크 용접에서 고내마모성의 콘택트 팁이 요구되어지고 있다. 현재 국내외에서는 콘택트팁에 대한 수명평가 기준이 없으며, 일부 업계에서 자체 규격을 제정하여 운용하고 있지만 근거가 명확하지 않다. 따라서 본 연구에서는 콘택트팁의 신뢰성 평가기준을 제정하고자 하였다. 팁의 주요 파손기구로는 고온 마찰마모, 전기적 에로존, 번백 등이 있다. 신뢰성 평가는 경도 시험, 열처리 후 경도, 용접 마모, 전기전도도를 시험으로 구성되었다. 팁의 수명은 마모가 45%에 도달했을 경우 송급된 와이어 총 길이로 하였으며, 4시간까지 마모시험 한 결과를 근거로하여 한계수명을 추정하였다. 본 연구에서는 세 가지 조성의 다섯 가지의 콘택트팁에 대하여 4시간동안 내마모성 실험을 하였으며, 마모정도는 1시간 단위로 면적비를 백분율로 환산하여 측정하였다. 실험 결과 가공경화형팁은 1시간이내에 재결정 및 입자성장에 의한 경도 저하로 가공경화가 팁 수명에 지속적 영향을 주지 못하였다. 반면, 석출경화형팁은 석출경화 효과가 지속되어 가공경화형팁보다 수명이 향상 되었다.

• 한국해양공학회지
• /
• 제26권2호
• /
• pp.33-38
• /
• 2012

The effects of the diffusible hydrogen content and hardness on the cold cracking in high strength weld metal were investigated. The diffusible hydrogen contents were influenced by welding parameters such as the voltage and contact tip-to-work distance (CTWD). The diffusible hydrogen content increased with an increase in voltage. However, it was decreased with an increase in CTWD. CTWD also influenced the weld metal hardness,especially when the wire used had a higher strength than the base metal. This showed that weld metal hardness had a more powerful effect on weld metal cold cracking than the diffusible hydrogen content in this experiment.

• 한국안전학회지
• /
• 제22권6호
• /
• pp.20-26
• /
• 2007

The new integrated CAD-CAM systems induce an increasing demand for simulation tools, which are able to simulate industrial part assembly processes by welding, gluing, riveting or bolting(more generally by fastening). Concerning fastened flexible parts, there exist no efficient computational aid on tolerance and methodology available on the field. The first part briefly presents the approach method based on the finite element method for TADA(Tolerance Analysis of Deformable Assemblies). The second part compares the results obtained by simulation using the commercial FEM code with the measurements. The principal elements of dispersion have been identified and studied on an experimental basis in order to test the robustness of the TADA model. This has enabled us to verify the model's possibilities as regards industrial constraints such as the use of incompatible meshes or the use of triangular elements and so on.

• 터널과지하공간
• /
• 제22권1호
• /
• pp.69-76
• /
• 2012

본 논문은 폭약의 폭발현상을 이용한 폭발용접, 폭발성형과 충격분말고화기술의 기본적 원리와 실험방법, 실험결과에 대하여 기술한다. 타이타늄(Ti)과 스테인레스 강(Stainless steel, SUS 304) 판재의 폭발용접 실험결과, 두 재료 접촉면의 단면에서는 연속적인 젯(jet)모양의 파형이 관찰되었고, 두 금속판재의 설치 경사각도가 $15{\sim}20^{\circ}$ 이고 접착속도가 2,100~2,800 m/s인 경우에 최적의 접합조건을 보였다. 알루미늄(Al) 판재를 이용한 폭발성형 실험과 전형적인 가압성형 실험 결과를 비교분석하여, 폭발성형의 경우가 큰 곡률변형을 보여 가공성이 우수한 것으로 확인되었다. 끝으로 금속과 세라믹의 혼합분말($Fe_{11.2}La_2O_3Co_{0.7}Si_{1.1}$)에 대한 충격고화 실험법을 제안하고 실험을 수행한 결과, 고화체의 표면과 내부에 균열이 확인되지 않았으며 세라믹입자와 금속입자들의 강한 미세조직 결합이 형성되었다. 또한 충격분말고화실험에서 발생되는 폭약의 폭발에 의한 폭굉파와 수중 충격파의 전파 및 간섭현상을 분석하기 위하여 LS-Dyna 3D를 이용한 동적해석을 수행하였다. 그 결과, 물용기 내 벽면에서 반사된 수중충격파가 중앙부에서 중첩되어 폭약의 폭발압력보다 높은 20 GPa의 수중 충격압을 보여, 물용기 내부형상의 중요성을 입증하였다.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
• /
• pp.260-265
• /
• 2002

