• 제목/요약/키워드: Contact Process

검색결과 2,780건 처리시간 0.031초

곡률 커플링 접촉각에 따른 접촉 강성 및 굽힘 강성해석 (Analysis of Contact Stiffness and Bending Stiffness according to Contact Angle of Curvic Coupling)

  • 유용훈;조용주;이동현;김영철
    • Tribology and Lubricants
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    • 제34권1호
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    • pp.23-32
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    • 2018
  • Coupling is a mechanical component that transmits rotational force by connecting two shafts. Curvic coupling is widely used in high-performance systems because of its excellent power transmission efficiency and easy machining. However, coupling applications change dynamic behavior by reducing the stiffness of an entire system. Contact surface stiffness is an important parameter that determines the dynamic behavior of a system. In addition, the roughness profile of a contact surface is the most important parameter for obtaining contact stiffness. In this study, we theoretically establish the process of contact and bending stiffness analysis by considering the rough surface contact at Curvic coupling. Surface roughness parameters are obtained from Nayak's random process, and the normal contact stiffness of a contact surface is calculated using the Greenwood and Williamson model in the elastic region and the Jackson and Green model in the elastic-plastic region. The shape of the Curvic coupling contact surface is obtained by modeling a machined shape through an actual machining tool. Based on this modeling, we find the maximum number of gear teeth that can be machined according to the contact angle. Curvic coupling stiffness is calculated by considering the contact angle, and the calculation process is divided into stick and slip conditions. Based on this process, we investigate the stiffness characteristics according to the contact angle.

Projection Method에 의한 주조 해석용 접촉 요소망 생성 기법 (Contact Element Generation Method for Casting Analysis by using Projection Method)

  • 남정호;곽시영
    • 한국주조공학회지
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    • 제40권6호
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    • pp.146-150
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    • 2020
  • In general, hot metal castings contract and molds expand during the cooling step of a casting process. Therefore, it is important to consider both the casting and mold at the same time in a casting process analysis. For a more accurate analysis that includes the contact characteristics, matching each node of the casting and mold in the contact area is recommended. However, it is very difficult to match the nodes of the casting and the mold when generating elements due to the geometric problem of CAD model data. The present study proposes a mesh generation technique that considers mechanical contact between the casting and the mold in a casting analysis (finite element analysis). The technique focuses on the fact that the mold surrounds the casting. After generating the 3D elements for the casting, the surface elements of the casting in contact with the mold are projected inside the mold to create contact elements that coincide with the contact surface of the casting. It was confirmed that high-quality contact element information and a 3D element net can be automatically generated by the method proposed in this study.

구리-타이타늄 이중봉 직접압출의 공정지도 개발 (Development of A Process Map for Extrusion of Cu-Ti Bimetal Bar)

  • 김중식;이용신;심경섭;박훈재
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.499-502
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    • 2005
  • A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal bar. Bonding mechanism between Cu and Ti was assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding was developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. Finite element analyses for extrusion of Cu-Ti bimetal bars were performed for various process conditions. The deformation history at the contact surface was traced and the proposed new bonding criterion was applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the extrusion of Cu-Ti bimetal bar is suggested.

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접촉 열저항을 고려한 합금주조의 응고과정 해석 (An analysis on the solidification process of alloy casting with a contact resistance)

  • 김우승;이관수;임익태;김광선
    • 대한기계학회논문집B
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    • 제21권1호
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    • pp.57-67
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    • 1997
  • The solidification process of Al 4.5%Cu alloy is numerically studied in the presence of contact resistance between mold and cast. Natural convection is considered in the liquid and mushy regions. The porosity approach is applied to the mushy zone modeling and linear variation of the solid fraction on the temperature is assumed. Results show that the mushy region is wider in the case with a contact resistance compared to the perfect contact condition. The temperature of the cast with a temporal variation in the contact heat transfer coefficient changes very rapidly in the early stage of the casting process compared to that with constant contact heat transfer coefficient.

