• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.230-234
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• 2009

It is significant technique to increase competitiveness that solar cells have a high energy conversion efficiency and cost effectiveness. When making high efficiency crystalline Si solar cells, evaporated Ti/Pd/Ag contact system is widely used in order to reduce the electrical resistance of the contact fingers. However, the evaporation process is no applicable to mass production because high vacuum is needed. Furthermore, those metals are too expensive to be applied for terrestrial applications. Ni/Cu/Ag contact system of silicon solar cells offers a relatively inexpensive method of making electrical contact. Ni silicide formation is one of the indispensable techniques for Ni/Cu/Ag contact sytem. Ni was electroless plated on the front grid pattern, After Ni electroless plating, the cells were annealed by RTP(Rapid Thermal Process). Ni silicide(NiSi) has certain advantages over Ti silicide($TiSi_2$), lower temperature anneal, one step anneal, low resistivity, low silicon consumption, low film stress, absence of reaction between the annealing ambient. Ni/Cu/Ag metallization scheme is an important process in the direction of cost reduction for solar cells of high efficiency. In this article we shall report an investigation of rapid thermal silicidation of nickel on silngle crystalline silicon wafers in the annealing range of $350-390^{\circ}C$. The samples annealed at temperatures from 350 to $390^{\circ}C$ have been analyzed by SEM(Scanning Electron Microscopy).

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.404-409
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• 2004

The electrical contact resistance is here estimated using the multiscale microcontact distribution of elastic contact between rough surfaces, simulated from the Archard's model, and the electrical contact conduction theory suggested by Greenwood. These analysis confirms that the electrical contact resistance is converged to a values, larger than would be obtained if the contact spots were widely separated and hence independent. In multiscale process, the base potential is close to the value of the potential difference between the contact surface and the extremity of body, suggesting a possibility to obtain the multiscale electrical contact resistance relations.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.05a
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• pp.281-285
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• 2002

A new method of dynamic contact force measurement between a pantograph and a contact wire is proposed in this paper The method does not require design modification of an original pantograph in order to install sensors such as load cells. Contact forces can be expressed as the sum of vertical shear forces at the support points and inertial forces. Using specially-designed strain gage rosettes. vertical shear forces at the supported points can be measured without noise mixing and thermal effects. In order to obtain contact forces from shear forces, 3 inertial force compansation methods are proposed and compared in this paper. By validation process, the new proposed measurement method is verified to be applicable to the on-line current collection test.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2214-2219
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• 2008

The thermal contact resistance(TCR) of nanosized contact spots has been investigated through a multiscale analysis which considers the resolution of surface topography. A numerical simulation is performed on the finite element model of rough surfaces. Especially, as the contact size decreases below the phonon mean free path, the size dependent thermal conductivity is considered to calculate the TCR. In our earlier model which follows an elastic material, the TCR increases without limits as the number of nanosized contact spots increases in the process of scale variation. However, the elastoplastic contact induces a finite limit of TCR as the scale varies. The results are explained through the plastic behavior of the two contacting models. Furthermore, the effect of air conduction in nanoscale is also investigated.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.6
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• pp.116-125
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• 2008

In general, fretting is a contact damage process due to micro-slip associated with small amplitude oscillatory movement between two surfaces in contact. Previous studies in fretting fatigue have observed a contact size effect related to contact width. The volume-averaging method of theoretically predicted contact stress fields was required to emulate experimental trends and to predict the observed contact size effects. This contact size effect is captured by the mean values of stresses and strains at the element integration points of FE model and two critical plane models (SWT, FS) in the present paper. It is shown that crack nucleation and fretting fatigue life can be predicted by the FE-based critical plane models.