Microbiologically influenced Corrosion (MIC) is one of the most deleterious effects of metal microbe interactions. When a fresh metal surface comes in contact with a non-sterile fluid, biofilm formation is ensued. This might result in the initiation of corrosion. The sites and materials where MIC is implicated are versatile. Industries such as shipping, power generation, chemical etc are reported to be affected. The rapid and unexpected failure of AISI type 304 stainless steel was investigated in the laboratory by simulation studies for a period of 4 months. Slime and water samples from the failure site were screened for corrosion causing bacteria. Both aerobic and anaerobic nora were enumerated and identified using PCR techniques. Pseudomonas sp. and Bacillus sp. were the most common aerobic bacteria isolated from the water and slime samples, whilst sulfate reducing bacteria (SRB) were the major anaerobic bacteria. The aerobic bacteria were used for the corrosion experiments in the laboratory. Coupon exposure studies were conducted using a very dilute (0.1%V/V) nutrient broth medium. The coupons after retrieval were observed under a Scanning Electron Microscope (SEM) for the presence of MIC pits. Compared to sterile controls, metal coupons exposed to Pseudomonas sp and Bacillus sp. showed the initiation of severe pitting corrosion. However, amongst these two strains, Psudomonas sp. caused pits in a very short span of 14 days. Towards the end of the experiment, severe pitting was observed in both the cases. The detailed observation of pits showed they vary both in number and shapes. Whilst the coupons exposed to Bacillus sp. showed widely spread scales like pits, those exposed to Pseudomonas sp. showed smaller and circular pits, which had grown in number and size by the end of the experiment. From these results it is inferred that the rapid and unexpected failure of 304 SS might be due to MIC. Pseudonwnas sp. could be considered as the major responsible bacteria that could initiate pits in the metallic structures. As the appearance of pits was different in both the tested strains, it was thought that the mechanisms of pit formation are different. Experiments on these lines are being continued.

• 한국정밀공학회지
• /
• 제29권8호
• /
• pp.896-905
• /
• 2012

Recently, the application of the plastic material to automotive components and structures has steadily increased to satisfy demands on the saving of overall weight and the improvement of energy efficiency. The objective of this paper is to investigate the development of a bumper back-beam using a thermoplastic olefin (TPO). The bumper back-beam was designed to be manufactured from the injection molding process. In order to obtain a proper design of the bumper back-beam, three-dimensional finite element analyses were performed for various design alternatives. Stress-strain curves for different strain rates were measured by high speed tensile tests of the TPO to consider strain rate effects in the FEA. The influence of the sectional shape and the rib formation on the contact force-intrusion curves, the deflection and the energy absorption rate of the bumper back-beam was examined. From the results of the examination, a proper design of the bumper back-beam was acquired. The bumper back-beam consisting of TPO was fabricated from the injection moulding process and the vibration welding. Pendulum crash tests were carried out using the fabricated bumper back-beam. The results of the tests showed that the designed bumper back-beam can satisfy requirements of the federal motor vehicle safety standard (FMVSS). Through the comparison of the previously designed bumper back-beam with the newly designed bumper back beam, it was noted that the weight of the designed bumper back-beam is lighter than that of the previously designed bumper back beam by nearly 16 %. In addition, it was considered that the newly designed bumper back beam can improve recycling of the bumper back-beam.