터보블로워용 헬리컬 기어의 접촉응력 해석 (Contact Stress Analysis of Helical Gear for Turbo Blower)

  • 황석철;이동형;박영철;이권희
    • 한국기계가공학회지
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    • 제10권2호
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    • pp.90-95
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    • 2011
  • This paper presents the study on the contact stress analysis of a pair of mating helical gears for turbo blower during rotation. Turbo blowers need high speed rotation of impeller in structure and high rate gear ratio. The use of helical gear indicated that noise was an important problem when the application involves high speeds and large power transmission. An example is presented to investigate the variation of contact stress on a pair of mating gears with contact positions. The variation of contact stress during rotation is compared with the contact stress at the lowest point of single tooth contact(LPSTC) and AGMA Equation for contact stress. In this study, the gear design considering the contact stress on a pair of mating gear is more severe than that of AGMA standard.

단결정 실리콘 태양전지의 후면 전극형성에 관한 비교분석 (Analysis of the Formation of Rear Contact for Monocrystalline Silicon Solar Cells)

  • 권혁용;이재두;김민정;이수홍
    • 한국전기전자재료학회논문지
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    • 제23권7호
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    • pp.571-574
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    • 2010
  • Surface recombination loss should be reduced for high efficiency of solar cells. To reduce this loss, the BSF (back surface field) is used. The BSF on the back of the p-type wafer forms a p+layer, which prevents the activity of electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. Therefore, the open-circuit-voltage (Voc) and fill factor (FF) of solar cells are increased. This paper investigates the formation of the rear contact process by comparing aluminum-paste (Al-paste) with pure aluminum-metal(99.9%). Under the vacuum evaporation process, pure aluminum-metal(99.9%) provides high conductivity and low contact resistance of $4.2\;m{\Omega}cm$, but It is difficult to apply the standard industrial process to it because high vacuum is needed, and it's more expensive than the commercial equipment. On the other hand, using the Al-paste process by screen printing is simple for the formation of metal contact, and it is possible to produce the standard industrial process. However, Al-paste used in screen printing is lower than the conductivity of pure aluminum-metal(99.9) because of its mass glass frit. In this study, contact resistances were measured by a 4-point probe. The contact resistance of pure aluminum-metal was $4.2\;m{\Omega}cm$ and that of Al-paste was $35.69\;m{\Omega}cm$. Then the rear contact was analyzed by scanning electron microscope (SEM).

연속접촉처리를 고려한 박판성형공정의 해석 (FE-analysis of sheet metal forming processes considering continuous contact treatment)

  • 김태정;양동열
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 춘계학술대회 논문집
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    • pp.134-137
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    • 2005
  • In this paper, a continuous contact treatment has been considered during FE-analysis of the sheet metal forming processes. Because the simulation is usually performed stepwise, the status of contact can change suddenly. In case of implicit scheme, the increment of punch stroke can be chosen as large value. For exact assessment of contact force and friction force between die and sheet, the continuous contact treatment is proposed. The virtual surface of sheet metal is modeled by NURBS curves or surfaces in order to calculate exact contact area and penetration depth. From the geometrical evaluation of contact behavior, additional contact pressure is imposed to the element. The deformation of bending process and hydroforming process are analyzed based on this scheme.

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결정질 실리콘 태양전지에 적용하기 위한 후면전극 형성에 관한 연구 (An Analysis on rear contact for crystalline silicon solar cell)

