• Journal of Powder Materials
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• v.14 no.5
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• pp.327-332
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• 2007

In a view point of environment, the advanced electric contact material without environmental load element such as cadmium has to be developed. Extensive studies have been carried out on $Ag-SnO_2$ electric contact material as a substitute of Ag-CdO contact materials. In the present study, powder metallurgy including compaction and sintering is introduced to solve the incomplete oxidation problems in manufacturing process of $Ag-SnO_2$ electrical contact material. The $Ag-SnO_2$ contact material, fabricated in this study, was actually set in an electric switchgear of which working voltage is 462V and current is between 25 and 40A, for the purpose of testing its performance. As a result, it exceeded the existing Ag-CdO contact materials in terminal-temperature ascent and main contact resistance.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.393-397
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion fur pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• Tribology and Lubricants
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• v.19 no.1
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• pp.1-8
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• 2003

Recently, PM-high speed steel(PM-HSS) has reportedly been a good alternative material for rolling mill because of its superior performance to conventional HSS. This paper has been aimed to investigate the possibility for application to rolling contact element for PM-HSS by X-ray diffraction technique. The X-ray elastic constant for PH-HSS has been found by X-ray diffraction during the four-point bending test. Residual stress and half-value breadth on the contact surface during rolling contact fatigue process by X-ray diffraction have also been measured. The result of this study shows that the application of X-ray diffraction technique to PM-HSS could be as possible alternative material as conventional HSS. Half-value breadth on rolling contact surface by X-ray diffraction is not changed during rolling contact fatigue process. On the other hand, the residual stress is changed. This suggests that dislocation reaction has been hardly occurred in rolling contact, depending on super-saturated carbon in PM-HSS.

• Tribology and Lubricants
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• v.17 no.3
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• pp.209-215
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• 2001

In view of the effects of the hardness of material on fatigue, rolling contact fatigue process in hard metals seems to differ from it in soft metals. This paper has been aimed to compare the rolling contact fatigue process according to the hardness of materials. Rolling contact fatigue tests using the ball bearings assembled with the inner race of four different hardness have been carried out. In addition, residual stress and half-value breadth on/below the inner raceway during individual rolling contact fatigue have been measured by X-ray diffraction. The results of this study showed that the change of residual stress and half-value breadth during the rolling contact fatigue on race way in hard metals is the same as in soft metals. However, plastic deformation by rolling contact in hard metals is in microscopic scale but only for soft metals in macroscopic scale.

• Magazine of the Korean Society of Agricultural Engineers
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• v.35 no.4
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• pp.67-75
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• 1993

This study was carried out to investigate the applicability of Solid Contact Process for the improvement of Moving Media Complete Mixing Activated Sludge(MMCMAS) effluents. Laboratory MMCMAS Reactor and MMCMAS/Solid Contact were operated at the hydraulic loading of 122~340 L/m$^2$/d. The conclusions from this study were as follows ; The addition of Solid Contact tank to the MMCMAS reactor has increased the SCOD and SBOD removal efficiencies of 4 to 67% and 2 to 41%, respectively. In addition, the increments of nitrification rates were about 13 to 46%. It was also observed that the addition of Solid Contact tank has greatly increased the organic removal efficiencies at the higher hydraulic loading rates and also decrement of sludge production rates was 0.1 gVSS/gBODrem. It was therefore concluded that the addition of Solid Contact tank could have polished the effluent of MMCMAS at the higher hydraulic loading rates.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.53.2-53.2
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• 2010

In this study, we focused on our specialized electrode process for Si back-contact crystalline solar cell. It is different from other well-known back-contact cell process for thermal aspect and specialized process. In general, aluminum makes ohmic contact to the Si wafer and acts as a back surface reflector. And, silver is used for low series resistance metal grid lines. Aluminum was sputtered onto back side of wafer. Next, silver is directly patterned on the wafer by screen printing. The sputtered aluminum was removed by wet etching process after rear silver electrode was formed. In this process, the silver paste must have good printability, electrical property and adhesion strength, before and after the aluminum etching process. Silver paste also needs low temperature firing characteristics to reduce the thermal budget. So it was seriously collected by the products of several company of regarding low temperature firing (below $250^{\circ}C$) and aluminum etching endurance. First of all, silver pastes for etching selectivity were selected to evaluate as low temperature firing condition, electrical properties and adhesive strength. Using the nano- and micron-sized silver paste, so called hybrid type, made low temperature firing. So we could minimize the thermal budget in metallization process. Also the adhesion property greatly depended on the composition of paste, especially added resin and inorganic additives. In this paper, we will show that the metallization process of back-contact solar cell was realized as optimized nano-paste characteristics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.3
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• pp.234-239
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• 2007