• Journal of Welding and Joining
• /
• 제34권1호
• /
• pp.26-34
• /
• 2016

Automotive today has been transforming to an electronic product by adopting a lot of convenience and safety features, suggesting that joining materials and their mechanical reliabilities are getting more important. In this study, a Sn-Cu-Cr-Ca solder composition having a high melting temperature ($>230^{\circ}C$) was fabricated and its joint properties and reliability was investigated with an aim to evaluate the suitability as a joining material for electronics of engine room. Furthermore, mechanical properties change under complex environment were compared with several existing solder compositions. As a result of contact angle measurement, favorable spreadability of 84% was shown and the average shear strength manufactured with corresponding composition solder paste was $1.9kg/mm^2$. Also, thermo-mechanical reliability by thermal shock and vibration test was compared with that of the representative high temperature solder materials such as Sn-3.5Ag, Sn-0.7Cu, and Sn-5.0Sb. In order to fabricate the test module, solder balls were made in joints with ENIG-finished BGA and then the BGA chip was reflowed on the OPS-finished PCB pattern. During the environmental tests, resistance change was continuously monitored and the joint strength was examined after tests. Sn-3.5Ag alloy exhibited the biggest degradation rate in resistance and shear stress and Sn-0.7Cu resulted in a relatively stable reliability against thermo-mechanical stress coming from thermal shock and vibration.

• 한국정밀공학회지
• /
• 제19권3호
• /
• pp.66-72
• /
• 2002

Electronic Speckle Pattern Interferometry (ESPI) has been recently developed and widely used because it has advantage to be able to measure surface deformations of engineering components and materials in industrial areas with non-contact. The speckle patterns to be formed with interference and scattering phenomena can measure not only out-of-plane but also in-plane deformations, together with the use of digital image equipment to process the informations included in the speckle patterns and to display consequent interferogram on a computer monitor. In this study, the experimental results of a canti-levered plate using ESPI were compared with those obtained from the simple beam theory. The ESPI results of the canti-levered plate analyzed by 4-step phase shifting method are close to the theoretical expectation. Also, out-of-plane displacements of a spot welded cacti-levered plate were measured by ESPI with 4-step phase shifting technique. The phase map of the spot welded cacti-levered plate is quite different from that of the canti-levered plate without spot welding.

• International Journal of Korean Welding Society
• /
• 제2권2호
• /
• pp.19-25
• /
• 2002

In recent years, techniques for micro-assembly with high repeatability under a scanning electron microscope (SEM) are required to construct highly functional micro-devices. Adhesion phenomenon is more significant for smaller objects, because adhesional force is proportional to size of the objects while gravitational force is proportional to the third power of it. It is also known that adhesional force between micro-objects exposed to Electron Beam irradiation of SEM increases with the elapsed time. Therefore, mechanical manipulation techniques using a needle-shaped tool by adhesional force are often adopted in basic researches where micro-objects are studied. These techniques, however, have not yet achieved the desired repeatability because many of these could not have been supported theoretically. Some techniques even need the process of trial-and-error. Thus, in this paper, mechanical and adhesional micro-manipulation are analyzed theoretically by introducing new physical factors, such as adhesional force and rolling-resistance, into the kinematic system consisting of a sphere, a needle-shaped tool, and a substrate. Through this analysis, they are revealed that how the micro-sphere behavior depends on the given conditions, and that it is possible to cause the fracture of the desired contact Interfaces selectively by controlling the force direction in which the tool-tip loads to the sphere. Based on the acquired knowledge, a mode diagram, which indicates the micro-sphere behavior for the given conditions, is designed. By referring to this mode diagram, the practical technique of the pick and place manipulation of a micro-sphere under an SEM by the selective interface fracture is proposed.

• Journal of Welding and Joining
• /
• 제31권5호
• /
• pp.54-58
• /
• 2013

Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.