  • 권혁용;이재두;김민정;이수홍
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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    • pp.91.1-91.1
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    • 2010
  • There are some methods for increasing efficiency of crystalline silicon solar cells. Among them, It is important to reduce the recombination loss of surface for high efficiency. In order to reduce recombination loss is a way to use the BSF(Back Surface Field). The BSF on the back of the p-type wafer forms a p+layer. so, it is prevented to act electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. therefore, open-circuit-voltage and Fill factor(FF) of solar cells are increased. This paper investigates the formation of rear contact process comparing Aluminum-paste(Al-paste) with Aluminum-Metal(99.9%). It is shown that the Aluminum-Metal provides high conductivity and low contact resistance of $21.35m{\Omega}cm$ using the Vacuum evaporation process but, it is difficult to apply the standard industrial process because high Vacuum is needed and it costs a tremendous amount more than Al-paste. On the other hand, using the Al-paste process by screen printing is simple for formation of metal contact and it is possible to produce the standard industrial process. however, it is lower than Aluminum-Metal(99.9) of conductivity because of including mass glass frit. In this study, contact resistances were measured by 4-point prove. each of contact resistances is $21.35m{\Omega}cm$ of Aluminum-Metal and $0.69m{\Omega}cm$ of Al-paste. and then rear contact have been analyzed by Scanning Electron Microscopy(SEM).

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Increased Sensitivity of Carbon Nanotube Sensors by Forming Rigid CNT/metal Electrode

  • 박대현;전동렬
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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    • pp.348-348
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    • 2011
  • Carbon nanotube (CNT) field effect transistors and sensors use CNT as a current channel, of which the resistance varies with the gate voltage or upon molecule adsorption. Since the performance of CNT devices depends very much on the CNT/metal contact resistance, the CNT/electrode contact must be stable and the contact resistance must be small. Depending on the geometry of CNT/electrode contact, it can be categorized into the end-contact, embedded-contact (top-contact), and side-contact (bottom-contact). Because of difficulties in the sample preparation, the end-contact CNT device is seldom practiced. The embedded-contact in which CNT is embedded inside the electrode is desirable due to its rigidness and the low contact resistance. Fabrication of this structure is complicated, however, because each CNT has to be located under a high-resolution microscope and then the electrode is patterned by electron beam lithography. The side-contact is done by depositing CNT electrophoretically or by precipitating on the patterned electrode. Although this contact is fragile and the contact resistance is relatively high, the side-contact by far has been widely practiced because of its simple fabrication process. Here we introduce a simple method to embed CNT inside the electrode while taking advantage of the bottom-contact process. The idea is to utilize a eutectic material as an electrode, which melts at low temperature so that CNT is not damaged while annealing to melt the electrode to embed CNT. The lowering of CNT/Au contact resistance upon annealing at mild temperature has been reported, but the electrode in these studies did not melt and CNT laid on the surface of electrode even after annealing. In our experiment, we used a eutectic Au/Al film that melts at 250$^{\circ}C$. After depositing CNT on the electrode made of an Au/Al thin film, we annealed the sample at 250$^{\circ}C$ in air to induce eutectic melting. As a result, Au-Al alloy grains formed, under which the CNT was embedded to produce a rigid and low resistance contact. The embedded CNT contact was as strong as to tolerate the ultrasonic agitation for 90 s and the current-voltage measurement indicated that the contact resistance was lowered by a factor of 4. By performing standard fabrication process on this CNT-deposited substrate to add another pair of electrodes bridged by CNT in perpendicular direction, we could fabricate a CNT cross junction. Finally, we could conclude that the eutectic alloy electrode is valid for CNT sensors by examine the detection of Au ion which is spontaneously reduced to CNT surface. The device sustatined strong washing process and maintained its detection ability.

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STUDY ON THE HIGH EFFICIENCY BURIED CONTACT SOLAR CELL WITH WET ETCHING PROCESS

  • Kang, Dae-Keun;Choi, Kang-Ho;Lee, Joo-Yul;Lee, Kyu-Hwan
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2009년도 추계학술대회 초록집
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    • pp.156-156
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    • 2009
  • High efficiency silicon solar cell technology based on planar technology has been improved by various kinds of process by using the wet etching process. In particular, the buried contact solar cell has been successfully studied. In the present work, a simplified process of the buried contact solar cell has been suggested to help one design effectively the high-efficiency solar cell.

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