This paper describes the TiW ohmic contact characteristics under the surface treatment of the polycrystalline 3C-SiC thin film grown on $SiO_2/Si(100)$ wafers by APCVD. The poly 3C-SiC surface was polished by using CMP(chemical mechanical polishing) process and then oxidized by wet-oxidation process, and finally removed SiC oxide layers. A TiW thin film as a metalization process was deposited on the surface treated poly 3C-SiC layer and was annealed through a RTA(rapid thermal annealing) process. TiW/poly 3C-SiC was investigated to get mechanical, physical, and electrical characteristics using SEM, XRD, XPS, AFM, optical microscope, I-V characteristic, and four-point probe, respectively. Contact resistivity of the surface treated 3C-SiC was measured as the lowest $1.2{\times}10^{-5}{\Omega}cm^2$ at $900^{\circ}C$ for 45 sec. Therefore, the surface treatments of poly 3C-SiC are necessary to get better contact resistance for extreme environment MEMS applications.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.3
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• pp.59-65
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• 2019

In many industries, particle packing is adopted quite frequently. In the particle packing process, the Discrete Element Method (DEM) can analyze the multi-collision of particles efficiently. Two types of contact models are frequently used for the DEM. One is the linear spring model, which has the fastest calculation time, and the other is the Hertz-Mindlin model, which is the most frequently used contact model employing the DEM. Meanwhile, very tiny particles in the micrometer order are used in modern industries. In the micro length order, surface force is important to decreased particle size. To consider the effect of surface force in this study, we performed a simulation with the Hertz-Mindlin model and added the Johnson-Kendall-Roberts (JKR) theory depicting surface force with surface energy. In addition, three contact models were compared with several parameters. As a result, it was found that the JKR model has larger residual stress than the general contact models because of the pull-off force. We also validated that surface force can influence particle behavior if the particles are small.

• Progress in Superconductivity and Cryogenics
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• v.23 no.3
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• pp.32-36
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• 2021

Milking parlor wastewater contains not only high concentrations of organic compounds, but often animal antibiotics. To discharge the antibiotics to public water area cause problem of antibiotics resistant bacteria. Magnetic separation was applied into improvement of milking parlor wastewater treatment process. A new process, composed of a magnetic activated sludge (MAS) process and a contact oxidation (CO) process, was proposed in this study. This process was evaluated by the simulated milking parlor wastewater (4500 mg/L COD_Cr and 10 mg/L tetracycline) using a bench scale experimental setup. As a result, the process was able to removed 97% COD_Cr as well as 94% tetracycline. The MLVSS (mixed liquor volatile suspended solids) concentration of MAS was maintained at 12000 mg/L without excess sludge drawing. This process was considered to be useful as treatment process for milking parlor wastewater in which waste-milk including antibiotics is often discharged.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.6
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• pp.756-760
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• 2011

This paper proposed an alignment stage driven by piezo actuators for alignment process of a contact-type lithography. Among contact-type lithography processes, an UV-curable nanoimprint process is an unique process to be able to align patterns on upper and lower layers. An alignment stage of the UV-curable nanoimprint process requires nano-level resolution as well as high stiffness to overcome friction force due to contact moving. In this paper, the alignment stage consists of a compliant mechanism using flexure hinges, piezo actuators for high force generation, and capacitive sensors for high-resolution measurement. The compliant mechanism is implemented by four prismatic-prismatic compliant chains for two degree-of-freedom translations. The compliant mechanism is composed of flexure hinges with high stiffness, and it is directly actuated by the piezo actuators which increases the stiffness of the mechanism, also. The performance of the ultra-precision stage is demonstrated by experiments.