• Transactions of Materials Processing
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• v.18 no.4
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• pp.342-346
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• 2009

Forming characteristics for the bundle extrusion of Cu-Ti bimetal wires are investigated, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.4
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• pp.17-22
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• 2018

A glove valve regulates the flow in a pipeline as a kind of control valve. However, when the disc and seat contact, the valve structure can be distorted and flow can leak due to the elongation of the valve material under high pressure. The surface texture is not good enough to seal the contact surface (in practice) because the lapping process is usually done manually. Furthermore, assembly performance is analyzed by structural analysis. Compared with a standard seat, the newly designed seat had a smaller radial deformation and a larger longitudinal deformation. Therefore, the newly designed seat can maintain a tight and uniform contact with the disc with a reduced radial deformation and an expanded available seal area with an increased longitudinal deformation. The seal performance of the glove valve has been improved in a cost-effective manner.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.1
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• pp.130-133
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• 2010

Although many structures based on $SnO_2$ nanowires have been demonstrated, there is a limitation towards practical application due to the unwanted contact potential between the metal electrode and the $SnO_2$ nanowire. This is mostly due to the presence of the native oxide layer that acts as an insulator between the metal contact and the nanowire. In this study the contact properties between Ti/Au contacts and a single $SnO_2$ nanowire was compared to the electrical properties of a contact without the oxide layer. RIE(Reactive Ion Etching) is used to selectively remove the oxide layer from the contact area. The $SnO_2$ nanowires were synthesized by chemical vapor deposition (CVD) and dispersed on a $Si/Si_3N_4$ substrate. The Ti/Au (20nm/100nm) electrodes were formed bye-beam lithography, e-beam evaporation and a lift-off process.

• Transactions of the Korean Society of Automotive Engineers
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• v.19 no.3
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• pp.52-56
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• 2011

Active regeneration in CDPF requires $O_2$ which regenerates soot at high temperature. However, small amount of NO can interrupt $O_2$ regeneration in CDPF. To verify this phenomena, soot oxidation experiments using a flow reactor with a $Pr/CeO_2$ catalyst are carried out to simulate Catalyzed Diesel Particulate Filter (CDPF) phenomena. Catalytic soot oxidation with and without small amount of NO is conducted under tight contact condition. As the heating rate rises, the temperature gap of maximum reaction rate is increased between with and without 50ppm NO. To accelerate the $NO_2$ de-coupling effect, CTO process is performed to eliminate interfacial contact for that time. As CTO process is extended, temperature which indicates peak reaction rate increases. From this result, it is found that small amount of NO can affect tight contact soot oxidation by removal of interfacial contact between soot and catalyst.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.6
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• pp.139-145
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• 2017

It is necessary to analyze the exact contact position and contact stress of the wheel-rail in order to predict damage to the wheel and rail. This study presents a wheel-rail contact analysis model that considers the deformation of the axle. When a wheel-rail contact analysis is performed using a full three-dimensional model of the wheelset and rail, the analytical model becomes very inefficient due to the increase in analysis time and cost. Therefore, modeling the element-coupling model of the wheel and rail as a three-dimensional element and the axle as a one-dimensional element is proposed. The wheel-rail contact characteristics in the proposed analysis model for straight and curved lines were analyzed and compared with the conventional three-dimensional analysis model. Considering the accuracy of the analysis results and time, the result shows that the proposed analytical model has almost the same accuracy as a full three-dimensional model, but the computational effort is significantly reduced.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.569-572
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• 2003

In VLM-ST process, the fine detailed shape processing process is needed due to the use of thick sheets for layers. The developed process perform the fine detailed shape processing in VLM-ST parts using non-contact hot tool. To predict the heat-affected zone and temperature distribution of VLM-ST parts in detailed shaping, the heat flux from the tool to the surface was calculated for the finite element analysis by modeling the tool as a heat source of radiation. The dominant process parameters such as the radiated heat input, the tool speed, and the gap between the tool tip and the foam sheet (tool height) were considered in the analysis. The results showed a good agreement with the experiments.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2003.11a
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• pp.291-298
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• 2003

Recently, load/unload(L/UL) process is applied to a computer information storage device due to its advantages such as lower power consumption, larger data zone, simpler fabrication of disk for no bumped parking zone, and rarer contact between the slider and media. An analysis of the transient motion for the slider is very important to design an air bearing surface (ABS) of the slider to secure the stable performance of the system. During the L/UL process, however, there are several issues occurred such as contact or collision between slider and media. Sometimes this will cause the system failure. In this study, the dynamics of the slider during the loading process are investigated through a numerical simulation using FEM analysis and experiment.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.2
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• pp.110-116
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• 2011

The current study investigated the friction property of angle and width effect for micro-scale grooved crosshatch pattern on SKD11 steel surface against bearing steel using pin-on-disk type. The samples fabricated by photolithography process and then these are carry out the electrochemical etching process. We discuss the friction property due to the influence of a hatched-angle and a width of groove on contact surface. We could be explained the lubrication mechanism for a Stribeck curve. So It was found that the friction coefficient depend on an angle of the crosshatch on contact surface. It was thus verified that micro-scale crosshatch grooved pattern could affect the friction reduction. Also, it is play an important a width of groove to be improved the friction property. I was found that friction property has a relationship between a width and an angle for micro-grooved pattern.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.11
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• pp.874-878
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• 2001

Solder bump was electroplated on wafer for flip chip application. The process is as follows. Ti/Cu were sputtered and thick PR was formed by several coating PR layer. Fine pitch vias were opened using via mask and then Cu stud and solder bump were electroplated. Finally solder bump was formed by reflow process. In this paper, we opened 40㎛ vias on 57㎛ thick PR layer and electroplated solder bump with 70㎛ height and 40㎛ diameter. After reflow process, we could form solder bump with 53㎛ height and 43㎛ diameter. In plating process, we improved the plating uniformity within 3% by using ring contact instead of conventional multi-point contact.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.6
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• pp.464-469
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• 2017

This study evaluated the displacements of a Cu bar in the Y-direction and the relationship between swaging pressures and total contact forces to increase the productivity of the rotor core swaging process. Elastic-plastic numerical analyses of four different Cu bar shapes were performed with a constant swaging pressure to evaluate the displacements of the Cu bar in the Y-direction and the contact force distributions at the contact surfaces during the swaging process. Based on the numerical analysis results, the following conclusions were obtained. First, a simplified 2-dimensional cyclic symmetric analysis model was developed for the numerical analysis of the rotor core swaging process. Second, the final displacements of the Cu bar in the Y-direction were nearly the same as the change of the Cu bar size at a constant swaging pressure. Third, a linear relationship between the swaging pressures and the total contact forces, the so called resistance forces, was suggested.