• Journal of the Korean Society for Precision Engineering
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• v.34 no.3
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• pp.167-172
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• 2017

This study proposes a method for identifying correlations between tension and drop height for sessile droplets in a roll-to-roll processing system. The effect of tension and drop height on the contact angle of a sessile droplet is presented. Design of experiment (DOE) methodology and statistical analysis are used to define a correlation between the process parameters. The contact angle is decreased while increasing tension and drop height. The influence of the tension is less significant on the contact angle compared with the effect of the drop height. However, tension should be considered as a major parameter because it is not easy to fix with roll eccentricity and compensating speed of the driven roll. The results of this study show that the effect of tension on the contact angle of a sessile droplet is more important than drop height because the drop height is fixed when the process systems are determined.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.9
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• pp.2242-2251
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• 1993

The mesh-based frictional contact model has been developed which does not rely on the spatial derivatives of the tool surface. Only points on the surface are evaluated from the description. which can then be simplified because of the relaxed demands placed on it. The surface tangents, normals, and corresponding derivatives at each finite-element node are evaluated directly from the finite-element mesh, in terms of the connecting nodal positions. The advantages accrue because there is no longer a need for a smooth tool surface to assure reasonable normals and derivatives. Furthermore, it can be shown that the equilibrium equations can only be properly written with a special normal derived from the mesh itself. The validity, accuracy, computation time, and stability of mesh-based contact model were discussed with the numerical examples of rounded flat-top and rough, flat-top rounded punch forming operations. Also, the forming process of a automobile inner panel section was simulated for testing the robustness of new contact model. In the discussion, the superiority of new model was examined, comparing with tool-based contact one.

• Korean Journal of Materials Research
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• v.20 no.6
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• pp.338-343
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• 2010

As an alternative to the W plug used in MOSFETs, a Cu plug with a NiSi contact using Ta / TaN as a diffusion barrier is currently being considered. Conventionally, Ni was first deposited and then NiSi was formed, followed by the barrier and Cu deposition. In this study, Ti was employed as a barrier material and simultaneous formation of the NiSi contact and Cu plug / Ti barrier was attempted. Cu(100 nm) / Ti / Ni(20 nm) with varying Ti thicknesses were deposited on a Si substrate and annealed at $4000^{\circ}C$ for 30 min. For comparison, Cu/Ti/NiSi thin films were also formed by the conventional method. Optical Microscopy (OM), Scanning Probe Microscopy (SPM), X-Ray Diffractometry (XRD), and Auger Electron Microscopy (AES) analysis were performed to characterize the inter-diffusion properties. For a Ti interlayer thicker than 50 nm, the NiSi formation was incomplete, although Cu diffusion was inhibited by the Ti barrier. For a Ti thickness of 20 nm and less, an almost stoichiometric NiSi contact along with the Cu plug and Ti barrier layers was formed. The results were comparable to that formed by the conventional method and showed that this alternative process has potential as a formation process for the Cu plug/Ti barrier/NiSi contact system.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.3
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• pp.378-384
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• 1997

In curing process of tire, contact and slip occurs between green tire and curing bladder. The curing process is a critical step in the manufacture of tires. In this investigation, curing bladder shaping is examined using a finite element method. Specifically, a finite element model between the inner part of green tire and the outer part of curing bladder is generated using contact element and curing bladder is generated using incompressible element. Numerical analysis are performed on two different bladder types, different overall outer diameters of curing bladder and different heights of curing bladder. Numerical results show that contact pressure is increased by using toroidal type of curing bladder, increasing overall diameter and increasing height of curing bladder. To obtain natural equilibrium carcass line, there is a requirement in increasing contact pressure of the section between side and bead.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.5
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• pp.2019-2024
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• 2011

The effect of the wear of contact tips on the weld beads made by a Gas Metal Arc Welding(GMAW) process was studied. In order to correlate between the wear of tips and beads, the droplet transfer was investigated by a high speed camera and waveform shapes, and the condition of beads was examined by a low magnification camera as well. It was found that the worn contact tip had caused to shift the contact point between the tip and the welding wire which resulted in nonuniform beads. In addition, the worn contact tip had changed the welding resistance and brought about the arc instability during welding.